High-density packaging: future outlook

Abstract

Describes the general packaging outlook for the 1990s for primarily low-end to intermediate systems. It is pointed out that the key drivers on packaging are: (1) the trend towards higher performance which drives electrical and thermal design in a cost/performance environment; and (2) the trend toward portable and notebook systems which drives low weight and thin packages in a cost conscious environment. Attention is given to the SCM strategy, the MCM (multichip module) strategy, chip-on-board considerations, and wiring and surface area comparisons.<>