采用相内和相外混合耦合的封装ka波段IPD带通滤波器

IF 3 3区 工程技术 Q2 ENGINEERING, ELECTRICAL & ELECTRONIC
Na Ji;Guangxu Shen;Wenjie Feng;Quan Xue;Wenquan Che
{"title":"采用相内和相外混合耦合的封装ka波段IPD带通滤波器","authors":"Na Ji;Guangxu Shen;Wenjie Feng;Quan Xue;Wenquan Che","doi":"10.1109/TCPMT.2025.3581320","DOIUrl":null,"url":null,"abstract":"By effectively merging in-phase and out-of-phase electric and magnetic mixed couplings in an in-line fourth-order topology, a high-selectivity millimeter-wave (mm-wave) bandpass filter (BPF) is proposed. The use of in-phase and out-of-phase mixed couplings introduces pairs of 180° phase shift, resulting in multiple transmission zeros (TZs) generated outside the passband, whose locations can be independently controlled by adjusting the coupling strength. Furthermore, the equivalent circuit models are analyzed and discussed to elucidate the operating mechanism. For experimental verification, a 25-GHz in-line fourth-order high-selectivity BPF is designed and fabricated using gallium arsenide (GaAs)-based integrated passive device (IPD) process. Compared with prior works, the proposed BPF shows the merits of high selectivity, wider rejection bandwidth, and low insertion losses, making it well-suited for enhancing receiver sensitivity and suppressing interference in satellite communication systems.","PeriodicalId":13085,"journal":{"name":"IEEE Transactions on Components, Packaging and Manufacturing Technology","volume":"15 8","pages":"1750-1758"},"PeriodicalIF":3.0000,"publicationDate":"2025-06-20","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"0","resultStr":"{\"title\":\"Packaged Ka-Band IPD Bandpass Filter Using In-Phase and Out-of-Phase Mixed Couplings\",\"authors\":\"Na Ji;Guangxu Shen;Wenjie Feng;Quan Xue;Wenquan Che\",\"doi\":\"10.1109/TCPMT.2025.3581320\",\"DOIUrl\":null,\"url\":null,\"abstract\":\"By effectively merging in-phase and out-of-phase electric and magnetic mixed couplings in an in-line fourth-order topology, a high-selectivity millimeter-wave (mm-wave) bandpass filter (BPF) is proposed. The use of in-phase and out-of-phase mixed couplings introduces pairs of 180° phase shift, resulting in multiple transmission zeros (TZs) generated outside the passband, whose locations can be independently controlled by adjusting the coupling strength. Furthermore, the equivalent circuit models are analyzed and discussed to elucidate the operating mechanism. For experimental verification, a 25-GHz in-line fourth-order high-selectivity BPF is designed and fabricated using gallium arsenide (GaAs)-based integrated passive device (IPD) process. Compared with prior works, the proposed BPF shows the merits of high selectivity, wider rejection bandwidth, and low insertion losses, making it well-suited for enhancing receiver sensitivity and suppressing interference in satellite communication systems.\",\"PeriodicalId\":13085,\"journal\":{\"name\":\"IEEE Transactions on Components, Packaging and Manufacturing Technology\",\"volume\":\"15 8\",\"pages\":\"1750-1758\"},\"PeriodicalIF\":3.0000,\"publicationDate\":\"2025-06-20\",\"publicationTypes\":\"Journal Article\",\"fieldsOfStudy\":null,\"isOpenAccess\":false,\"openAccessPdf\":\"\",\"citationCount\":\"0\",\"resultStr\":null,\"platform\":\"Semanticscholar\",\"paperid\":null,\"PeriodicalName\":\"IEEE Transactions on Components, Packaging and Manufacturing Technology\",\"FirstCategoryId\":\"5\",\"ListUrlMain\":\"https://ieeexplore.ieee.org/document/11045336/\",\"RegionNum\":3,\"RegionCategory\":\"工程技术\",\"ArticlePicture\":[],\"TitleCN\":null,\"AbstractTextCN\":null,\"PMCID\":null,\"EPubDate\":\"\",\"PubModel\":\"\",\"JCR\":\"Q2\",\"JCRName\":\"ENGINEERING, ELECTRICAL & ELECTRONIC\",\"Score\":null,\"Total\":0}","platform":"Semanticscholar","paperid":null,"PeriodicalName":"IEEE Transactions on Components, Packaging and Manufacturing Technology","FirstCategoryId":"5","ListUrlMain":"https://ieeexplore.ieee.org/document/11045336/","RegionNum":3,"RegionCategory":"工程技术","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"Q2","JCRName":"ENGINEERING, ELECTRICAL & ELECTRONIC","Score":null,"Total":0}
引用次数: 0

