Chip最新文献 - Book学术

Core-shell microdisk with InGaN/GaN quantum wells for dual-band whispering gallery mode lasing 具有InGaN/GaN量子阱的核壳微磁盘，用于双频窃窃廊模式激光

IF 7.1

Chip Pub Date : 2026-03-01 Epub Date: 2025-05-06 DOI: 10.1016/j.chip.2025.100150

Jianqi Dong , Zhuoming Liang , Chenguang He , Ningyang Liu , Zhitao Chen , Qiao Wang , Kang Zhang , Chunxiang Xu , Xingfu Wang

{"title":"Core-shell microdisk with InGaN/GaN quantum wells for dual-band whispering gallery mode lasing","authors":"Jianqi Dong , Zhuoming Liang , Chenguang He , Ningyang Liu , Zhitao Chen , Qiao Wang , Kang Zhang , Chunxiang Xu , Xingfu Wang","doi":"10.1016/j.chip.2025.100150","DOIUrl":"10.1016/j.chip.2025.100150","url":null,"abstract":"<div><div>The development of high-quality, stable, and cost-effective micro/nano dual-band lasing remains a crucial challenge for multifunctional applications. In this study, we demonstrated high-Q dual-band whispering gallery mode lasing in an independent core-shell microdisk, emitting both ultraviolet and blue lasing. The GaN-based microdisk with InGaN/GaN quantum wells served as the core, while a SiO<sub>2</sub> layer was deposited on the sidewalls to construct the core-shell microdisk. This independent structure was fabricated using the graphically epitaxial lift-off method, which effectively mitigates light leakage issues associated with the substrate and facilitates flexible device integration. Compared to the microdisk without a SiO<sub>2</sub> shell coating, the threshold of ultraviolet lasing in the core-shell microdisk was reduced by 1.6 times, the quality factor (Q-factor) was enhanced by 21.7%, and blue lasing was successfully achieved. The underlying physical mechanisms were thoroughly analyzed through steady-state and time-resolved photoluminescence, along with finite-difference time-domain simulations. Furthermore, cooling from 300 K to 100 K could significantly enhance the lasing performance, increasing the Q-factor by factors of 1.7 and 1.9 in the ultraviolet and blue bands, respectively. Additionally, due to thermal expansion and thermo-optical effects, the blue lasing mode exhibits a temperature-dependent wavelength shift with a slope of −0.007 nm/K. The generation and optimization of dual-band lasing within a single microcavity offer new opportunities for broadband optical communication, high-sensitivity multi-wavelength biosensing, multi-label biomedical imaging, and high-density optical storage.</div></div>","PeriodicalId":100244,"journal":{"name":"Chip","volume":"5 1","pages":"Article 100150"},"PeriodicalIF":7.1,"publicationDate":"2026-03-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"145738218","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}

引用次数: 0

Demonstration of acousto-optic modulation using an integrated Michelson interferometer 使用集成迈克尔逊干涉仪的声光调制演示

IF 7.1

Chip Pub Date : 2026-03-01 Epub Date: 2025-09-04 DOI: 10.1016/j.chip.2025.100164

Zhiqiang Yang , Siyi Wu , Jun Yue , Xingxu Liu , Yan Li , Zhengji Xu , Chao Lu , Zhaohui Li

引用次数: 0

A hybrid algorithm-driven approach for efficient design of terahertz molecule-specific metasensors 一种混合算法驱动的太赫兹分子特异超传感器高效设计方法

IF 7.1

Chip Pub Date : 2026-03-01 Epub Date: 2025-07-23 DOI: 10.1016/j.chip.2025.100162

Mian Wang , Ying Bao , Weiping Wang , Nan Li , Xiaoyan Hu , Tao Chu , Yibin Ying , Wendao Xu , Bo Xiong , Wei Ma

