IEEE Transactions on Components, Packaging and Manufacturing Technology最新文献_第4页

Advanced Polymer Dry Etching Processes for Enhanced Cu/Polymer Hybrid Bonding 用于增强铜/聚合物杂化键合的先进聚合物干蚀刻工艺

IF 3 3区工程技术

IEEE Transactions on Components, Packaging and Manufacturing Technology Pub Date : 2025-06-30 DOI: 10.1109/TCPMT.2025.3584053

Jihun Kim;Nam Ki Hwang;Seul Ki Hong;Min Ju Kim;Jong Kyung Park

{"title":"Advanced Polymer Dry Etching Processes for Enhanced Cu/Polymer Hybrid Bonding","authors":"Jihun Kim;Nam Ki Hwang;Seul Ki Hong;Min Ju Kim;Jong Kyung Park","doi":"10.1109/TCPMT.2025.3584053","DOIUrl":"https://doi.org/10.1109/TCPMT.2025.3584053","url":null,"abstract":"As semiconductor devices continue to demand higher performance and density, Cu/polymer hybrid structures have gained significant attention due to their potential to replace conventional SiO2 dielectrics. In this study, we explore the optimization of dry etching processes for 1,3,5-trimethyl-1,3,5-trivinyl cyclotrisiloxane (p<inline-formula> <tex-math>$text {V}_{{3}}text {D}_{{3}}$ </tex-math></inline-formula>) a low-dielectric constant polymer (<inline-formula> <tex-math>$k =2.2$ </tex-math></inline-formula>), used in Cu/polymer hybrid structures. By employing initiated chemical vapor deposition (iCVD) high purity, p<inline-formula> <tex-math>$text {V}_{{3}}text {D}_{{3}}$ </tex-math></inline-formula> thin films with a thickness of 200 nm were deposited. Various gas mixtures, including O2, CF4, and Ar, were used for dry etching to evaluate the optimal etching conditions. Results show that the most anisotropic etching occurred with an O2/Ar gas mixture, achieving an etching depth of 200 nm and near-vertical sidewalls. Detailed analysis of the etching mechanism was conducted using Gibbs free energy calculations and X-ray photoelectron spectroscopy (XPS). The findings of this study provide valuable insights into the fabrication of high-density, high-performance Cu/polymer hybrid structures for next-generation semiconductor devices.","PeriodicalId":13085,"journal":{"name":"IEEE Transactions on Components, Packaging and Manufacturing Technology","volume":"15 8","pages":"1795-1802"},"PeriodicalIF":3.0,"publicationDate":"2025-06-30","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"144892374","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":3,"RegionCategory":"工程技术","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}

引用次数: 0

IEEE Transactions on Components, Packaging and Manufacturing Technology Society Information IEEE元件、封装与制造技术学会汇刊

IF 2.3 3区工程技术

IEEE Transactions on Components, Packaging and Manufacturing Technology Pub Date : 2025-06-26 DOI: 10.1109/TCPMT.2025.3570046

引用次数: 0

IEEE Transactions on Components, Packaging and Manufacturing Technology Information for Authors IEEE元件、封装与制造技术资讯汇刊

IF 2.3 3区工程技术

IEEE Transactions on Components, Packaging and Manufacturing Technology Pub Date : 2025-06-26 DOI: 10.1109/TCPMT.2025.3570044

引用次数: 0

IEEE Transactions on Components, Packaging and Manufacturing Technology Publication Information IEEE元件、包装与制造技术汇刊信息

IF 2.3 3区工程技术

IEEE Transactions on Components, Packaging and Manufacturing Technology Pub Date : 2025-06-26 DOI: 10.1109/TCPMT.2025.3570042

引用次数: 0

VO2 Switch-Based Tunable 3-D Cavity Filters 基于VO2开关的可调三维腔滤波器

IF 3 3区工程技术

IEEE Transactions on Components, Packaging and Manufacturing Technology Pub Date : 2025-06-24 DOI: 10.1109/TCPMT.2025.3582617

Junwen Jiang;Raafat R. Mansour

引用次数: 0

Cross Coupled Substrate Integrated Waveguide Filter With Quasi-Elliptic Response and Wide Stopband 准椭圆宽阻带交叉耦合基板集成波导滤波器

IF 3 3区工程技术

IEEE Transactions on Components, Packaging and Manufacturing Technology Pub Date : 2025-06-23 DOI: 10.1109/TCPMT.2025.3581956

Peng Chu;Jialong Zhou;Wenyu Zhang;Fang Zhu;Li Cheng;Leilei Liu;Ke Wu

引用次数: 0

A New High-Sensitivity Near-Field Composite Probe With Mirror Symmetry Design 一种新型镜面对称设计的高灵敏度近场复合探头

IF 3 3区工程技术

IEEE Transactions on Components, Packaging and Manufacturing Technology Pub Date : 2025-06-23 DOI: 10.1109/TCPMT.2025.3582405

