准椭圆宽阻带交叉耦合基板集成波导滤波器

IF 3 3区 工程技术 Q2 ENGINEERING, ELECTRICAL & ELECTRONIC
Peng Chu;Jialong Zhou;Wenyu Zhang;Fang Zhu;Li Cheng;Leilei Liu;Ke Wu
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引用次数: 0

摘要

本文提出了一种新的交叉耦合基板集成波导(SIW)滤波器技术,以实现宽阻带和准椭圆响应。它利用了多层中杂散模式的场分布特性,以防止它们在不影响其准椭圆基带的情况下通过主耦合路径和交叉耦合路径传输,而不是之前报道的只能在主耦合路径中抑制杂散模式的设计。提供了一个示例。在不使用影响SIW优势的混合结构的情况下,采用适合高性能和高频应用的屏蔽结构,实现了具有多个传输零点(TZs)的准椭圆响应和具有足够抑制的宽阻带。该技术对于微波和无线电路和系统中SIW滤波器的开发是有效的。
本文章由计算机程序翻译,如有差异,请以英文原文为准。
Cross Coupled Substrate Integrated Waveguide Filter With Quasi-Elliptic Response and Wide Stopband
This article proposes a new technique for the cross coupled substrate integrated waveguide (SIW) filter to achieve a wide stopband in addition to a quasi-elliptic response. It exploits the field distribution properties of spurious modes in multilayers to prevent them from transmitting through both the main and cross coupling paths without affecting its quasi-elliptic fundamental passband, as opposed to the previously reported designs that can suppress spurious modes only in their main coupling path. An example is provided. Without using a hybrid structure that compromises the superiority of SIW, and with a shielding structure that is suitable for high-performance and high-frequency applications, it achieves a quasi-elliptic response with multiple transmission zeros (TZs) and a wide stopband with adequate suppression. The proposed technique should be effective for developing SIW filters in microwave and wireless circuits and systems.
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来源期刊
IEEE Transactions on Components, Packaging and Manufacturing Technology
IEEE Transactions on Components, Packaging and Manufacturing Technology ENGINEERING, MANUFACTURING-ENGINEERING, ELECTRICAL & ELECTRONIC
CiteScore
4.70
自引率
13.60%
发文量
203
审稿时长
3 months
期刊介绍: IEEE Transactions on Components, Packaging, and Manufacturing Technology publishes research and application articles on modeling, design, building blocks, technical infrastructure, and analysis underpinning electronic, photonic and MEMS packaging, in addition to new developments in passive components, electrical contacts and connectors, thermal management, and device reliability; as well as the manufacture of electronics parts and assemblies, with broad coverage of design, factory modeling, assembly methods, quality, product robustness, and design-for-environment.
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