{"title":"A hybrid algorithm-driven approach for efficient design of terahertz molecule-specific metasensors","authors":"Mian Wang , Ying Bao , Weiping Wang , Nan Li , Xiaoyan Hu , Tao Chu , Yibin Ying , Wendao Xu , Bo Xiong , Wei Ma","doi":"10.1016/j.chip.2025.100162","DOIUrl":"10.1016/j.chip.2025.100162","url":null,"abstract":"<div><div>Metasurfaces, owing to their capacity to significantly enhance localized electric fields, have emerged as crucial tools for improving sensor sensitivity and enabling efficient biomolecular detection in the terahertz range. However, most terahertz metasensors in current research focus only on a single molecular absorption peak of the analyte, limiting their ability to distinguish substances with similar absorption peaks. Achieving metasensors that precisely match molecular fingerprint spectra requires simultaneously optimizing multiple resonance modes, which remains a considerable challenge. Here, we introduced a hybrid algorithm-driven metasensor design approach (HAMD) that combines deep learning diffusion model with a genetic algorithm to efficiently design highly integrated metasensors capable of matching multiple molecular absorption peaks. The deep learning model incorporates the attention mechanism, enabling not only accurate prediction of sharp spectra but also high-fidelity inverse design of multiresonant spectra. The genetic algorithm further refines the local characteristics, enhancing the detection accuracy of the metasensor. We also experimentally demonstrated the sensing performance of the designed metasensors in detecting isomers, where Rabi splitting is observed and fingerprints of isomers are clearly recognized. Our approach contributes to advancing the design of molecule-specific metasensors and promotes the application of machine learning in the design of other photonic devices.</div></div>","PeriodicalId":100244,"journal":{"name":"Chip","volume":"5 1","pages":"Article 100162"},"PeriodicalIF":7.1,"publicationDate":"2026-03-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"146077426","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}

引用次数: 0

Piezoelectric active air-cooling devices 压电式主动风冷装置

IF 7.1

Chip Pub Date : 2026-03-01 Epub Date: 2025-08-12 DOI: 10.1016/j.chip.2025.100163

Boyang Peng , Zhiran Yi , Yu Fan , Xiuxuan Li , Xingyu Wei , Chenxi Wang , Xuying Chen , Jinghui Xu , Wenming Zhang

{"title":"Piezoelectric active air-cooling devices","authors":"Boyang Peng , Zhiran Yi , Yu Fan , Xiuxuan Li , Xingyu Wei , Chenxi Wang , Xuying Chen , Jinghui Xu , Wenming Zhang","doi":"10.1016/j.chip.2025.100163","DOIUrl":"10.1016/j.chip.2025.100163","url":null,"abstract":"<div><div>As the power consumption and miniaturization of electronic devices increase, traditional liquid-cooling and fan systems struggle to meet the high heat flux requirements, especially in space-constrained devices. Piezoelectric effect can convert electrical energy into mechanical energy, which is commonly used for sensing and actuating, especially in microscale due to its high integration capacity. Recently, the piezoelectric micro fan has attracted more attention due to its efficient heat dissipation with advantages in low energy consumption, high performance, and compact design. The review introduces the working principles of piezoelectric fans or jet-based coolers, summarizes their structural designs and their performances, and discusses the pros and cons in practical applications, particularly focusing on the impact of piezoelectric moving component designs, cavity designs, and airflow apertures on cooling performance. Additionally, the review explores the layout optimization and installation configurations of piezoelectric coolers, discussing the best usage scenarios. Overall, piezoelectric cooling technologies show great potential for future electronic device heat management, especially for high-performance, low-power, miniaturized devices.</div></div>","PeriodicalId":100244,"journal":{"name":"Chip","volume":"5 1","pages":"Article 100163"},"PeriodicalIF":7.1,"publicationDate":"2026-03-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"147448881","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}

引用次数: 0

On-chip signal isolation based on mode orthogonality in plasmonic dual-mode transmission line 等离子体双模传输线中基于模式正交性的片上信号隔离

IF 7.1

Chip Pub Date : 2026-03-01 Epub Date: 2025-05-30 DOI: 10.1016/j.chip.2025.100153

Kai Lu , Jiemin Wu , Chenchen Li , Ming Wan , Shiqi Zhang , Hao Gao , Di Bao , Tie Jun Cui

引用次数: 0

Multifunctional graphene/organic transistor enabled by polyethyleneimine (PEIE)-induced charge tunneling and trapping effects 聚乙烯亚胺（PEIE）诱导的电荷隧穿和俘获效应使能多功能石墨烯/有机晶体管

