ieeexplore最新文献

筛选
英文 中文
Author's Guide for IEEE Electrical Insulation Magazine Technical Articles IEEE电气绝缘杂志技术文章作者指南
IF 2.6 4区 工程技术
IEEE Electrical Insulation Magazine Pub Date : 2025-06-17 DOI: 10.1109/MEI.2025.11039196
{"title":"Author's Guide for IEEE Electrical Insulation Magazine Technical Articles","authors":"","doi":"10.1109/MEI.2025.11039196","DOIUrl":"https://doi.org/10.1109/MEI.2025.11039196","url":null,"abstract":"","PeriodicalId":444,"journal":{"name":"IEEE Electrical Insulation Magazine","volume":"41 4","pages":"C3-C3"},"PeriodicalIF":2.6,"publicationDate":"2025-06-17","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"https://ieeexplore.ieee.org/stamp/stamp.jsp?tp=&arnumber=11039196","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"144308232","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":4,"RegionCategory":"工程技术","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"OA","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 0
IEEE Electrical Insulation Magazine, a Publication of DEIS IEEE电气绝缘杂志,DEIS的出版物
IF 2.6 4区 工程技术
IEEE Electrical Insulation Magazine Pub Date : 2025-06-17 DOI: 10.1109/MEI.2025.11039230
{"title":"IEEE Electrical Insulation Magazine, a Publication of DEIS","authors":"","doi":"10.1109/MEI.2025.11039230","DOIUrl":"https://doi.org/10.1109/MEI.2025.11039230","url":null,"abstract":"","PeriodicalId":444,"journal":{"name":"IEEE Electrical Insulation Magazine","volume":"41 4","pages":"C2-C2"},"PeriodicalIF":2.6,"publicationDate":"2025-06-17","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"https://ieeexplore.ieee.org/stamp/stamp.jsp?tp=&arnumber=11039230","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"144308428","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":4,"RegionCategory":"工程技术","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"OA","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 0
Special Issue on Plenary, Invited, Workshop on Pulsed Power for Fusion from PPPS-2025 来自PPPS-2025的聚变脉冲功率研讨会全体会议特刊
IF 1.3 4区 物理与天体物理
IEEE Transactions on Plasma Science Pub Date : 2025-06-17 DOI: 10.1109/TPS.2025.3574772
{"title":"Special Issue on Plenary, Invited, Workshop on Pulsed Power for Fusion from PPPS-2025","authors":"","doi":"10.1109/TPS.2025.3574772","DOIUrl":"https://doi.org/10.1109/TPS.2025.3574772","url":null,"abstract":"","PeriodicalId":450,"journal":{"name":"IEEE Transactions on Plasma Science","volume":"53 6","pages":"1428-1428"},"PeriodicalIF":1.3,"publicationDate":"2025-06-17","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"https://ieeexplore.ieee.org/stamp/stamp.jsp?tp=&arnumber=11037929","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"144308471","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":4,"RegionCategory":"物理与天体物理","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"OA","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 0
IEEE Sensors Council IEEE传感器委员会
IF 4.3 2区 综合性期刊
IEEE Sensors Journal Pub Date : 2025-06-16 DOI: 10.1109/JSEN.2025.3575674
{"title":"IEEE Sensors Council","authors":"","doi":"10.1109/JSEN.2025.3575674","DOIUrl":"https://doi.org/10.1109/JSEN.2025.3575674","url":null,"abstract":"","PeriodicalId":447,"journal":{"name":"IEEE Sensors Journal","volume":"25 12","pages":"C3-C3"},"PeriodicalIF":4.3,"publicationDate":"2025-06-16","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"https://ieeexplore.ieee.org/stamp/stamp.jsp?tp=&arnumber=11037307","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"144299309","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":2,"RegionCategory":"综合性期刊","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"OA","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 0
Designing RF Sensing Transmission Rates to Counter Nonuniformity in Wi-Fi Packet Propagation 设计射频传感传输速率以对抗Wi-Fi分组传播中的不均匀性
IF 4.3 2区 综合性期刊
IEEE Sensors Journal Pub Date : 2025-06-11 DOI: 10.1109/JSEN.2025.3572707
