Torsional stiffness and fatigue study of surface-mounted compliant leaded systems

P. Engel, T. Miller
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引用次数: 3

Abstract

Circuit cards with surface soldered compliant leaded modules are often subjected to torque tests to ensure their structural integrity. The authors explore the stiffness and fatigue behavior of such structures. A torsional load tester was devised, exerting cyclic mechanical torque at a desired fixed amplitude and frequency. Twisting loads up into the nonlinear load range were applied. Lead forces were computed by structural analysis methods, and these were compared with finite element results. The Engel-Ling coupled plate theory was found to correspond well to finite element results. Fatigue failures occurred in the solder for J-leads and in the leads for gullwings. Fatigue curves resembled the Coffin-Manson law.<>
表面安装柔性铅系统的扭转刚度和疲劳研究
带有表面焊接的兼容铅模块的电路卡通常要进行扭矩测试,以确保其结构完整性。作者探讨了这种结构的刚度和疲劳行为。设计了一种扭转载荷测试仪,以所要求的固定幅值和频率施加循环机械扭矩。在非线性载荷范围内施加扭转载荷。采用结构分析方法计算了铅力,并与有限元计算结果进行了比较。恩格尔-凌耦合板理论与有限元结果吻合较好。疲劳失效发生在j型引线和鸥翼引线的焊料中。疲劳曲线与Coffin-Manson定律相似。
本文章由计算机程序翻译,如有差异,请以英文原文为准。
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