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IEEE Journal of Photovoltaics Publication Information IEEE光电杂志出版信息
IF 2.5 3区 工程技术
IEEE Journal of Photovoltaics Pub Date : 2024-12-24 DOI: 10.1109/JPHOTOV.2024.3513575
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引用次数: 0
TechRxiv: Share Your Preprint Research with the World! techxiv：与世界分享你的预印本研究！
IF 2.5 3区 工程技术
IEEE Transactions on Device and Materials Reliability Pub Date : 2024-12-23 DOI: 10.1109/TDMR.2024.3520737
{"title":"TechRxiv: Share Your Preprint Research with the World!","authors":"","doi":"10.1109/TDMR.2024.3520737","DOIUrl":"https://doi.org/10.1109/TDMR.2024.3520737","url":null,"abstract":"","PeriodicalId":448,"journal":{"name":"IEEE Transactions on Device and Materials Reliability","volume":"24 4","pages":"664-664"},"PeriodicalIF":2.5,"publicationDate":"2024-12-23","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"https://ieeexplore.ieee.org/stamp/stamp.jsp?tp=&arnumber=10812357","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"142875094","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":3,"RegionCategory":"工程技术","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"OA","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 0
IEEE Transactions on Device and Materials Reliability Publication Information IEEE器件与材料可靠性学报
IF 2.5 3区 工程技术
IEEE Transactions on Device and Materials Reliability Pub Date : 2024-12-23 DOI: 10.1109/TDMR.2024.3516717
{"title":"IEEE Transactions on Device and Materials Reliability Publication Information","authors":"","doi":"10.1109/TDMR.2024.3516717","DOIUrl":"https://doi.org/10.1109/TDMR.2024.3516717","url":null,"abstract":"","PeriodicalId":448,"journal":{"name":"IEEE Transactions on Device and Materials Reliability","volume":"24 4","pages":"C2-C2"},"PeriodicalIF":2.5,"publicationDate":"2024-12-23","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"https://ieeexplore.ieee.org/stamp/stamp.jsp?tp=&arnumber=10812356","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"142875098","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":3,"RegionCategory":"工程技术","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"OA","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 0
TDMR December 2024 Editorial TDMR 2024年12月社论
IF 2.5 3区 工程技术
IEEE Transactions on Device and Materials Reliability Pub Date : 2024-12-23 DOI: 10.1109/TDMR.2024.3508312
Edmundo Gutierrez
{"title":"TDMR December 2024 Editorial","authors":"Edmundo Gutierrez","doi":"10.1109/TDMR.2024.3508312","DOIUrl":"https://doi.org/10.1109/TDMR.2024.3508312","url":null,"abstract":"","PeriodicalId":448,"journal":{"name":"IEEE Transactions on Device and Materials Reliability","volume":"24 4","pages":"470-470"},"PeriodicalIF":2.5,"publicationDate":"2024-12-23","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"https://ieeexplore.ieee.org/stamp/stamp.jsp?tp=&arnumber=10812355","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"142875095","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":3,"RegionCategory":"工程技术","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"OA","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 0
IEEE Transactions on Device and Materials Reliability Information for Authors IEEE器件与材料可靠性信息学报
IF 2.5 3区 工程技术
IEEE Transactions on Device and Materials Reliability Pub Date : 2024-12-23 DOI: 10.1109/TDMR.2024.3516718
{"title":"IEEE Transactions on Device and Materials Reliability Information for Authors","authors":"","doi":"10.1109/TDMR.2024.3516718","DOIUrl":"https://doi.org/10.1109/TDMR.2024.3516718","url":null,"abstract":"","PeriodicalId":448,"journal":{"name":"IEEE Transactions on Device and Materials Reliability","volume":"24 4","pages":"C3-C3"},"PeriodicalIF":2.5,"publicationDate":"2024-12-23","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"https://ieeexplore.ieee.org/stamp/stamp.jsp?tp=&arnumber=10812196","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"142875093","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":3,"RegionCategory":"工程技术","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"OA","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 0
Blank Page 空白页
IF 2.5 3区 工程技术
IEEE Transactions on Device and Materials Reliability Pub Date : 2024-12-23 DOI: 10.1109/TDMR.2024.3516719
{"title":"Blank Page","authors":"","doi":"10.1109/TDMR.2024.3516719","DOIUrl":"https://doi.org/10.1109/TDMR.2024.3516719","url":null,"abstract":"","PeriodicalId":448,"journal":{"name":"IEEE Transactions on Device and Materials Reliability","volume":"24 4","pages":"C4-C4"},"PeriodicalIF":2.5,"publicationDate":"2024-12-23","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"https://ieeexplore.ieee.org/stamp/stamp.jsp?tp=&arnumber=10812197","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"142875072","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":3,"RegionCategory":"工程技术","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"OA","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 0
Editorial on EOS EOS评论
IF 2.5 3区 工程技术
IEEE Transactions on Device and Materials Reliability Pub Date : 2024-12-23 DOI: 10.1109/TDMR.2024.3507412
Ming-Dou Ker
{"title":"Editorial on EOS","authors":"Ming-Dou Ker","doi":"10.1109/TDMR.2024.3507412","DOIUrl":"https://doi.org/10.1109/TDMR.2024.3507412","url":null,"abstract":"","PeriodicalId":448,"journal":{"name":"IEEE Transactions on Device and Materials Reliability","volume":"24 4","pages":"471-471"},"PeriodicalIF":2.5,"publicationDate":"2024-12-23","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"https://ieeexplore.ieee.org/stamp/stamp.jsp?tp=&arnumber=10812359","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"142875099","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":3,"RegionCategory":"工程技术","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"OA","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 0
