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1992 Proceedings 42nd Electronic Components & Technology Conference最新文献

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A low-cost manufacturing process for high-density hybrid components, based on multilayer polyimide/ceramic structures 基于多层聚酰亚胺/陶瓷结构的高密度混合组件的低成本制造工艺
1992 Proceedings 42nd Electronic Components & Technology Conference Pub Date : 1992-05-18 DOI: 10.1109/ECTC.1992.204194
M. Tudanca, R. G. Luna, A. Fraile, J. Triana, J.M. Gonzalvez, I. Vincueria, C. Domínguez
{"title":"A low-cost manufacturing process for high-density hybrid components, based on multilayer polyimide/ceramic structures","authors":"M. Tudanca, R. G. Luna, A. Fraile, J. Triana, J.M. Gonzalvez, I. Vincueria, C. Domínguez","doi":"10.1109/ECTC.1992.204194","DOIUrl":"https://doi.org/10.1109/ECTC.1992.204194","url":null,"abstract":"A multichip module component manufacturing process combining multilayer polyimide and multilayer low-temperature cofired ceramic structures, using the latter as the encapsulation support, is described. A first characterization of the results is also reported. The procedures described make it possible to integrate resistances in thin/thick-film technology.<<ETX>>","PeriodicalId":125270,"journal":{"name":"1992 Proceedings 42nd Electronic Components & Technology Conference","volume":"3 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"1992-05-18","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"132065664","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 5
Welding of plated, dissimilar metals for RF/EMI shielding 焊接电镀异种金属，用于射频/电磁干扰屏蔽
1992 Proceedings 42nd Electronic Components & Technology Conference Pub Date : 1992-05-18 DOI: 10.1109/ECTC.1992.204181
W.A. Bratschun, J. L. Leicht
{"title":"Welding of plated, dissimilar metals for RF/EMI shielding","authors":"W.A. Bratschun, J. L. Leicht","doi":"10.1109/ECTC.1992.204181","DOIUrl":"https://doi.org/10.1109/ECTC.1992.204181","url":null,"abstract":"Plated beryllium-copper shield clips are used in the Motorola MicroTAC cellular portable telephone to provide interconnections between the RF ground and the mating shielded and compartmentalized housing cover. Outer shield clip attachment to the plated steel core of the circuit board is accomplished using a resistance weld in a narrow, space-limited area closely adjacent to conductor traces. The production welding process was characterized by widely varying weld strengths, the need for multiple welds to achieve adequate weld strength, ejection of metal during welding, frequent electrode dressing, and frequent electrode replacement. An investigation was performed with the purpose of developing a stronger weld and a more consistent welding process without the limitations mentioned above. It was determined that the process could be improved by (1) the use of projections, (2) larger, harder electrodes, (3) slightly softened shield clips, and (4) an angled top electrode to aid the operator. The improved weld was analyzed using cross sections, optical and scanning electron microscopy, and energy dispersion spectroscopy.<<ETX>>","PeriodicalId":125270,"journal":{"name":"1992 Proceedings 42nd Electronic Components & Technology Conference","volume":"27 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"1992-05-18","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"130045993","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 13
A new type of fiber optic connector designed for military optical backplanes 一种用于军用光学背板的新型光纤连接器
1992 Proceedings 42nd Electronic Components & Technology Conference Pub Date : 1992-05-18 DOI: 10.1109/ECTC.1992.204271
R. Pimpinella
{"title":"A new type of fiber optic connector designed for military optical backplanes","authors":"R. Pimpinella","doi":"10.1109/ECTC.1992.204271","DOIUrl":"https://doi.org/10.1109/ECTC.1992.204271","url":null,"abstract":"A new type of fiber-optic connector designed to meet military stress requirements has been demonstrated. This reliable optical card-edge (ROC) connector is a multifiber backplane connector (four fiber, blind mate). The connector uses a unique, expanded beam coupling design and micromachined silicon optical subassemblies to provide optimum coupling under high levels of shock and vibration. An additional feature of the ROC connector is its ability to self-seal or shield the optical fiber ends when unmated, protecting the fibers and internal mechanisms from environmental contamination and abusive handling. The authors discuss the design features of the ROC connector with respect to military stress requirements, and present the prototype test results. Based on the test results, it is concluded that the ROC connector can provide a nominal insertion loss of 0.75 dB with a standard deviation of 0.2 dB. The connector provides superb repeatability (standard deviation of 0,1 dB), and shows no evidence of degradation for the nearly 500 insertions and extractions measured (with no cleaning).<<ETX>>","PeriodicalId":125270,"journal":{"name":"1992 Proceedings 42nd Electronic Components & Technology Conference","volume":"6 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"1992-05-18","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"131481254","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 8
