Zai-Cheng Guo;Weijun Li;Wangtao Ye;Xuedao Wang;Yi Wang
{"title":"Negative Dispersion-Less Coupling Structure and Its Application for Realization of Extremely Small Negative Couplings in Waveguide Filters","authors":"Zai-Cheng Guo;Weijun Li;Wangtao Ye;Xuedao Wang;Yi Wang","doi":"10.1109/TCPMT.2025.3582009","DOIUrl":null,"url":null,"abstract":"Negative coupling is widely used in microwave filter design, especially for filters with finite transmission zeros (TZs). Conventionally, negative coupling is realized through capacitive irises or probes. However, when the negative coupling is small, capacitive irises need to be very narrow, which presents significant challenges in manufacturing and tuning the filters. In this article, a negative dispersion-less coupling structure (NDLCS) is proposed based on a partial-height post for waveguide filters. Compared to capacitive irises, the NDLCS achieves a comparable effect while allowing the minimum dimension of coupling structures to increase from tens of micrometers to a few millimeters. The NDLCS also enables the installation of tuning screws, which significantly lowers both the manufacturing difficulty and the sensitivity to manufacturing tolerances. Two waveguide filters with narrow bandwidths are designed using the proposed NDLCS and compared to filters with conventional capacitive irises and dispersive coupling structures. The investigated and measured results demonstrate the advantages of the proposed NDLCS in manufacturing and tuning when realizing small negative coupling for waveguide filters.","PeriodicalId":13085,"journal":{"name":"IEEE Transactions on Components, Packaging and Manufacturing Technology","volume":"15 8","pages":"1644-1651"},"PeriodicalIF":3.0000,"publicationDate":"2025-06-23","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"0","resultStr":null,"platform":"Semanticscholar","paperid":null,"PeriodicalName":"IEEE Transactions on Components, Packaging and Manufacturing Technology","FirstCategoryId":"5","ListUrlMain":"https://ieeexplore.ieee.org/document/11048593/","RegionNum":3,"RegionCategory":"工程技术","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"Q2","JCRName":"ENGINEERING, ELECTRICAL & ELECTRONIC","Score":null,"Total":0}
引用次数: 0
Abstract
Negative coupling is widely used in microwave filter design, especially for filters with finite transmission zeros (TZs). Conventionally, negative coupling is realized through capacitive irises or probes. However, when the negative coupling is small, capacitive irises need to be very narrow, which presents significant challenges in manufacturing and tuning the filters. In this article, a negative dispersion-less coupling structure (NDLCS) is proposed based on a partial-height post for waveguide filters. Compared to capacitive irises, the NDLCS achieves a comparable effect while allowing the minimum dimension of coupling structures to increase from tens of micrometers to a few millimeters. The NDLCS also enables the installation of tuning screws, which significantly lowers both the manufacturing difficulty and the sensitivity to manufacturing tolerances. Two waveguide filters with narrow bandwidths are designed using the proposed NDLCS and compared to filters with conventional capacitive irises and dispersive coupling structures. The investigated and measured results demonstrate the advantages of the proposed NDLCS in manufacturing and tuning when realizing small negative coupling for waveguide filters.
期刊介绍:
IEEE Transactions on Components, Packaging, and Manufacturing Technology publishes research and application articles on modeling, design, building blocks, technical infrastructure, and analysis underpinning electronic, photonic and MEMS packaging, in addition to new developments in passive components, electrical contacts and connectors, thermal management, and device reliability; as well as the manufacture of electronics parts and assemblies, with broad coverage of design, factory modeling, assembly methods, quality, product robustness, and design-for-environment.