IEEE Transactions on Materials for Electron Devices最新文献

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Editorial An Era of Surfaces 社论 一个表面的时代
IEEE Transactions on Materials for Electron Devices Pub Date : 2024-11-25 DOI: 10.1109/TMAT.2024.3486974
FRANCESCA IACOPI
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引用次数: 0
Call for Nominations for Editor-in-Chief—IEEE Transactions on Semiconductor Manufacturing 征集《IEEE 半导体制造》杂志主编提名
IEEE Transactions on Materials for Electron Devices Pub Date : 2024-11-05 DOI: 10.1109/TMAT.2024.3489232
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引用次数: 0
Advances in Flexible Electrotactile Devices for Restoration of Biomedical Haptic Sensation 用于恢复生物医学触觉的柔性电触觉设备的研究进展
IEEE Transactions on Materials for Electron Devices Pub Date : 2024-10-17 DOI: 10.1109/TMAT.2024.3483174
Yunxia Jin;Zixiong Wu;Yusheng Zhang;Jiaming Qi;Chwee Teck Lim
{"title":"Advances in Flexible Electrotactile Devices for Restoration of Biomedical Haptic Sensation","authors":"Yunxia Jin;Zixiong Wu;Yusheng Zhang;Jiaming Qi;Chwee Teck Lim","doi":"10.1109/TMAT.2024.3483174","DOIUrl":"https://doi.org/10.1109/TMAT.2024.3483174","url":null,"abstract":"Haptic technology often uses electrical or mechanical methods to stimulate skin mechanoreceptors, creating touch sensations that will enhance experiences in assistive technologies and virtual or augmented reality. One approach involves creating platforms that deliver spatiotemporal sensation to the skin by using thin, skin-like technologies, thus minimizing user discomfort. This review highlights the biological basis for nervous system involved in sensing and the fundamentals of electrotactile devices which facilitate tactile perception in forms suitable for integration with the skin. It discusses principles of human sensation and electrical stimulation, along with materials requirement, aiming to provide a comprehensive understanding of the possibilities of electrotactile techniques and its performance in enabling specific biomedical haptic applications where other haptic technologies are less effective. The potential of current efforts, along with challenges and associated opportunities are also presented.","PeriodicalId":100642,"journal":{"name":"IEEE Transactions on Materials for Electron Devices","volume":"1 ","pages":"126-135"},"PeriodicalIF":0.0,"publicationDate":"2024-10-17","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"142636503","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 0
Off-Axis Electron Holography as a Tool for the Mapping of Electromagnetic Properties in the Semiconductor Industry 作为半导体工业电磁特性绘图工具的离轴电子全息技术
IEEE Transactions on Materials for Electron Devices Pub Date : 2024-10-16 DOI: 10.1109/TMAT.2024.3482284
David Cooper;Victor Boureau;Trevor P. Almeida
{"title":"Off-Axis Electron Holography as a Tool for the Mapping of Electromagnetic Properties in the Semiconductor Industry","authors":"David Cooper;Victor Boureau;Trevor P. Almeida","doi":"10.1109/TMAT.2024.3482284","DOIUrl":"https://doi.org/10.1109/TMAT.2024.3482284","url":null,"abstract":"In this paper we discuss the state-of-the-art of off-axis electron holography today. We introduce the method and illustrate how it can be used for the measurements of dopants and polarization potentials in a range of different semiconductor materials. We then demonstrate how it can be used to measure the magnetic fields around technologically relevant materials for spintronics. Within this work we also demonstrate the use of off-axis electron holography during in-situ electrical biasing experiments for the study of micro-LED devices and in-situ annealing for the case of MRAM devices. We discuss when holography can and cannot be successfully applied and demonstrate clearly that it is a useful tool that can be used for routine analysis in the semiconductor industry.","PeriodicalId":100642,"journal":{"name":"IEEE Transactions on Materials for Electron Devices","volume":"1 ","pages":"136-150"},"PeriodicalIF":0.0,"publicationDate":"2024-10-16","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"142679378","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 0
Work Function Measurements of Carbon Structures Using Ultraviolet Photoelectron Spectroscopy 利用紫外光电子能谱测量碳结构的功函数
IEEE Transactions on Materials for Electron Devices Pub Date : 2024-10-07 DOI: 10.1109/TMAT.2024.3475331
Saif Taqy;Pallab Sarkar;Istiaq Shiam;Subrata Karmakar;Ariful Haque