A thin film multichip module for workstation applications 用于工作站应用的薄膜多芯片模块
1992 Proceedings 42nd Electronic Components & Technology Conference Pub Date : 1992-05-18 DOI: 10.1109/ECTC.1992.204322
M. Bregman, A. Kimura, T. Matsui, H. Nishida, K. Nishiyama, H. Ohkuma, A. Tanaka, C. Kovac, D. McQueeney
{"title":"A thin film multichip module for workstation applications","authors":"M. Bregman, A. Kimura, T. Matsui, H. Nishida, K. Nishiyama, H. Ohkuma, A. Tanaka, C. Kovac, D. McQueeney","doi":"10.1109/ECTC.1992.204322","DOIUrl":"https://doi.org/10.1109/ECTC.1992.204322","url":null,"abstract":"A thin film multichip module which utilizes very high density wiring on a silicon substrate has been developed. The technology has been demonstrated using the IBM RISC (reduced instruction set computer) System/6000 processor as a vehicle. The prototype module contains a RISC processor consisting of nine CMOS VLSI chips. The package also contains decoupling capacitors and has 684 I/O. The substrate consists of a thin film structure fabricated on a silicon wafer using a polyimide dielectric and aluminum metal. All fabrication was done in an existing CMOS manufacturing line. IBM's C4 (controlled collapse chip connection) flip chip bonding technique was used to connect the CMOS VLSI chips to the package. The silicon substrate was packaged nonhermetically and connected to the next level of packaging using very high density surface mount flex cables. A clip-on heatsink was attached to the finished module, which allows for up to 30 W of power dissipation in the air flow found in a typical workstation environment.<<ETX>>","PeriodicalId":125270,"journal":{"name":"1992 Proceedings 42nd Electronic Components & Technology Conference","volume":"18 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"1992-05-18","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"122024297","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 10
Effect of the specimen size in predicting the mechanical properties of PbSn solder alloys 试样尺寸对预测PbSn钎料合金力学性能的影响
1992 Proceedings 42nd Electronic Components & Technology Conference Pub Date : 1992-05-18 DOI: 10.1109/ECTC.1992.204258
N. Bonda, I. Noyan
{"title":"Effect of the specimen size in predicting the mechanical properties of PbSn solder alloys","authors":"N. Bonda, I. Noyan","doi":"10.1109/ECTC.1992.204258","DOIUrl":"https://doi.org/10.1109/ECTC.1992.204258","url":null,"abstract":"The data obtained from bulk test specimens are often used in deformation models to predict the mechanical responses of parts that are very different in size and shape, such as solder joints in VLSI surface mount components. Such predictions are valid only if the size of the solder joints exceeds the representative deformation volume of the bulk specimens. In the present study, the measurement of the representative volume was performed for a single-phase solder alloy (98Pb-2Sn wt.%) deformed in both tension and cyclic loading. Deformation of 98Pb-2Sn alloy at room temperature was shown to be extremely inhomogeneous in both tensile and cyclic loading, and strain localization was observed at the grain boundaries. Strain distribution is more inhomogeneous in the specimen tested in fatigue than the specimen tested in uniaxial tension. This may be due to fatigue inhomogeneity in strain distribution or a small degree of buckling. The number of grains required for a representative volume of the 98Pb-2Sn alloy specimens tested is quite large.<<ETX>>","PeriodicalId":125270,"journal":{"name":"1992 Proceedings 42nd Electronic Components & Technology Conference","volume":"40 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"1992-05-18","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"122081062","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 47
Short-pulse propagation technique for characterizing resistive package interconnections 表征电阻式封装互连的短脉冲传播技术
1992 Proceedings 42nd Electronic Components & Technology Conference Pub Date : 1992-05-18 DOI: 10.1109/33.206927
A. Deutsch, G. Arjavalingam, G. Kopcsay, M. Degerstrom