摘要

通过在线四阶拓扑结构中有效地合并同相和非同相的电磁混合耦合,提出了一种高选择性毫米波带通滤波器。相内和相外混合耦合的使用引入了180°相移对,导致在通带外产生多个传输零点(TZs),其位置可以通过调节耦合强度独立控制。并对等效电路模型进行了分析和讨论,阐明了等效电路的运行机理。为了验证实验结果,采用砷化镓(GaAs)集成无源器件(IPD)工艺,设计并制作了一个25 ghz在线四阶高选择性BPF。与以往的研究成果相比,所提出的BPF具有高选择性、更宽的抑制带宽和低插入损耗等优点,非常适合用于卫星通信系统中提高接收机灵敏度和抑制干扰。
本文章由计算机程序翻译,如有差异,请以英文原文为准。
Packaged Ka-Band IPD Bandpass Filter Using In-Phase and Out-of-Phase Mixed Couplings
By effectively merging in-phase and out-of-phase electric and magnetic mixed couplings in an in-line fourth-order topology, a high-selectivity millimeter-wave (mm-wave) bandpass filter (BPF) is proposed. The use of in-phase and out-of-phase mixed couplings introduces pairs of 180° phase shift, resulting in multiple transmission zeros (TZs) generated outside the passband, whose locations can be independently controlled by adjusting the coupling strength. Furthermore, the equivalent circuit models are analyzed and discussed to elucidate the operating mechanism. For experimental verification, a 25-GHz in-line fourth-order high-selectivity BPF is designed and fabricated using gallium arsenide (GaAs)-based integrated passive device (IPD) process. Compared with prior works, the proposed BPF shows the merits of high selectivity, wider rejection bandwidth, and low insertion losses, making it well-suited for enhancing receiver sensitivity and suppressing interference in satellite communication systems.
求助全文
通过发布文献求助,成功后即可免费获取论文全文。 去求助
来源期刊
IEEE Transactions on Components, Packaging and Manufacturing Technology
IEEE Transactions on Components, Packaging and Manufacturing Technology ENGINEERING, MANUFACTURING-ENGINEERING, ELECTRICAL & ELECTRONIC
CiteScore
4.70
自引率
13.60%
发文量
203
审稿时长
3 months
期刊介绍: IEEE Transactions on Components, Packaging, and Manufacturing Technology publishes research and application articles on modeling, design, building blocks, technical infrastructure, and analysis underpinning electronic, photonic and MEMS packaging, in addition to new developments in passive components, electrical contacts and connectors, thermal management, and device reliability; as well as the manufacture of electronics parts and assemblies, with broad coverage of design, factory modeling, assembly methods, quality, product robustness, and design-for-environment.
×
引用
GB/T 7714-2015
复制
MLA
复制
APA
复制
导出至
BibTeX EndNote RefMan NoteFirst NoteExpress
×
提示
您的信息不完整,为了账户安全,请先补充。
现在去补充
×
提示
您因"违规操作"
具体请查看互助需知
我知道了
×
提示
确定
请完成安全验证×
copy
已复制链接
快去分享给好友吧!
我知道了
右上角分享
点击右上角分享
0
联系我们:info@booksci.cn Book学术提供免费学术资源搜索服务,方便国内外学者检索中英文文献。致力于提供最便捷和优质的服务体验。 Copyright © 2023 布克学术 All rights reserved.
京ICP备2023020795号-1
ghs 京公网安备 11010802042870号
Book学术文献互助
Book学术文献互助群
群 号:604180095
Book学术官方微信