{"title":"Work Function Measurements of Carbon Structures Using Ultraviolet Photoelectron Spectroscopy","authors":"Saif Taqy;Pallab Sarkar;Istiaq Shiam;Subrata Karmakar;Ariful Haque","doi":"10.1109/TMAT.2024.3475331","DOIUrl":"https://doi.org/10.1109/TMAT.2024.3475331","url":null,"abstract":"The work function of carbon-based materials is crucial in understanding the electronic properties, offering critical insights for optimizing device performance and advancing electronic applications. The work function of diamond-like carbon (DLC), Q-carbon, and diamond is measured using ultraviolet photoelectron spectroscopy (UPS). Three DLC films having different sp\u0000<sup>2</sup>\u0000/sp\u0000<sup>3</sup>\u0000 content (I\u0000<sub>D</sub>\u0000/I\u0000<sub>G</sub>\u0000 ratios 0.43, 0.87, and 1.61) are grown using pulsed laser deposition, and the Q-carbon films are fabricated using subsequent pulsed laser annealing of the DLC films. Moreover, the diamond films are deposited using hot filament chemical vapor deposition (HFCVD). The compositional analysis of the films is performed using Raman spectroscopy, and the formation of Q-carbon is confirmed through Raman spectroscopy and scanning electron microscopic (SEM) analysis. The bandgap measurement using the Tauc plot demonstrates the bandgap of the DLC films to range from 2.56 eV to 3.77 eV, while the bandgap of Q-carbon is measured to be 3.7 eV. The work function measurement reveals the values to range from 3.91 eV to 4.18 eV for the DLC films. Additionally, the work function of Q-carbon is calculated to be 3.82 eV from experimental measurements, while the DFT simulations provide a value of 3.62 eV. Finally, the diamond film's work function is measured at 4.54 eV. Overall, the results reveal insights into the relationship between structural characteristics and work function, providing valuable information for optimizing the performance of these materials in electronic and optoelectronic technologies.","PeriodicalId":100642,"journal":{"name":"IEEE Transactions on Materials for Electron Devices","volume":"1 ","pages":"121-125"},"PeriodicalIF":0.0,"publicationDate":"2024-10-07","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"142555111","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 0
Editorial A Quick History of Modern Electronics and the Role of Materials, Processes and Interfaces 社论 现代电子学简史以及材料、工艺和界面的作用
IEEE Transactions on Materials for Electron Devices Pub Date : 2024-08-30 DOI: 10.1109/TMAT.2024.3428948
Paolo A. Gargini
{"title":"Editorial A Quick History of Modern Electronics and the Role of Materials, Processes and Interfaces","authors":"Paolo A. Gargini","doi":"10.1109/TMAT.2024.3428948","DOIUrl":"https://doi.org/10.1109/TMAT.2024.3428948","url":null,"abstract":"","PeriodicalId":100642,"journal":{"name":"IEEE Transactions on Materials for Electron Devices","volume":"1 ","pages":"64-67"},"PeriodicalIF":0.0,"publicationDate":"2024-08-30","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"https://ieeexplore.ieee.org/stamp/stamp.jsp?tp=&arnumber=10659743","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"142090942","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"OA","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 0
Computational Analysis of the Effects of Nanoscale Confinement on the Structure of Low-k Dielectric Hybrid Organosilicate Materials 纳米级限制对低介电混合有机硅酸盐材料结构影响的计算分析
IEEE Transactions on Materials for Electron Devices Pub Date : 2024-08-20 DOI: 10.1109/TMAT.2024.3446740
Karsu Ipek Kilic;Rasit O. Topaloglu;Jeff Bielefeld;Reinhold H. Dauskardt
{"title":"Computational Analysis of the Effects of Nanoscale Confinement on the Structure of Low-k Dielectric Hybrid Organosilicate Materials","authors":"Karsu Ipek Kilic;Rasit O. Topaloglu;Jeff Bielefeld;Reinhold H. Dauskardt","doi":"10.1109/TMAT.2024.3446740","DOIUrl":"https://doi.org/10.1109/TMAT.2024.3446740","url":null,"abstract":"Emerging interconnect technologies with increased performance of microchips necessitate the reliable integration of ultra-low-k dielectrics such as hybrid organosilicate glasses (OSG) as insulating units to prevent crosstalk. However, obtaining nanoscale trench patterns densely filled with low-k dielectrics has been challenging as the feature sizes become smaller. Several studies report on the formation of undesired low-density regions within the low-k dielectric decreasing device reliability and preventing easy scalability. With the help of molecular dynamics simulations, we developed computational modeling strategies where we explore the role of OSG precursor structure and the OSG precursor-trench interaction on the formation of low-density regions and final morphology of the low-k filling under confinement. Our goal is to ultimately provide guidance for the experimental efforts for precursor selection to control the formation of low-density regions to enhance mechanical reliability. Our simulation results show that cyclic and hyperconnected 1,3,5-benzene precursor molecules can pack in a relatively more homogeneous fashion under nanoscale confinement compared to more conventionally connected ethylene bridged Et-OCS molecules. The molecular geometry and crosslinking of hyperconnected 1,3,5-benzene precursors can help reduce the formation of low-density regions and lead to better connectivity of the filling material formed under nanoconfinement; thereby yielding improved elastic and fracture properties.","PeriodicalId":100642,"journal":{"name":"IEEE Transactions on Materials for Electron Devices","volume":"1 ","pages":"82-89"},"PeriodicalIF":0.0,"publicationDate":"2024-08-20","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"142165001","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 0
MXene-Contacted Carbon Nanotube Thin-Film Transistors Using Aerosol Jet Printing 利用气溶胶喷射打印技术实现与 MXene 接触的碳纳米管薄膜晶体管
