发布求助
文献互助 智能选刊 最新文献

1992 Proceedings 42nd Electronic Components & Technology Conference最新文献

筛选
英文 中文
Torsional stiffness and fatigue study of surface-mounted compliant leaded systems 表面安装柔性铅系统的扭转刚度和疲劳研究
1992 Proceedings 42nd Electronic Components & Technology Conference Pub Date : 1992-05-18 DOI: 10.1109/ECTC.1992.204259
P. Engel, T. Miller
{"title":"Torsional stiffness and fatigue study of surface-mounted compliant leaded systems","authors":"P. Engel, T. Miller","doi":"10.1109/ECTC.1992.204259","DOIUrl":"https://doi.org/10.1109/ECTC.1992.204259","url":null,"abstract":"Circuit cards with surface soldered compliant leaded modules are often subjected to torque tests to ensure their structural integrity. The authors explore the stiffness and fatigue behavior of such structures. A torsional load tester was devised, exerting cyclic mechanical torque at a desired fixed amplitude and frequency. Twisting loads up into the nonlinear load range were applied. Lead forces were computed by structural analysis methods, and these were compared with finite element results. The Engel-Ling coupled plate theory was found to correspond well to finite element results. Fatigue failures occurred in the solder for J-leads and in the leads for gullwings. Fatigue curves resembled the Coffin-Manson law.<<ETX>>","PeriodicalId":125270,"journal":{"name":"1992 Proceedings 42nd Electronic Components & Technology Conference","volume":"52 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"1992-05-18","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"130135792","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 3
Design and performance of a 10-Gbit/s optical transmitter module 10gbit /s光发送模块的设计与性能
1992 Proceedings 42nd Electronic Components & Technology Conference Pub Date : 1992-05-18 DOI: 10.1109/ECTC.1992.204302
M. Goto, K. Hironishi, A. Sugata, K. Mori, T. Korimatsu, M. Sasaki
{"title":"Design and performance of a 10-Gbit/s optical transmitter module","authors":"M. Goto, K. Hironishi, A. Sugata, K. Mori, T. Korimatsu, M. Sasaki","doi":"10.1109/ECTC.1992.204302","DOIUrl":"https://doi.org/10.1109/ECTC.1992.204302","url":null,"abstract":"A compact 10-Gb/s optical transmitter module with low-chip output was developed by using a monolithically integrated electroabsorption modulator with a DFB (distributed feedback) laser. A novel optical coupling scheme was used which involves a unique optical isolator with a photodiode for output power monitoring, and a thermoelectric cooler mounted in the package to achieve thermally stable module operation. The module can be operated at a bit rate of more than 10 Gb/s at 1.55 mu m and shows a high modulated output power of -1 dBm with a low optical coupling loss of 3.2 dB between chip and fiber. Because its wavelength chirping under high-speed modulation is small, this module is promising for multigigabit intensity modulation and direct detection (IM-DD) optical transmission systems.<<ETX>>","PeriodicalId":125270,"journal":{"name":"1992 Proceedings 42nd Electronic Components & Technology Conference","volume":"18 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"1992-05-18","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"130577046","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 1
VLSI packaging requirements for new and evolving work stations 新的和不断发展的工作站的VLSI封装要求
1992 Proceedings 42nd Electronic Components & Technology Conference Pub Date : 1992-05-18 DOI: 10.1109/ECTC.1992.204178
H. L. Davidson
{"title":"VLSI packaging requirements for new and evolving work stations","authors":"H. L. Davidson","doi":"10.1109/ECTC.1992.204178","DOIUrl":"https://doi.org/10.1109/ECTC.1992.204178","url":null,"abstract":"It is suggested that there are four technological improvements that workstation designers need for future systems: (1) area pad connections to die; (2) low thermal resistance from junction to air; (3) reliable, inexpensive MCMs (multichip modules); and (4) 'known good' bare die to put on the MCMs. Having area pad connections to the die accomplishes two critical things: it provides the number of pins that the system architects want, and drives the die attach technology towards low series inductance. The low thermal resistance permits the system designer to survive the air flow constraint that has been placed on the box by acoustic noise limits and very tight mechanical packaging. MCMs enable the designer to confine high speed paths to the module. This eases the problems of crosstalk and skew that the current generation of single device packages aggravates.<<ETX>>","PeriodicalId":125270,"journal":{"name":"1992 Proceedings 42nd Electronic Components & Technology Conference","volume":"80 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"1992-05-18","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"128822788","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 2