Aryan Sharma;Deepak Mishra;Sanjay K. Jha;Aruna Seneviratne
{"title":"Designing RF Sensing Transmission Rates to Counter Nonuniformity in Wi-Fi Packet Propagation","authors":"Aryan Sharma;Deepak Mishra;Sanjay K. Jha;Aruna Seneviratne","doi":"10.1109/JSEN.2025.3572707","DOIUrl":"https://doi.org/10.1109/JSEN.2025.3572707","url":null,"abstract":"The rapid proliferation of radio frequency (RF) devices and advancements in communication standards, such as 6G and 802.11bf has facilitated the emergence of new sensing paradigms. These standards not only boost communications throughput but also enable RF signals to be processed using advanced machine learning (ML) pipelines to uncover information about the physical environment. This has received tremendous attention, particularly in the Wi-Fi domain, where commodity devices have been used to monitor the environment and human activities using channel state information (CSI) data harvested from Wi-Fi packets. As is the case with any sensor system, the Wi-Fi sensing requires sufficiently frequent CSI measurements. This has been a challenge in the prior work, since the half-duplex nature of Wi-Fi and channel access protocols has meant that transmission systems can be undermined by third parties. This article is hence motivated to investigate transmission characteristics in the context of Wi-Fi sensing to understand it’s robustness and reliability. By developing and testing a Wi-Fi-based movement sensing system, we provide nontrivial insights into the nonuniformity of CSI data. We further investigate this by comprehensively analyzing the propagation characteristics of Wi-Fi packets. Through the probability distribution fitting and statistical analysis, we demonstrate that the nonuniformity of CSI is worse at lower Wi-Fi packet rates. To compensate for this, we develop a regression model that facilitates the design of transmission rates in Wi-Fi sensing systems to maintain the CSI uniformity within user-defined tolerances. These advancements bridge the gap toward realizing robust Wi-Fi sensing deployments in practical environments.","PeriodicalId":447,"journal":{"name":"IEEE Sensors Journal","volume":"25 13","pages":"23326-23340"},"PeriodicalIF":4.3,"publicationDate":"2025-06-11","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"144550088","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":2,"RegionCategory":"综合性期刊","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 0
Exploration of the exciting world of multifunctional oxide-based electronic devices: from material to system-level applications 探索令人兴奋的多功能氧化物基电子器件世界:从材料到系统级应用
IF 2.5 3区 工程技术
IEEE Transactions on Device and Materials Reliability Pub Date : 2025-06-09 DOI: 10.1109/TDMR.2025.3575823
{"title":"Exploration of the exciting world of multifunctional oxide-based electronic devices: from material to system-level applications","authors":"","doi":"10.1109/TDMR.2025.3575823","DOIUrl":"https://doi.org/10.1109/TDMR.2025.3575823","url":null,"abstract":"","PeriodicalId":448,"journal":{"name":"IEEE Transactions on Device and Materials Reliability","volume":"25 2","pages":"355-356"},"PeriodicalIF":2.5,"publicationDate":"2025-06-09","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"https://ieeexplore.ieee.org/stamp/stamp.jsp?tp=&arnumber=11028628","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"144243809","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":3,"RegionCategory":"工程技术","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"OA","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 0
Announcing an IEEE/Optica Publishing Group Journal of Lightwave Technology Special Issue on: OFS-29 宣布IEEE/Optica出版集团光波技术杂志特刊:OFS-29
IF 2.5 3区 工程技术
IEEE Transactions on Device and Materials Reliability Pub Date : 2025-06-09 DOI: 10.1109/TDMR.2025.3575821