Call for Nominations for Editor-in-Chief 征集总编辑提名
IF 2.5 3区 工程技术
IEEE Transactions on Device and Materials Reliability Pub Date : 2024-12-23 DOI: 10.1109/TDMR.2024.3513737
{"title":"Call for Nominations for Editor-in-Chief","authors":"","doi":"10.1109/TDMR.2024.3513737","DOIUrl":"https://doi.org/10.1109/TDMR.2024.3513737","url":null,"abstract":"","PeriodicalId":448,"journal":{"name":"IEEE Transactions on Device and Materials Reliability","volume":"24 4","pages":"663-663"},"PeriodicalIF":2.5,"publicationDate":"2024-12-23","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"https://ieeexplore.ieee.org/stamp/stamp.jsp?tp=&arnumber=10812200","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"142875145","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":3,"RegionCategory":"工程技术","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"OA","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 0
Microwave-Assisted Synthesis and Characterization of Iron Oxide Nanoparticles for Advanced Biomedical Sensing Applications 用于先进生物医学传感应用的氧化铁纳米颗粒的微波辅助合成和表征
IF 1.8
IEEE Open Journal of Nanotechnology Pub Date : 2024-12-20 DOI: 10.1109/OJNANO.2024.3514866
Vivek Pratap Singh;Chandra Prakash Singh;Santosh Kumar;Saurabh Kumar Pandey;Deepak Punetha
{"title":"Microwave-Assisted Synthesis and Characterization of Iron Oxide Nanoparticles for Advanced Biomedical Sensing Applications","authors":"Vivek Pratap Singh;Chandra Prakash Singh;Santosh Kumar;Saurabh Kumar Pandey;Deepak Punetha","doi":"10.1109/OJNANO.2024.3514866","DOIUrl":"https://doi.org/10.1109/OJNANO.2024.3514866","url":null,"abstract":"This study focuses on the synthesis and characterization of Superparamagnetic Iron Oxide Nanoparticles (IONPs) with potential biomedical and sensing applications. These nanoparticles are in high demand for their biocompatibility, biodegradability, and superparamagnetic properties. In contrast to traditional high-temperature synthesis methods, microwave-assisted co-precipitation provides notable benefits, such as improved superparamagnetic characteristics, a high surface-to-volume ratio, large surface area, and simplified separation processes. The synthesis process utilized microwave-assisted co-precipitation, and a range of characterization techniques, including XRD, FESEM, VSM, FTIR, and UV-spectroscopy, were employed to assess the properties of the iron oxide nanoparticles. Analysis of the XRD, FTIR, and UV-spectroscopy results confirmed the formation of IONPs, predominantly comprising magnetite (Fe3O4). The microwave-synthesized IONPs exhibited superparamagnetic behavior, featuring an average crystallite size of 9 nm and robust saturation magnetization values (up to 68 emu/g). These attributes render them highly suitable for applications such as MRI contrast agents, thermal mediators in hyperthermia, drug delivery systems, and advanced sensor technologies, including magnetic sensing and biosensing applications, where their high magnetic responsiveness and surface functionalization capabilities can be effectively leveraged.","PeriodicalId":446,"journal":{"name":"IEEE Open Journal of Nanotechnology","volume":"6 ","pages":"10-15"},"PeriodicalIF":1.8,"publicationDate":"2024-12-20","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"https://ieeexplore.ieee.org/stamp/stamp.jsp?tp=&arnumber=10810447","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"142938088","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"OA","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 0
Design and Microfabrication of Transition Waveguides for Traveling Wave Tubes (TWTs) 行波管过渡波导的设计与微加工
IF 1.3 4区 物理与天体物理
IEEE Transactions on Plasma Science Pub Date : 2024-12-19 DOI: 10.1109/TPS.2024.3510789
Yongtao Li;Xiaoguang Ma;Hanyan Li;Nan Li;Jinjun Feng
{"title":"Design and Microfabrication of Transition Waveguides for Traveling Wave Tubes (TWTs)","authors":"Yongtao Li;Xiaoguang Ma;Hanyan Li;Nan Li;Jinjun Feng","doi":"10.1109/TPS.2024.3510789","DOIUrl":"https://doi.org/10.1109/TPS.2024.3510789","url":null,"abstract":"This study aims to design and fabricate transition waveguides operating at a frequency range of 80–110 GHz using aluminum die electroforming. The CST software is used to calculate the relationship between the transition waveguide length and the transmission properties of the transition waveguide. The return loss (<inline-formula> <tex-math>$S_{11}$ </tex-math></inline-formula>) of the transition waveguides is less than −20 dB over the passing band. Aluminum die electroforming is chosen to microfabricate them, and the effects of processing parameters on the quality of the electroformed copper lay have been investigated, such as the electrolyte solution and electroforming current. Dimensional accuracy of the completed transition waveguide is about <inline-formula> <tex-math>$pm 5~mu $ </tex-math></inline-formula> m. The measurement of <inline-formula> <tex-math>$S_{11}$ </tex-math></inline-formula> parameter has been carried out, and test finding shows that the measured <inline-formula> <tex-math>$S_{11}$ </tex-math></inline-formula> is between −25 and −20 dB.","PeriodicalId":450,"journal":{"name":"IEEE Transactions on Plasma Science","volume":"52 11","pages":"5487-5492"},"PeriodicalIF":1.3,"publicationDate":"2024-12-19","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"142993753","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":4,"RegionCategory":"物理与天体物理","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 0
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