IF 7.1

Chip Pub Date : 2026-03-01 Epub Date: 2025-06-18 DOI: 10.1016/j.chip.2025.100159

Lei Guo , Chao Han , Meiyu He , Xingwei Han , Jiayue Han , Jun Wang

引用次数: 0

Nanometer scale thermal measurement for next-generation electronics via scanning Joule expansion microscopy 扫描焦耳膨胀显微镜用于下一代电子器件的纳米级热测量

IF 7.1

Chip Pub Date : 2026-03-01 Epub Date: 2025-06-14 DOI: 10.1016/j.chip.2025.100156

Baoshi Qiao , Qihai Jiang , Zhiyao Zheng , Yang Xu , Huan Hu

{"title":"Nanometer scale thermal measurement for next-generation electronics via scanning Joule expansion microscopy","authors":"Baoshi Qiao , Qihai Jiang , Zhiyao Zheng , Yang Xu , Huan Hu","doi":"10.1016/j.chip.2025.100156","DOIUrl":"10.1016/j.chip.2025.100156","url":null,"abstract":"<div><div>As semiconductor devices continue to scale down, increasing power densities introduce significant thermal management challenges. High-resolution thermal imaging is crucial for understanding localized heating and ensuring device reliability. Scanning Joule expansion microscopy (SJEM) has emerged as a powerful technique for nanoscale thermal characterization, offering high spatial and temperature resolution without the need for specialized thermal sensors. This review explores SJEM’s fundamental principles, historical advancements, and critical applications, including thermoelectric effects, current crowding, and conductive filament analysis. We further discuss the challenges and future opportunities in SJEM, such as enhancing the mechanistic understanding of thermal strain, developing specialized atomic force microscope probes, enabling real-time probe manipulation, integrating AI-driven analysis, and extending SJEM to low-temperature physics studies. As semiconductor technology advances, SJEM is expected to play an essential role in thermal failure analysis, nanoelectronics, and nanoscale energy transport research.</div></div>","PeriodicalId":100244,"journal":{"name":"Chip","volume":"5 1","pages":"Article 100156"},"PeriodicalIF":7.1,"publicationDate":"2026-03-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"147449000","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}

引用次数: 0

Fault modeling, testing, and repair for chiplet interconnects 小片互连的故障建模、测试和修复

IF 7.1

Chip Pub Date : 2026-03-01 Epub Date: 2025-06-21 DOI: 10.1016/j.chip.2025.100160

Xiaoting Liu , Xiaojun Zhou , Chengcheng Fu , Dazhi Yang , Suning Ji , Nan Zhang , Dapeng Yan , Zixuan Wang , Yufeng Guo , Lu Liu , Zhikuang Cai

{"title":"Fault modeling, testing, and repair for chiplet interconnects","authors":"Xiaoting Liu , Xiaojun Zhou , Chengcheng Fu , Dazhi Yang , Suning Ji , Nan Zhang , Dapeng Yan , Zixuan Wang , Yufeng Guo , Lu Liu , Zhikuang Cai","doi":"10.1016/j.chip.2025.100160","DOIUrl":"10.1016/j.chip.2025.100160","url":null,"abstract":"<div><div>With the continuous advancement of semiconductor technology, chiplet technology has gained importance due to its significant advantages in enhancing performance, reducing power consumption, and saving space. However, vertical interconnect structures in 3D integrated circuits (ICs), such as through-silicon via (TSV) and inter-layer via (ILV), present unprecedented challenges in modeling, testing, and repair. This paper focuses on four modules: modeling for faults, TSV testing, ILV testing, and repair strategies. First, different methods of establishing TSV fault models and discussions on the influence of different defects on performance are introduced. Then, the challenges in detecting various faults of TSVs, such as short, delay faults, and crosstalk, and the presented corresponding testing methods are analyzed. Meanwhile, some electric parameter test methods are also discussed. In the ILV testing technology, the difficulties caused by the small size and high density of ILVs, which make traditional testing methods less effective, are discussed. Various testing and optimization methods are explored, aimed at improving fault coverage while minimizing testing time and hardware overhead. Moreover, repair strategies based on redundant TSVs are analyzed in this paper. Redundant repair architectures, including ring-based, honeycomb, and so on, are introduced. Additionally, the paper explores dynamic real-time fault-repair methods, such as time-division multiple access and online repair technologies, which aim to enhance the reliability and lifespan of 3D ICs. In conclusion, a comprehensive solution for the testing of 3D chiplet is presented.</div></div>","PeriodicalId":100244,"journal":{"name":"Chip","volume":"5 1","pages":"Article 100160"},"PeriodicalIF":7.1,"publicationDate":"2026-03-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"147421360","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}

