{"title":"Special Issue on Plenary, Invited, Workshop on Pulsed Power for Fusion from PPPS-2025","authors":"","doi":"10.1109/TPS.2025.3574772","DOIUrl":"https://doi.org/10.1109/TPS.2025.3574772","url":null,"abstract":"","PeriodicalId":450,"journal":{"name":"IEEE Transactions on Plasma Science","volume":"53 6","pages":"1428-1428"},"PeriodicalIF":1.3,"publicationDate":"2025-06-17","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"https://ieeexplore.ieee.org/stamp/stamp.jsp?tp=&arnumber=11037929","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"144308471","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":4,"RegionCategory":"物理与天体物理","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"OA","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
Aryan Sharma;Deepak Mishra;Sanjay K. Jha;Aruna Seneviratne
{"title":"Designing RF Sensing Transmission Rates to Counter Nonuniformity in Wi-Fi Packet Propagation","authors":"Aryan Sharma;Deepak Mishra;Sanjay K. Jha;Aruna Seneviratne","doi":"10.1109/JSEN.2025.3572707","DOIUrl":"https://doi.org/10.1109/JSEN.2025.3572707","url":null,"abstract":"The rapid proliferation of radio frequency (RF) devices and advancements in communication standards, such as 6G and 802.11bf has facilitated the emergence of new sensing paradigms. These standards not only boost communications throughput but also enable RF signals to be processed using advanced machine learning (ML) pipelines to uncover information about the physical environment. This has received tremendous attention, particularly in the Wi-Fi domain, where commodity devices have been used to monitor the environment and human activities using channel state information (CSI) data harvested from Wi-Fi packets. As is the case with any sensor system, the Wi-Fi sensing requires sufficiently frequent CSI measurements. This has been a challenge in the prior work, since the half-duplex nature of Wi-Fi and channel access protocols has meant that transmission systems can be undermined by third parties. This article is hence motivated to investigate transmission characteristics in the context of Wi-Fi sensing to understand it’s robustness and reliability. By developing and testing a Wi-Fi-based movement sensing system, we provide nontrivial insights into the nonuniformity of CSI data. We further investigate this by comprehensively analyzing the propagation characteristics of Wi-Fi packets. Through the probability distribution fitting and statistical analysis, we demonstrate that the nonuniformity of CSI is worse at lower Wi-Fi packet rates. To compensate for this, we develop a regression model that facilitates the design of transmission rates in Wi-Fi sensing systems to maintain the CSI uniformity within user-defined tolerances. These advancements bridge the gap toward realizing robust Wi-Fi sensing deployments in practical environments.","PeriodicalId":447,"journal":{"name":"IEEE Sensors Journal","volume":"25 13","pages":"23326-23340"},"PeriodicalIF":4.3,"publicationDate":"2025-06-11","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"144550088","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":2,"RegionCategory":"综合性期刊","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
{"title":"Exploration of the exciting world of multifunctional oxide-based electronic devices: from material to system-level applications","authors":"","doi":"10.1109/TDMR.2025.3575823","DOIUrl":"https://doi.org/10.1109/TDMR.2025.3575823","url":null,"abstract":"","PeriodicalId":448,"journal":{"name":"IEEE Transactions on Device and Materials Reliability","volume":"25 2","pages":"355-356"},"PeriodicalIF":2.5,"publicationDate":"2025-06-09","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"https://ieeexplore.ieee.org/stamp/stamp.jsp?tp=&arnumber=11028628","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"144243809","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":3,"RegionCategory":"工程技术","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"OA","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
{"title":"Announcing an IEEE/Optica Publishing Group Journal of Lightwave Technology Special Issue on: OFS-29","authors":"","doi":"10.1109/TDMR.2025.3575821","DOIUrl":"https://doi.org/10.1109/TDMR.2025.3575821","url":null,"abstract":"","PeriodicalId":448,"journal":{"name":"IEEE Transactions on Device and Materials Reliability","volume":"25 2","pages":"354-354"},"PeriodicalIF":2.5,"publicationDate":"2025-06-09","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"https://ieeexplore.ieee.org/stamp/stamp.jsp?tp=&arnumber=11028133","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"144243811","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":3,"RegionCategory":"工程技术","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"OA","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
{"title":"Call for Nominations for Editor-in-Chief IEEE Electron Device Letters","authors":"","doi":"10.1109/TDMR.2025.3558657","DOIUrl":"https://doi.org/10.1109/TDMR.2025.3558657","url":null,"abstract":"","PeriodicalId":448,"journal":{"name":"IEEE Transactions on Device and Materials Reliability","volume":"25 2","pages":"353-353"},"PeriodicalIF":2.5,"publicationDate":"2025-06-09","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"https://ieeexplore.ieee.org/stamp/stamp.jsp?tp=&arnumber=11028627","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"144243657","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":3,"RegionCategory":"工程技术","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"OA","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
{"title":"IEEE Transactions on Device and Materials Reliability Information for Authors","authors":"","doi":"10.1109/TDMR.2025.3575830","DOIUrl":"https://doi.org/10.1109/TDMR.2025.3575830","url":null,"abstract":"","PeriodicalId":448,"journal":{"name":"IEEE Transactions on Device and Materials Reliability","volume":"25 2","pages":"C3-C3"},"PeriodicalIF":2.5,"publicationDate":"2025-06-09","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"https://ieeexplore.ieee.org/stamp/stamp.jsp?tp=&arnumber=11028625","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"144243674","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":3,"RegionCategory":"工程技术","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"OA","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
{"title":"Reliability of Advanced Nodes","authors":"","doi":"10.1109/TDMR.2025.3575822","DOIUrl":"https://doi.org/10.1109/TDMR.2025.3575822","url":null,"abstract":"","PeriodicalId":448,"journal":{"name":"IEEE Transactions on Device and Materials Reliability","volume":"25 2","pages":"359-360"},"PeriodicalIF":2.5,"publicationDate":"2025-06-09","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"https://ieeexplore.ieee.org/stamp/stamp.jsp?tp=&arnumber=11028626","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"144243922","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":3,"RegionCategory":"工程技术","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"OA","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}