IEEE Transactions on Materials for Electron Devices Pub Date : 2024-08-15 DOI: 10.1109/TMAT.2024.3443753
Baiyu Zhang;Hansel A. Hobbie;Yizhang Wu;Wubin Bai;Aaron D. Franklin
{"title":"MXene-Contacted Carbon Nanotube Thin-Film Transistors Using Aerosol Jet Printing","authors":"Baiyu Zhang;Hansel A. Hobbie;Yizhang Wu;Wubin Bai;Aaron D. Franklin","doi":"10.1109/TMAT.2024.3443753","DOIUrl":"https://doi.org/10.1109/TMAT.2024.3443753","url":null,"abstract":"MXenes have garnered significant attention for electronics applications due to their facile synthesis, tunable properties, and exceptional optical and electrical characteristics. Their stable aqueous suspension without additional surfactants enables compatibility of MXenes with various low-cost, additive manufacturing techniques, including spin coating, spraying, and direct-write printing. In this work, we investigate the aerosol jet printing of water-based Ti\u0000<sub>3</sub>\u0000C\u0000<sub>2</sub>\u0000T\u0000<italic><sub>x</sub></i>\u0000 MXene on surfaces with different wettability, achieving printed thin films with sheet resistance as low as ∼7 Ω/□ within three printing passes on both hydrophilic and hydrophobic substrates. Furthermore, we present MXene-contacted carbon nanotube thin-film transistors (CNT-TFTs) with various device geometries, finding a tradeoff between on- and off-state performance when selecting between bottom and top contacts, respectively. Devices with MXene contacts exhibited performance (on-state current up to 16.9 μA/mm and on/off-current ratio of 10\u0000<sup>6</sup>\u0000) comparable to printed CNT-TFTs contacted by graphene and silver nanowires; meanwhile, the lower unit price of MXene ink makes it a more attractive candidate for low-cost, large-area fabrication.","PeriodicalId":100642,"journal":{"name":"IEEE Transactions on Materials for Electron Devices","volume":"1 ","pages":"90-96"},"PeriodicalIF":0.0,"publicationDate":"2024-08-15","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"142165030","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 0
Additive Manufacturing Materials and Processes for Passive Electronics in Wireless Communication 用于无线通信无源电子器件的快速成型制造材料和工艺
IEEE Transactions on Materials for Electron Devices Pub Date : 2024-08-08 DOI: 10.1109/TMAT.2024.3440889
Manh Dat Nguyen;Zhiwei Yin;Rafael Del Rey;Francesca Iacopi;Yang Yang
{"title":"Additive Manufacturing Materials and Processes for Passive Electronics in Wireless Communication","authors":"Manh Dat Nguyen;Zhiwei Yin;Rafael Del Rey;Francesca Iacopi;Yang Yang","doi":"10.1109/TMAT.2024.3440889","DOIUrl":"https://doi.org/10.1109/TMAT.2024.3440889","url":null,"abstract":"There is growing interest in Additive Manufacturing (AM) as a state-of-the-art fabrication technology for electronics, complementary to silicon -based manufacturing. Notwithstanding current limitations in the choice of available materials and minimum feature sizes, the ability to manufacture complex customized structures, compact and rapid prototyping are the main benefits of 3D printed electronics. This paper summarizes the status of AM electronics material's characteristics and introduces the principles of AME process. In particular, the AME applications in various frequency bands are discussed. Overall, this paper demonstrates the significance of AM in facilitating the advancement of advanced electronic component manufacturing, particularly as to passive circuits, electronic devices, antennas, metasurfaces and electronic packaging.","PeriodicalId":100642,"journal":{"name":"IEEE Transactions on Materials for Electron Devices","volume":"1 ","pages":"97-105"},"PeriodicalIF":0.0,"publicationDate":"2024-08-08","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"142313050","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 0
On the Thickness Scaling of Ferroelectric Hafnia 论铁电哈夫纳的厚度缩放
IEEE Transactions on Materials for Electron Devices Pub Date : 2024-07-05 DOI: 10.1109/TMAT.2024.3423665
Suzanne Lancaster;Stefan Slesazeck;Thomas Mikolajick
{"title":"On the Thickness Scaling of Ferroelectric Hafnia","authors":"Suzanne Lancaster;Stefan Slesazeck;Thomas Mikolajick","doi":"10.1109/TMAT.2024.3423665","DOIUrl":"https://doi.org/10.1109/TMAT.2024.3423665","url":null,"abstract":"The discovery of ferroelectricity in hafnia has revolutionized the field and brought industry applications closer than ever. One of the most interesting aspects of hafnia compared to other ferroelectric materials is the possibility of scaling film thicknesses down to the 10 nm regime and even below. However, going significantly below 10 nm poses some challenges in terms of materials engineering. In this perspective paper, the topic of thickness scaling in ferroelectric hafnia will be discussed in terms of physical limits, current achievements and challenges, and potential applications in different device types.","PeriodicalId":100642,"journal":{"name":"IEEE Transactions on Materials for Electron Devices","volume":"1 ","pages":"36-48"},"PeriodicalIF":0.0,"publicationDate":"2024-07-05","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"141965495","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 0
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