High-density packaging: future outlook 高密度包装:未来展望
1992 Proceedings 42nd Electronic Components & Technology Conference Pub Date : 1992-05-18 DOI: 10.1109/ECTC.1992.204180
L.A. Buda, R. Gedney, T. F. Kelley
{"title":"High-density packaging: future outlook","authors":"L.A. Buda, R. Gedney, T. F. Kelley","doi":"10.1109/ECTC.1992.204180","DOIUrl":"https://doi.org/10.1109/ECTC.1992.204180","url":null,"abstract":"Describes the general packaging outlook for the 1990s for primarily low-end to intermediate systems. It is pointed out that the key drivers on packaging are: (1) the trend towards higher performance which drives electrical and thermal design in a cost/performance environment; and (2) the trend toward portable and notebook systems which drives low weight and thin packages in a cost conscious environment. Attention is given to the SCM strategy, the MCM (multichip module) strategy, chip-on-board considerations, and wiring and surface area comparisons.<<ETX>>","PeriodicalId":125270,"journal":{"name":"1992 Proceedings 42nd Electronic Components & Technology Conference","volume":"34 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"1992-05-18","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"116195155","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 5
A new assembly architecture for multichannel singlemode-fiber-pigtail LD/PD modules 一种新的多通道单模光纤尾纤LD/PD模块组装架构
1992 Proceedings 42nd Electronic Components & Technology Conference Pub Date : 1992-05-18 DOI: 10.1109/ECTC.1992.204306
T. Kato, F. Yuuki, K. Tanaka, T. Habu, T. Shimura, A. Takai, K. Mizuishi, T. Teraoka, Y. Motegi
{"title":"A new assembly architecture for multichannel singlemode-fiber-pigtail LD/PD modules","authors":"T. Kato, F. Yuuki, K. Tanaka, T. Habu, T. Shimura, A. Takai, K. Mizuishi, T. Teraoka, Y. Motegi","doi":"10.1109/ECTC.1992.204306","DOIUrl":"https://doi.org/10.1109/ECTC.1992.204306","url":null,"abstract":"A novel assembly architecture is developed for alignment and soldering between single-mode (SM) fiber arrays and laser-diode/photodiode (LD/PD) arrays. The image position detection method, by eliminating degrees of freedom for alignment, improves assembly throughput to twice that of conventional assembly architecture. The thermal shrinkage compensation method achieves high-precision soldering by canceling misalignments due to thermal shrinkage of assembly equipment and solder volume. As a result, assembly, through all processes, achieves +or-1.5- mu m precision, which corresponds to a +or-1-dB fluctuation of coupling efficiency. Based on this architecture, eight-channel SM-fiber-pigtail LD/PD modules were successfully assembled.<<ETX>>","PeriodicalId":125270,"journal":{"name":"1992 Proceedings 42nd Electronic Components & Technology Conference","volume":"26 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"1992-05-18","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"121198335","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 12
High-reliability silver-bearing thick film conductors for automotive applications 汽车用高可靠性含银厚膜导体
1992 Proceedings 42nd Electronic Components & Technology Conference Pub Date : 1992-05-18 DOI: 10.1109/ECTC.1992.204198
K. Yamamoto, S. Abou, S. Uchida, H. Kojo, H. Hara, Y. Yamamoto, B. Taylor, M. Labranche