{"title":"Announcing an IEEE/Optica Publishing Group Journal of Lightwave Technology Special Issue on: OFS-29","authors":"","doi":"10.1109/TDMR.2025.3575821","DOIUrl":"https://doi.org/10.1109/TDMR.2025.3575821","url":null,"abstract":"","PeriodicalId":448,"journal":{"name":"IEEE Transactions on Device and Materials Reliability","volume":"25 2","pages":"354-354"},"PeriodicalIF":2.5,"publicationDate":"2025-06-09","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"https://ieeexplore.ieee.org/stamp/stamp.jsp?tp=&arnumber=11028133","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"144243811","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":3,"RegionCategory":"工程技术","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"OA","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 0
Call for Nominations for Editor-in-Chief IEEE Electron Device Letters IEEE电子设备通讯总编辑提名
IF 2.5 3区 工程技术
IEEE Transactions on Device and Materials Reliability Pub Date : 2025-06-09 DOI: 10.1109/TDMR.2025.3558657
{"title":"Call for Nominations for Editor-in-Chief IEEE Electron Device Letters","authors":"","doi":"10.1109/TDMR.2025.3558657","DOIUrl":"https://doi.org/10.1109/TDMR.2025.3558657","url":null,"abstract":"","PeriodicalId":448,"journal":{"name":"IEEE Transactions on Device and Materials Reliability","volume":"25 2","pages":"353-353"},"PeriodicalIF":2.5,"publicationDate":"2025-06-09","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"https://ieeexplore.ieee.org/stamp/stamp.jsp?tp=&arnumber=11028627","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"144243657","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":3,"RegionCategory":"工程技术","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"OA","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 0
IEEE Transactions on Device and Materials Reliability Information for Authors IEEE器件与材料可靠性信息学报
IF 2.5 3区 工程技术
IEEE Transactions on Device and Materials Reliability Pub Date : 2025-06-09 DOI: 10.1109/TDMR.2025.3575830
{"title":"IEEE Transactions on Device and Materials Reliability Information for Authors","authors":"","doi":"10.1109/TDMR.2025.3575830","DOIUrl":"https://doi.org/10.1109/TDMR.2025.3575830","url":null,"abstract":"","PeriodicalId":448,"journal":{"name":"IEEE Transactions on Device and Materials Reliability","volume":"25 2","pages":"C3-C3"},"PeriodicalIF":2.5,"publicationDate":"2025-06-09","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"https://ieeexplore.ieee.org/stamp/stamp.jsp?tp=&arnumber=11028625","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"144243674","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":3,"RegionCategory":"工程技术","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"OA","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 0
Reliability of Advanced Nodes 高级节点可靠性
IF 2.5 3区 工程技术
IEEE Transactions on Device and Materials Reliability Pub Date : 2025-06-09 DOI: 10.1109/TDMR.2025.3575822
{"title":"Reliability of Advanced Nodes","authors":"","doi":"10.1109/TDMR.2025.3575822","DOIUrl":"https://doi.org/10.1109/TDMR.2025.3575822","url":null,"abstract":"","PeriodicalId":448,"journal":{"name":"IEEE Transactions on Device and Materials Reliability","volume":"25 2","pages":"359-360"},"PeriodicalIF":2.5,"publicationDate":"2025-06-09","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"https://ieeexplore.ieee.org/stamp/stamp.jsp?tp=&arnumber=11028626","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"144243922","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":3,"RegionCategory":"工程技术","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"OA","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 0
0
×
引用
GB/T 7714-2015
复制
MLA
复制
APA
复制
导出至
BibTeX EndNote RefMan NoteFirst NoteExpress
×
提示
您的信息不完整,为了账户安全,请先补充。
现在去补充
×
提示
您因"违规操作"
具体请查看互助需知
我知道了
×
提示
确定
请完成安全验证×
相关产品
×
本文献相关产品
联系我们:info@booksci.cn Book学术提供免费学术资源搜索服务,方便国内外学者检索中英文文献。致力于提供最便捷和优质的服务体验。 Copyright © 2023 布克学术 All rights reserved.
京ICP备2023020795号-1
ghs 京公网安备 11010802042870号
Book学术文献互助
Book学术文献互助群
群 号:604180095
Book学术官方微信