{"title":"Short-pulse propagation technique for characterizing resistive package interconnections","authors":"A. Deutsch, G. Arjavalingam, G. Kopcsay, M. Degerstrom","doi":"10.1109/33.206927","DOIUrl":"https://doi.org/10.1109/33.206927","url":null,"abstract":"A novel technique for completely characterizing the frequency-dependent electrical properties of resistive transmission lines by short-pulse propagation is described. Time-domain measurements of the loss and dispersion of pulses propagated on two different lengths of the line under investigation, together with the measured low-frequency capacitance, are used to determine its broadband complex propagation constant and complex impedance. The technique is illustrated with measurements on a thin-film package interconnection structure. The measured line characteristics are then used in a transient circuit analysis program to predict output waveforms generated by logiclike signals. In the absence of modeling capabilities, the measured results can be used directly as input to circuit simulation programs. The authors illustrate this with the response of a 9.65-cm-long thin-film line to logiclike signals.<<ETX>>","PeriodicalId":125270,"journal":{"name":"1992 Proceedings 42nd Electronic Components & Technology Conference","volume":"42 5 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"1992-05-18","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"125753190","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 27
Four-channel, long-wavelength transmitter arrays incorporating passive laser/singlemode-fiber alignment on silicon waferboard 采用无源激光/单模光纤对准硅片的四通道长波发射机阵列
1992 Proceedings 42nd Electronic Components & Technology Conference Pub Date : 1992-05-18 DOI: 10.1109/ECTC.1992.204192
C. Armiento, A. J. Negri, M.J. Tabasky, R. Boudreau, M. Rothman, T. Fitzgerald, P. Haugsjaa
{"title":"Four-channel, long-wavelength transmitter arrays incorporating passive laser/singlemode-fiber alignment on silicon waferboard","authors":"C. Armiento, A. J. Negri, M.J. Tabasky, R. Boudreau, M. Rothman, T. Fitzgerald, P. Haugsjaa","doi":"10.1109/ECTC.1992.204192","DOIUrl":"https://doi.org/10.1109/ECTC.1992.204192","url":null,"abstract":"Individually addressable, four-channel transmitter arrays operating at a wavelength of 1.3 mu m have been developed based on a hybrid optoelectronic integration approach called silicon waferboard. This approach uses micromachined silicon substrates as a platform for integration of electronic, optoelectronic, and optical components. It should lead toward the development of optical multichip modules. Silicon waferboard uses mechanical alignment features fabricated on the surface of a silicon chip to permit passive optical alignment of components such as lasers and optical fibers. The transmitter array comprises a four-channel InGaAsP-InP laser array that is passively aligned to four single-mode fibers held in V-grooves. The transmitter array also includes a four-channel GaAs MESFET driver array chip that provides high-speed drive currents to the individual lasers. The laser array, driver array, and optical fibers are all spaced on 350- mu m centers. which results ill a transmitter array that fits within a width of only 2 mm. Packages with high-speed electrical and optical I/Os have also been designed to accommodate the transmitter array waferboards for use in system applications.<<ETX>>","PeriodicalId":125270,"journal":{"name":"1992 Proceedings 42nd Electronic Components & Technology Conference","volume":"15 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"1992-05-18","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"124821898","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 13
Polymeric resin-filled optical couplers with mode mixing and polarization scrambling microparticles 具有模式混合和偏振置乱微粒的聚合物树脂填充光学耦合器
1992 Proceedings 42nd Electronic Components & Technology Conference Pub Date : 1992-05-18 DOI: 10.1109/ECTC.1992.204273
G. Grimes, L.L. Blyler
{"title":"Polymeric resin-filled optical couplers with mode mixing and polarization scrambling microparticles","authors":"G. Grimes, L.L. Blyler","doi":"10.1109/ECTC.1992.204273","DOIUrl":"https://doi.org/10.1109/ECTC.1992.204273","url":null,"abstract":"It was found that the performance of polymeric multimode combiners and splitters could be enhanced by the addition of mode mixing microspheres. The microparticles were silica, which had a slightly different index of refraction (1.46) than that (1.40) of the silicone polymeric material in which they were suspended. This index difference causes both refractive and diffractive mode mixing effects. The refraction and diffraction causes light to be scattered preferentially into higher-order modes. When propagating light reaches equilibrium and uniformity in the propagating modes, it is known that in large, high-NA , step index waveguides the power distribution across the aperture of the waveguide is also uniform. This means that the couplers can achieve the fiber-to-fiber uniformity required to make both combiners and splitters. Loss and near-field uniformity measurements of large polymer waveguides excited by a relatively small collimated HeNe laser have been carried out. Uniformity measurements of complete 1*7 splitters containing a visible diode laser are also presented. The application of this technology to a polymeric photon switch is discussed.