{"title":"High-reliability silver-bearing thick film conductors for automotive applications","authors":"K. Yamamoto, S. Abou, S. Uchida, H. Kojo, H. Hara, Y. Yamamoto, B. Taylor, M. Labranche","doi":"10.1109/ECTC.1992.204198","DOIUrl":"https://doi.org/10.1109/ECTC.1992.204198","url":null,"abstract":"The reliability of several soldered thick-film Pd/Ag and Pt/Ag conductors under thermal cycles is reported. Evaluations were made of the thermal cycle adhesion by wire peel tests, as well as the electrical reliability of soldered components. In the case of Pt/Ag, the failure mode with mounted components was at the conductor/solder interface. The results of the electrical reliability test generally agreed with peel test results. However, when components were soldered to Pd/Ag conductors, vertical cracks were often observed through the conductor at the edge of the solder fillet. These cracks did not correlate with failure modes from peel tests. The tendency to vertical cracking was significantly reduced with the use of a dense firing Pd/Ag composition. No vertical cracks were observed with the Pt/Ag conductor because of the much slower rate of Sn intermetallic formation compared with Pd/Ag conductors. The design windows for both Pd/Ag and Pt/Ag conductors are discussed from the circuit design point of view.<<ETX>>","PeriodicalId":125270,"journal":{"name":"1992 Proceedings 42nd Electronic Components & Technology Conference","volume":"75 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"1992-05-18","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"123806151","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 1
Multichip modules vs. high-density printed wiring boards: a trade-off study 多芯片模块与高密度印刷线路板:权衡研究
1992 Proceedings 42nd Electronic Components & Technology Conference Pub Date : 1992-05-18 DOI: 10.1109/ECTC.1992.204179
D. E. O'Brien, B. Hahne, J. Krusius
{"title":"Multichip modules vs. high-density printed wiring boards: a trade-off study","authors":"D. E. O'Brien, B. Hahne, J. Krusius","doi":"10.1109/ECTC.1992.204179","DOIUrl":"https://doi.org/10.1109/ECTC.1992.204179","url":null,"abstract":"A comparison of conventional single-chip on high-density printed wiring board (PWB) packaging with both ceramic and silicon-substrate multichip module (MCM) strategies is presented. Both approaches are assessed given current state-of-the-art manufacturing capabilities and projections for the foreseeable future. The computer system used as the basis to investigate the relative impact of these packaging approaches is representative of a current workstation with a reduced instruction set computing (RISC) architecture. This study was conducted with AUDiT Version 4.2, an innovative simulation tool for evaluating the physical design of electronic systems. It is demonstrated that the maximum efficiency of the conventional single-chip PGA module on PWB packaging of state-of-the-art RISC workstations, such as the IBM RS/6000, is only about 14%. The addition of signal layers may improve speed performance for a given PWB design rule, but not beyond the PGA package tiling limit constraint. Introduction of multichip packaging greatly increases processor speed and dramatically reduces the overall system size.<<ETX>>","PeriodicalId":125270,"journal":{"name":"1992 Proceedings 42nd Electronic Components & Technology Conference","volume":"60 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"1992-05-18","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"131288505","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 3
Package inductance measurement at high frequencies 高频封装电感测量
1992 Proceedings 42nd Electronic Components & Technology Conference Pub Date : 1992-05-18 DOI: 10.1109/ECTC.1992.204287
Chi-Taou Tsai
{"title":"Package inductance measurement at high frequencies","authors":"Chi-Taou Tsai","doi":"10.1109/ECTC.1992.204287","DOIUrl":"https://doi.org/10.1109/ECTC.1992.204287","url":null,"abstract":"A major task in electrical characterization of IC packages is the experimental determination of package R, L, and C. A package self-inductance measurement technique based on network analysis and a lumped-element package model is described. Advantages of this technique include measuring inductance at the high operating frequencies of today's high-speed CMOS and ECL chips, providing information on a package's resonance frequencies and the limit of the lumped-element model, being inherently more accurate than techniques that measure package inductance at lower frequencies, and utilizing a simple one-port measurement method, procedure, and fixture design. Different packages and interconnects including a 160 QFP (quad flat package), a 296-lead TAB (tape automated bonding) tape, a flip TAB structure, and bonding wires of different length were characterized using this technique.<<ETX>>","PeriodicalId":125270,"journal":{"name":"1992 Proceedings 42nd Electronic Components & Technology Conference","volume":"33 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"1992-05-18","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"131545390","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 8