引用次数: 0

Through-silicon via advanced packaging technology and its radio frequency applications 通硅通过先进的封装技术及其在射频方面的应用

IF 7.1

Chip Pub Date : 2026-03-01 Epub Date: 2025-06-21 DOI: 10.1016/j.chip.2025.100158

Hongyu Yi , Jianyu Zhu , Jinwei Fan , Dingguan Wang , Junfa Mao

{"title":"Through-silicon via advanced packaging technology and its radio frequency applications","authors":"Hongyu Yi , Jianyu Zhu , Jinwei Fan , Dingguan Wang , Junfa Mao","doi":"10.1016/j.chip.2025.100158","DOIUrl":"10.1016/j.chip.2025.100158","url":null,"abstract":"<div><div>Through-silicon via (TSV) technology is widely recognized as one of the most promising interconnect solutions, owing to its ability to dramatically shorten interconnect paths, reduce package dimensions, decrease power consumption, and enhance device performance. Conventional TSVs embedded in low-resistivity silicon interposers are primarily employed in high-performance computing and memory stacking applications. Their application in radio frequency (RF) domains is limited due to severe high-frequency signal losses and TSV-to-TSV crosstalk. Currently, extensive research efforts have been undertaken to address these limitations. This review provides a comprehensive overview of recent advances in the fabrication processes of conventional TSVs, and summarizes the applications and challenges of conventional TSV technique in RF circuits. Furthermore, it overviews the recently developing coaxial TSV designs for RF applications, discussing in detail their fabrication processes, simulation studies, and design optimizations. Finally, it provides an outlook on the future development of TSVs in RF integrated microsystems.</div></div>","PeriodicalId":100244,"journal":{"name":"Chip","volume":"5 1","pages":"Article 100158"},"PeriodicalIF":7.1,"publicationDate":"2026-03-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"147421358","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}

引用次数: 0

Two-dimensional materials-based artificial neuron devices and their working mechanism 基于二维材料的人工神经元装置及其工作机理

IF 7.1

Chip Pub Date : 2026-03-01 Epub Date: 2025-07-11 DOI: 10.1016/j.chip.2025.100161

Yangwu Wu , Yijia Wu , Huimin Li , Song Liu

{"title":"Two-dimensional materials-based artificial neuron devices and their working mechanism","authors":"Yangwu Wu , Yijia Wu , Huimin Li , Song Liu","doi":"10.1016/j.chip.2025.100161","DOIUrl":"10.1016/j.chip.2025.100161","url":null,"abstract":"<div><div>The rapid development of artificial intelligence and robotics has created increased demands for the efficiency and performance of computer hardware. Neuromorphic computing provides a platform to process vast datasets with low power consumption, addressing the critical bottlenecks in conventional computing architectures and representing a promising approach for bridging biological systems with machines. Recent advances reported that synaptic devices based on two-dimensional (2D) layered semiconductor materials have demonstrated excellent biomimetic properties and significance for neuromorphic applications. Moreover, integrating biomimetic sensory systems with 2D materials-based synaptic devices that achieve signal sensing and spike-based information processing has received significant attention from researchers. In this review, we provide a comprehensive overview of biomimetic sensory neural systems, focusing on 2D material-based devices and their operational mechanisms. First, we provide a brief introduction to the structure of the artificial synaptic device. Then, we outline fundamental biological sensory principles and advanced artificial sensor system design, including visual, tactile, smell, taste, and auditory functions. Next, we summarize the use of bio-inspired artificial perception systems for information processing. Finally, we discuss challenges and directions for development of future artificial sensor systems.</div></div>","PeriodicalId":100244,"journal":{"name":"Chip","volume":"5 1","pages":"Article 100161"},"PeriodicalIF":7.1,"publicationDate":"2026-03-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"145685874","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}

引用次数: 0