<<ETX>>","PeriodicalId":125270,"journal":{"name":"1992 Proceedings 42nd Electronic Components & Technology Conference","volume":"24 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"1992-05-18","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"129480332","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 1
Use of low cost plastic DIPs and injection molded parts in packaging of optical data links 在光学数据链路封装中使用低成本塑料dip和注塑件
1992 Proceedings 42nd Electronic Components & Technology Conference Pub Date : 1992-05-18 DOI: 10.1109/ECTC.1992.204274
M. S. Acarlar, S. L. Moyer, S. Robinson
{"title":"Use of low cost plastic DIPs and injection molded parts in packaging of optical data links","authors":"M. S. Acarlar, S. L. Moyer, S. Robinson","doi":"10.1109/ECTC.1992.204274","DOIUrl":"https://doi.org/10.1109/ECTC.1992.204274","url":null,"abstract":"A novel, low-cost version of the ODL 125 optical data link has been developed in response to market needs. This packaging scheme offers a low-cost, high-performance solution for the growing FDDI (Fiber Distributed Data Interface) market. The ODL 125 Series II data link operates at 125 MB/s and uses long-wavelength (1.3- mu m) optics. The ST connectorized package is pin-compatible with the existing ODL 125 Data Link. This package consists of an injection-molded type of housing, OSA (optical subassembly), TO-type headers, a 16-pin plastic DIP, and a stamped metal cover-all low-cost, high-volume, mature packaging technologies. In addition, the assembled package is plotted to allow for wave soldering and aqueous cleaning. The authors focus on the package design and performance results of the preproduction models. In addition, they discuss design alternatives such as the use of conductive plastics for EMI shielding.<<ETX>>","PeriodicalId":125270,"journal":{"name":"1992 Proceedings 42nd Electronic Components & Technology Conference","volume":"47 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"1992-05-18","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"128225207","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 11
Optimizing force and geometry parameters in design of reduced-insertion force connectors 减小插入力连接器设计中的力和几何参数优化
1992 Proceedings 42nd Electronic Components & Technology Conference Pub Date : 1992-05-18 DOI: 10.1109/ECTC.1992.204219
I. Sawchyn, E. S. Sproles
{"title":"Optimizing force and geometry parameters in design of reduced-insertion force connectors","authors":"I. Sawchyn, E. S. Sproles","doi":"10.1109/ECTC.1992.204219","DOIUrl":"https://doi.org/10.1109/ECTC.1992.204219","url":null,"abstract":"The need to design connectors with large numbers of I/Os is hindered by the associated rise in connector insertion force. It is possible to lower an undesirably high insertion force by reducing the normal force of the contacts, but this raises the question of whether reduced-normal force connectors are sufficiently reliable for telecommunications applications. The authors examined nine test connector designs fabricated with 150-, 75- and 35-g nominal contact normal force, and with 150-, 70-, and 35-mil radii at the point of contact with the pin. The connectors were exposed to conditions of thermal stress (thermal aging and thermal cycling), atmospheric corrosion, and extreme dust contamination coupled with thermal/humidity exposure. Precision resistance measurements were made at various times before, during, and after exposures. All nine designs performed reliably under the test conditions used in this study. The results suggest that connectors which are designed with contact geometries that provide higher local pressures are more effective in overcoming the interference of the dust contamination.<<ETX>>","PeriodicalId":125270,"journal":{"name":"1992 Proceedings 42nd Electronic Components & Technology Conference","volume":"43 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"1992-05-18","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"127347662","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 15
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