Packaging technology for high-power, singlemode-fiber-pigtailed pump laser modules for Er-doped fiber amplifiers 用于掺铒光纤放大器的高功率单模光纤尾纤泵浦激光模块封装技术
1992 Proceedings 42nd Electronic Components & Technology Conference Pub Date : 1992-05-18 DOI: 10.1109/ECTC.1992.204304
V. Shah, L. Curtis, D. Mahoney, N. Andreadakis, F. Favire, B. Pathak, C. Caneau, R. Bhat, C. Zah, W. Young
{"title":"Packaging technology for high-power, singlemode-fiber-pigtailed pump laser modules for Er-doped fiber amplifiers","authors":"V. Shah, L. Curtis, D. Mahoney, N. Andreadakis, F. Favire, B. Pathak, C. Caneau, R. Bhat, C. Zah, W. Young","doi":"10.1109/ECTC.1992.204304","DOIUrl":"https://doi.org/10.1109/ECTC.1992.204304","url":null,"abstract":"A packaging technology for efficiently coupling a conical microlens single-mode fiber to a laser diode has been developed. A two-step approach has been used in which angular and linear alignments are carried out separately by using reusable fixtures. A thermoelectric cooler and a thermocouple are used to maintain the laser at a constant temperature of 15 degrees C. Using this approach, the authors have achieved submicron alignment between the laser and the lensed fiber and have obtained 106-mW fiber-coupled power in a 1480-nm wavelength packaged laser diode module which has been successfully used in pumping Er-doped fiber amplifiers.<<ETX>>","PeriodicalId":125270,"journal":{"name":"1992 Proceedings 42nd Electronic Components & Technology Conference","volume":"9 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"1992-05-18","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"132670930","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 1
High-frequency performance of GE high-density interconnect modules GE高密互连模块的高频性能
1992 Proceedings 42nd Electronic Components & Technology Conference Pub Date : 1992-05-18 DOI: 10.1109/ECTC.1992.204197
T. Haller, B. Whitmore, P. Zabinski, B. Gilbert
{"title":"High-frequency performance of GE high-density interconnect modules","authors":"T. Haller, B. Whitmore, P. Zabinski, B. Gilbert","doi":"10.1109/ECTC.1992.204197","DOIUrl":"https://doi.org/10.1109/ECTC.1992.204197","url":null,"abstract":"An effort to determine the high-frequency electrical characteristics of the HDI (high-density interconnect) process and validate models and analytical tools is described. There were seven different designs fabricated, five with only passive structures and two with both passive and active structures. These coupons were designed with many different line structures in order to determine the electrical characteristics of HDI at high (>500-MHz) frequencies. A few of the structures used on the coupons and their respective electrical performances are discussed. The analytical tools derived from basic transmission line theory appear adequate to explain observed values of insertion loss, reflection loss, and crosstalk. In addition, the measurements confirmed the commonly accepted values for the electrical parameters of the GE HDI process (dielectric constant, loss tangent, and electrical resistivity). The crosstalk measurements demonstrate that sufficient isolation exists for practical system designs up to frequencies of 9 GHz in the stripline configuration, and even in the less-tolerant microstrip configuration good isolation is obtained without use of excessive spacing or guard conductors. The major limitation at the higher frequencies appears to be the insertion loss, which approaches 10 dB in some of the longer-length lines considered.<<ETX>>","PeriodicalId":125270,"journal":{"name":"1992 Proceedings 42nd Electronic Components & Technology Conference","volume":"42 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"1992-05-18","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"133200013","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 28
首页 上一页 下一页 尾页
0
×
引用
GB/T 7714-2015
复制
MLA
复制
APA
复制
导出至
BibTeX EndNote RefMan NoteFirst NoteExpress
×
提示
您的信息不完整，为了账户安全，请先补充。
现在去补充
×
提示
您因"违规操作"
具体请查看互助需知
我知道了
×
提示
现在去查看 取消
×
提示
确定
请完成安全验证×
相关产品
×
本文献相关产品
联系我们：info@booksci.cn Book学术提供免费学术资源搜索服务，方便国内外学者检索中英文文献。致力于提供最便捷和优质的服务体验。 Copyright © 2023 布克学术 All rights reserved.
京ICP备2023020795号-1
ghs 京公网安备 11010802042870号
Book学术文献互助
Book学术文献互助群
群 号：604180095
Book学术官方微信