32nm节点Cu/超低k (k=1.6-1.8)集成CMP过程中图案化低k薄膜分层的表征

B. Yoo, S. Kondo, S. Tokitoh, A. Namiki, K. Misawa, K. Inukai, N. Ohashi, N. Kobayashi
{"title":"32nm节点Cu/超低k (k=1.6-1.8)集成CMP过程中图案化低k薄膜分层的表征","authors":"B. Yoo, S. Kondo, S. Tokitoh, A. Namiki, K. Misawa, K. Inukai, N. Ohashi, N. Kobayashi","doi":"10.1109/IITC.2004.1345761","DOIUrl":null,"url":null,"abstract":"Pattern dependence of ultra low-k (ULK, k=1.6-1.8) film delamination during Cu-CMP has been investigated to integrate the 32 nm node Cu/ULK damascene interconnects. A CMP mask that has various kinds of dummy-patterns was developed for quantitative characterization of the ULK film delamination. As a result, the perimeter of the pattern, which is the length along the boundary between Cu and low-k film, was found to be a determinative parameter in delamination of the patterned low-k film rather than pattern density. This is because Cu interconnects with higher-density perimeter increase the tolerance to shear stress generated by the CMP, and thus prevent the delamination due to the low mechanical strength of the ULK film (modulus; E<2GPa). A soft pad polishing was also effective in suppressing the mechanical damage. On the basis of these results, Cu damascene interconnects with ULK film were successfully integrated on 300mm wafers.","PeriodicalId":148010,"journal":{"name":"Proceedings of the IEEE 2004 International Interconnect Technology Conference (IEEE Cat. No.04TH8729)","volume":"55 1","pages":"0"},"PeriodicalIF":0.0000,"publicationDate":"2004-06-07","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"6","resultStr":"{\"title\":\"Characterization of patterned low-k film delamination during CMP for the 32nm node Cu/ultra low-k (k=1.6-1.8) integration\",\"authors\":\"B. Yoo, S. Kondo, S. Tokitoh, A. Namiki, K. Misawa, K. Inukai, N. Ohashi, N. Kobayashi\",\"doi\":\"10.1109/IITC.2004.1345761\",\"DOIUrl\":null,\"url\":null,\"abstract\":\"Pattern dependence of ultra low-k (ULK, k=1.6-1.8) film delamination during Cu-CMP has been investigated to integrate the 32 nm node Cu/ULK damascene interconnects. A CMP mask that has various kinds of dummy-patterns was developed for quantitative characterization of the ULK film delamination. As a result, the perimeter of the pattern, which is the length along the boundary between Cu and low-k film, was found to be a determinative parameter in delamination of the patterned low-k film rather than pattern density. This is because Cu interconnects with higher-density perimeter increase the tolerance to shear stress generated by the CMP, and thus prevent the delamination due to the low mechanical strength of the ULK film (modulus; E<2GPa). A soft pad polishing was also effective in suppressing the mechanical damage. On the basis of these results, Cu damascene interconnects with ULK film were successfully integrated on 300mm wafers.\",\"PeriodicalId\":148010,\"journal\":{\"name\":\"Proceedings of the IEEE 2004 International Interconnect Technology Conference (IEEE Cat. No.04TH8729)\",\"volume\":\"55 1\",\"pages\":\"0\"},\"PeriodicalIF\":0.0000,\"publicationDate\":\"2004-06-07\",\"publicationTypes\":\"Journal Article\",\"fieldsOfStudy\":null,\"isOpenAccess\":false,\"openAccessPdf\":\"\",\"citationCount\":\"6\",\"resultStr\":null,\"platform\":\"Semanticscholar\",\"paperid\":null,\"PeriodicalName\":\"Proceedings of the IEEE 2004 International Interconnect Technology Conference (IEEE Cat. No.04TH8729)\",\"FirstCategoryId\":\"1085\",\"ListUrlMain\":\"https://doi.org/10.1109/IITC.2004.1345761\",\"RegionNum\":0,\"RegionCategory\":null,\"ArticlePicture\":[],\"TitleCN\":null,\"AbstractTextCN\":null,\"PMCID\":null,\"EPubDate\":\"\",\"PubModel\":\"\",\"JCR\":\"\",\"JCRName\":\"\",\"Score\":null,\"Total\":0}","platform":"Semanticscholar","paperid":null,"PeriodicalName":"Proceedings of the IEEE 2004 International Interconnect Technology Conference (IEEE Cat. No.04TH8729)","FirstCategoryId":"1085","ListUrlMain":"https://doi.org/10.1109/IITC.2004.1345761","RegionNum":0,"RegionCategory":null,"ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"","JCRName":"","Score":null,"Total":0}
引用次数: 6

摘要

研究了Cu- cmp过程中超低k (ULK, k=1.6-1.8)薄膜分层的模式依赖关系,以集成32 nm节点Cu/ULK damascene互连。开发了一种具有多种假图案的CMP掩膜,用于定量表征ULK薄膜分层。结果发现,图案的周长,即沿Cu和低k薄膜边界的长度,是图案低k薄膜分层的决定性参数,而不是图案密度。这是因为具有高密度周长的Cu互连增加了CMP产生的剪切应力的容错性,从而防止了由于ULK膜的低机械强度(模量;E < 2 gpa)。软垫抛光在抑制机械损伤方面也很有效。在此基础上,成功地在300mm晶圆上集成了含有ULK薄膜的Cu damascene互连。
本文章由计算机程序翻译,如有差异,请以英文原文为准。
Characterization of patterned low-k film delamination during CMP for the 32nm node Cu/ultra low-k (k=1.6-1.8) integration
Pattern dependence of ultra low-k (ULK, k=1.6-1.8) film delamination during Cu-CMP has been investigated to integrate the 32 nm node Cu/ULK damascene interconnects. A CMP mask that has various kinds of dummy-patterns was developed for quantitative characterization of the ULK film delamination. As a result, the perimeter of the pattern, which is the length along the boundary between Cu and low-k film, was found to be a determinative parameter in delamination of the patterned low-k film rather than pattern density. This is because Cu interconnects with higher-density perimeter increase the tolerance to shear stress generated by the CMP, and thus prevent the delamination due to the low mechanical strength of the ULK film (modulus; E<2GPa). A soft pad polishing was also effective in suppressing the mechanical damage. On the basis of these results, Cu damascene interconnects with ULK film were successfully integrated on 300mm wafers.
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