基于深度可分离卷积和FECAM注意机制的表面肌电信号轻量手势识别

IF 4.3 2区 综合性期刊 Q1 ENGINEERING, ELECTRICAL & ELECTRONIC
Haozhu Wang;Du Jiang;Juntong Yun;Li Huang;Yuanmin Xie;Baojia Chen;Meng Jia;Ying Sun
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引用次数: 0

摘要

表面肌电图(sEMG)是一种很有前途的无创手势识别方法,用于人机交互和康复。然而,现有的高精度模型通常会产生高计算成本,从而限制了实时部署。为了解决这个问题,我们提出了FSGR-Net,这是一个使用小卷积堆叠策略和Lite-Fusion块重建ResNet50的轻量级残差网络。Lite-Fusion Block集成了深度可分离卷积(DSC)、幽灵卷积(GC)和信道压缩扩展机制,以减少冗余。特别是,在DSC层之后引入了频率增强通道注意机制(FECAM),以增强区分特征,同时减轻吉布斯现象。在此基础上,采用时移与掩码相结合的数据增强策略来提高泛化能力。对NinaPro DB1、DB5和SC-Myo数据集的评估表明,FSGR-Net在0.85 M参数和0.22 G FLOPs的情况下,准确率分别达到93.17%、87.83%和93.35%,显示出在移动和低功耗可穿戴系统中部署的强大潜力。
本文章由计算机程序翻译,如有差异,请以英文原文为准。
Lightweight Gesture Recognition Based on Depthwise Separable Convolution and FECAM Attention Mechanism for sEMG
Surface electromyography (sEMG) is a promising approach for noninvasive gesture recognition in human–computer interaction and rehabilitation. However, existing high-accuracy models often incur high-computational costs, thereby limiting real-time deployment. To address this, we propose FSGR-Net, a lightweight residual network that reconstructs ResNet50 using a small-convolution stacking strategy and a Lite-Fusion Block. The Lite-Fusion Block integrates depthwise separable convolution (DSC), ghost convolution (GC), and a channel compression–expansion mechanism to reduce redundancy. In particular, a frequency-enhanced channel attention mechanism (FECAM) is introduced after DSC layers to enhance discriminative features while mitigating the Gibbs phenomenon. Furthermore, a joint data augmentation strategy—time-shifting and masking—is applied to improve generalization. Evaluations on NinaPro DB1, DB5, and our SC-Myo datasets show that FSGR-Net achieves 93.17%, 87.83%, and 93.35% accuracy, respectively, with only 0.85 M parameters and 0.22 G FLOPs, demonstrating strong potential for deployment in mobile and low-power wearable systems.
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来源期刊
IEEE Sensors Journal
IEEE Sensors Journal 工程技术-工程:电子与电气
CiteScore
7.70
自引率
14.00%
发文量
2058
审稿时长
5.2 months
期刊介绍: The fields of interest of the IEEE Sensors Journal are the theory, design , fabrication, manufacturing and applications of devices for sensing and transducing physical, chemical and biological phenomena, with emphasis on the electronics and physics aspect of sensors and integrated sensors-actuators. IEEE Sensors Journal deals with the following: -Sensor Phenomenology, Modelling, and Evaluation -Sensor Materials, Processing, and Fabrication -Chemical and Gas Sensors -Microfluidics and Biosensors -Optical Sensors -Physical Sensors: Temperature, Mechanical, Magnetic, and others -Acoustic and Ultrasonic Sensors -Sensor Packaging -Sensor Networks -Sensor Applications -Sensor Systems: Signals, Processing, and Interfaces -Actuators and Sensor Power Systems -Sensor Signal Processing for high precision and stability (amplification, filtering, linearization, modulation/demodulation) and under harsh conditions (EMC, radiation, humidity, temperature); energy consumption/harvesting -Sensor Data Processing (soft computing with sensor data, e.g., pattern recognition, machine learning, evolutionary computation; sensor data fusion, processing of wave e.g., electromagnetic and acoustic; and non-wave, e.g., chemical, gravity, particle, thermal, radiative and non-radiative sensor data, detection, estimation and classification based on sensor data) -Sensors in Industrial Practice
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