先进集成光子学模块的三维封装技术综述

IF 3 3区工程技术 Q2 ENGINEERING, ELECTRICAL & ELECTRONIC

IEEE Transactions on Components, Packaging and Manufacturing Technology Pub Date : 2025-06-23 DOI:10.1109/TCPMT.2025.3582041

Jean Charbonnier;Thierry Mourier;Stéphane Bernabé

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引用次数: 0

摘要

在数据通信、高性能计算和集成光学传感器领域，光子学应用的最新发展加速了十多年前宣布的电子/光学融合趋势。硅光子学的日益成熟及其与先进封装技术（3-D堆叠，通过硅通孔（TSV）和扇出晶圆级封装）的结合，促成了两种新对象的出现，这些新对象正在成为标准：共封装光学器件（CPOs）和光子中间层，两者都利用光子芯片。本文回顾了这两个对象的出现，以及最近的成就。

本文章由计算机程序翻译，如有差异，请以英文原文为准。

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3-D Packaging Technologies for Advanced Integrated Photonics Modules: A Review

Recent developments in photonics applications, in the fields of datacom, high-performance computing, and integrated optical sensors, have accelerated the trend toward electronic/optical convergence announced over ten years ago. The growing maturity of silicon photonics and its use in conjunction with advanced packaging techniques (3-D stacking, through silicon via (TSV), and fan-out wafer-level packaging) have contributed to the emergence of two new objects that are becoming standards: co-packaged optics (CPOs) and photonic interposers, both leveraging photonic chiplets. This article reviews the emergence of these two objects, as well as the most recent achievements.

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来源期刊

IEEE Transactions on Components, Packaging and Manufacturing Technology ENGINEERING, MANUFACTURING-ENGINEERING, ELECTRICAL & ELECTRONIC

CiteScore

4.70

自引率

13.60%

发文量

203

审稿时长

3 months

期刊介绍： IEEE Transactions on Components, Packaging, and Manufacturing Technology publishes research and application articles on modeling, design, building blocks, technical infrastructure, and analysis underpinning electronic, photonic and MEMS packaging, in addition to new developments in passive components, electrical contacts and connectors, thermal management, and device reliability; as well as the manufacture of electronics parts and assemblies, with broad coverage of design, factory modeling, assembly methods, quality, product robustness, and design-for-environment.