{"title":"高密度包装:未来展望","authors":"L.A. Buda, R. Gedney, T. F. Kelley","doi":"10.1109/ECTC.1992.204180","DOIUrl":null,"url":null,"abstract":"Describes the general packaging outlook for the 1990s for primarily low-end to intermediate systems. It is pointed out that the key drivers on packaging are: (1) the trend towards higher performance which drives electrical and thermal design in a cost/performance environment; and (2) the trend toward portable and notebook systems which drives low weight and thin packages in a cost conscious environment. Attention is given to the SCM strategy, the MCM (multichip module) strategy, chip-on-board considerations, and wiring and surface area comparisons.<<ETX>>","PeriodicalId":125270,"journal":{"name":"1992 Proceedings 42nd Electronic Components & Technology Conference","volume":"34 1","pages":"0"},"PeriodicalIF":0.0000,"publicationDate":"1992-05-18","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"5","resultStr":"{\"title\":\"High-density packaging: future outlook\",\"authors\":\"L.A. Buda, R. Gedney, T. F. Kelley\",\"doi\":\"10.1109/ECTC.1992.204180\",\"DOIUrl\":null,\"url\":null,\"abstract\":\"Describes the general packaging outlook for the 1990s for primarily low-end to intermediate systems. It is pointed out that the key drivers on packaging are: (1) the trend towards higher performance which drives electrical and thermal design in a cost/performance environment; and (2) the trend toward portable and notebook systems which drives low weight and thin packages in a cost conscious environment. Attention is given to the SCM strategy, the MCM (multichip module) strategy, chip-on-board considerations, and wiring and surface area comparisons.<<ETX>>\",\"PeriodicalId\":125270,\"journal\":{\"name\":\"1992 Proceedings 42nd Electronic Components & Technology Conference\",\"volume\":\"34 1\",\"pages\":\"0\"},\"PeriodicalIF\":0.0000,\"publicationDate\":\"1992-05-18\",\"publicationTypes\":\"Journal Article\",\"fieldsOfStudy\":null,\"isOpenAccess\":false,\"openAccessPdf\":\"\",\"citationCount\":\"5\",\"resultStr\":null,\"platform\":\"Semanticscholar\",\"paperid\":null,\"PeriodicalName\":\"1992 Proceedings 42nd Electronic Components & Technology Conference\",\"FirstCategoryId\":\"1085\",\"ListUrlMain\":\"https://doi.org/10.1109/ECTC.1992.204180\",\"RegionNum\":0,\"RegionCategory\":null,\"ArticlePicture\":[],\"TitleCN\":null,\"AbstractTextCN\":null,\"PMCID\":null,\"EPubDate\":\"\",\"PubModel\":\"\",\"JCR\":\"\",\"JCRName\":\"\",\"Score\":null,\"Total\":0}","platform":"Semanticscholar","paperid":null,"PeriodicalName":"1992 Proceedings 42nd Electronic Components & Technology Conference","FirstCategoryId":"1085","ListUrlMain":"https://doi.org/10.1109/ECTC.1992.204180","RegionNum":0,"RegionCategory":null,"ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"","JCRName":"","Score":null,"Total":0}
Describes the general packaging outlook for the 1990s for primarily low-end to intermediate systems. It is pointed out that the key drivers on packaging are: (1) the trend towards higher performance which drives electrical and thermal design in a cost/performance environment; and (2) the trend toward portable and notebook systems which drives low weight and thin packages in a cost conscious environment. Attention is given to the SCM strategy, the MCM (multichip module) strategy, chip-on-board considerations, and wiring and surface area comparisons.<>
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