Lei Wang;Jianke Li;Quan Huang;Chengyang Luo;Guoguang Lu

{"title":"A New High-Sensitivity Near-Field Composite Probe With Mirror Symmetry Design","authors":"Lei Wang;Jianke Li;Quan Huang;Chengyang Luo;Guoguang Lu","doi":"10.1109/TCPMT.2025.3582405","DOIUrl":"https://doi.org/10.1109/TCPMT.2025.3582405","url":null,"abstract":"In this letter, a new high-sensitivity near-field composite probe with mirror symmetry design is presented. Unlike conventional differential magnetic-field probes that can only measure a magnetic-field component, a new differential composite probe with series loops is proposed to simultaneously test electric and magnetic field components. To increase the detection sensitivity, a pair of series loops are inserted into the conventional differential loops, which form the composite probe. Note that these series loops and differential loops are connected in series, not in parallel. The equivalent circuit models on the detection loops are used to explain the operating mechanism of the sensitivity enhancement of this design. In addition, four evolutionary models are simulated, compared, and studied to verify the effectiveness of the sensitivity enhancement. Moreover, the composite probe is together simulated, manufactured, and measured to verify the design rationality. The measured results reveal that the magnetic-field sensitivities of the probe exceed –40 dB at 0.6–5.4 GHz, while the electric-field sensitivities of that are over –40 dB at 1.3–6 GHz, respectively. Therefore, the designed composite probe not only has higher detection sensitivity but also can test the electric and magnetic field components simultaneously.","PeriodicalId":13085,"journal":{"name":"IEEE Transactions on Components, Packaging and Manufacturing Technology","volume":"15 8","pages":"1666-1671"},"PeriodicalIF":3.0,"publicationDate":"2025-06-23","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"144891047","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":3,"RegionCategory":"工程技术","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}

引用次数: 0

Negative Dispersion-Less Coupling Structure and Its Application for Realization of Extremely Small Negative Couplings in Waveguide Filters 负无色散耦合结构及其在波导滤波器中实现极小负耦合的应用

IF 3 3区工程技术

IEEE Transactions on Components, Packaging and Manufacturing Technology Pub Date : 2025-06-23 DOI: 10.1109/TCPMT.2025.3582009

Zai-Cheng Guo;Weijun Li;Wangtao Ye;Xuedao Wang;Yi Wang

{"title":"Negative Dispersion-Less Coupling Structure and Its Application for Realization of Extremely Small Negative Couplings in Waveguide Filters","authors":"Zai-Cheng Guo;Weijun Li;Wangtao Ye;Xuedao Wang;Yi Wang","doi":"10.1109/TCPMT.2025.3582009","DOIUrl":"https://doi.org/10.1109/TCPMT.2025.3582009","url":null,"abstract":"Negative coupling is widely used in microwave filter design, especially for filters with finite transmission zeros (TZs). Conventionally, negative coupling is realized through capacitive irises or probes. However, when the negative coupling is small, capacitive irises need to be very narrow, which presents significant challenges in manufacturing and tuning the filters. In this article, a negative dispersion-less coupling structure (NDLCS) is proposed based on a partial-height post for waveguide filters. Compared to capacitive irises, the NDLCS achieves a comparable effect while allowing the minimum dimension of coupling structures to increase from tens of micrometers to a few millimeters. The NDLCS also enables the installation of tuning screws, which significantly lowers both the manufacturing difficulty and the sensitivity to manufacturing tolerances. Two waveguide filters with narrow bandwidths are designed using the proposed NDLCS and compared to filters with conventional capacitive irises and dispersive coupling structures. The investigated and measured results demonstrate the advantages of the proposed NDLCS in manufacturing and tuning when realizing small negative coupling for waveguide filters.","PeriodicalId":13085,"journal":{"name":"IEEE Transactions on Components, Packaging and Manufacturing Technology","volume":"15 8","pages":"1644-1651"},"PeriodicalIF":3.0,"publicationDate":"2025-06-23","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"144891008","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":3,"RegionCategory":"工程技术","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}

引用次数: 0

3-D Packaging Technologies for Advanced Integrated Photonics Modules: A Review 先进集成光子学模块的三维封装技术综述

IF 3 3区工程技术

IEEE Transactions on Components, Packaging and Manufacturing Technology Pub Date : 2025-06-23 DOI: 10.1109/TCPMT.2025.3582041

Jean Charbonnier;Thierry Mourier;Stéphane Bernabé

引用次数: 0

Packaged Ka-Band IPD Bandpass Filter Using In-Phase and Out-of-Phase Mixed Couplings 采用相内和相外混合耦合的封装ka波段IPD带通滤波器

IF 3 3区工程技术

IEEE Transactions on Components, Packaging and Manufacturing Technology Pub Date : 2025-06-20 DOI: 10.1109/TCPMT.2025.3581320

Na Ji;Guangxu Shen;Wenjie Feng;Quan Xue;Wenquan Che

引用次数: 0