2022 IEEE International Solid- State Circuits Conference (ISSCC)最新文献

{"title":"A WiFi and Bluetooth Backscattering Combo Chip Featuring Beam Steering via a Fully-Reflective Phased-Controlled Multi-Antenna Termination Technique Enabling Operation Over 56 Meters","authors":"Shihkai Kuo, Manideep Dunna, Dinesh Bharadia, P. Mercier","doi":"10.1109/ISSCC42614.2022.9731744","DOIUrl":"https://doi.org/10.1109/ISSCC42614.2022.9731744","url":null,"abstract":"Many envisioned IoT applications are not realizable today due to the mW-level power burden of wireless communication circuits for the most popular consumer standards: WiFi and BLE. To help enable new IoT applications, WiFi backscatter communication techniques have been shown to enable a ∼1, 000× reduction in power consumption over conventional transceivers while maintaining WiFi standard compatibility [1]–[3]. However, pragmatic deployment is currently hindered by their limited range, and lack of IC implementations for BLE [4]–[5]. For example, [3] and [1] only operate with inter- access point (AP) distances of 16m and 21m, respectively, which is not quite sufficient for robust operation in dense office environments, or large smart warehouses or airports with larger (and therefore lower cost) inter-AP deployment distances. Since backscatter modulation is passive with no RF power amplification, additional range can only be achieved by reducing insertion loss or adding antenna gain. For example, the work in [2] replaced 500 absorbing terminations with reactive terminations to reduce insertion loss over [1] and improve range to 26m, though a bulky and lossy Wilkinson power splitter/combiner was still required. The work in [2] also introduced a way to utilize multiple antennas to achieve MIMO-like antenna gain, though only in a static retro-reflective manner with no beam steering capabilities. This latter approach requires two co-located APs, which have self-interference challenges, and are thus not readily available in existing mesh networks. In addition to range challenges, there are no current backscatter ICs that can operate with BLE.","PeriodicalId":6830,"journal":{"name":"2022 IEEE International Solid- State Circuits Conference (ISSCC)","volume":"44 1","pages":"1-3"},"PeriodicalIF":0.0,"publicationDate":"2022-02-20","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"86778163","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}

{"title":"A 0.5mΩ/√Hz 106dB SNR 0.45cm2 Dry-Electrode Bioimpedance Interface with Current Mismatch Cancellation and Boosted Input Impedance of 100MΩ at 50kHz","authors":"Qinjing Pan, Tianxiang Qu, Biao Tang, Fei Shan, Zhiliang Hong, Jiawei Xu","doi":"10.1109/ISSCC42614.2022.9731787","DOIUrl":"https://doi.org/10.1109/ISSCC42614.2022.9731787","url":null,"abstract":"Bioimpedance (BioZ) analysis has been recognized as a new paradigm to derive a number of body composition and hemodynamic measures in a non-invasive manner. Measuring the changes in electrical resistance of the thorax during a cardiac cycle, known as impedance cardiography (ICG), is beneficial in detecting early signs of heart failure deterioration [1]. This raises the need for power-efficient wearable BioZ sensors to enable long-term and user-friendly health monitoring, while state-of-the-art designs still suffer from a few drawbacks. First, conventional BioZ interfaces typically rely on gel electrodes (> 10cm2) for low-impedance contact between skin and electrodes [1]–[2]. This not only hampers the long-term recording but also causes user discomfort. However, it is very challenging to perform small-size dry-electrode BioZ sensing at the frequency range of 1kHz to 1MHz, where both the increased electrode-tissue impedance (ETI) (-10MΩII0.5nF) and input parasitic capacitance $mathrm{C}_{mathrm{p}}(> 10text{pF})$ play a dominating role in attenuating the input signal (Fig. 20.1.1), resulting in gain inaccuracy and a long settling time [3]. To solve this issue, a BioZ amplifier with calibrated positive feedback [3] was proposed for input impedance boosting, which enables 1cm2 dry-electrode BioZ sensing. Second, to identify small BioZ variation (0.01 to $1Omega$) over higher baseline impedance, i.e., ETI plus the static BioZ component, both the excitation current generator (CG) and the BioZ amplifier must feature low noise. Although dynamic element matching (DEM) is effective in alleviating the 1/f current noise of the CG [2], the input-signal-dependent noise of the amplifier remains a notable problem that severely reduces the measurement accuracy when the BioZ signal is large [4]. Furthermore, previous CGs employing complementary current sources suffer from current mismatch, resulting in low output impedance and limited voltage headroom [1]–[2]. A unipolar CG solves this problem, but both the sinusoidal CG and current sink amplifier are power-hungry [3]. Finally, state-of-the-art BioZ readouts [1]–[3] still require an extra electrode to bias the body and provide the input common-mode (CM) voltage, which further increases the system complexity.","PeriodicalId":6830,"journal":{"name":"2022 IEEE International Solid- State Circuits Conference (ISSCC)","volume":"36 1","pages":"332-334"},"PeriodicalIF":0.0,"publicationDate":"2022-02-20","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"87199133","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}

{"title":"Session 25 Overview: Noise-Shaping ADCs","authors":"","doi":"10.1109/isscc42614.2022.9731569","DOIUrl":"https://doi.org/10.1109/isscc42614.2022.9731569","url":null,"abstract":"","PeriodicalId":6830,"journal":{"name":"2022 IEEE International Solid- State Circuits Conference (ISSCC)","volume":"38 1","pages":""},"PeriodicalIF":0.0,"publicationDate":"2022-02-20","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"86179174","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}

{"title":"A 0.76V Vin Triode Region 4A Analog LDO with Distributed Gain Enhancement and Dynamic Load-Current Tracking in Intel 4 CMOS Featuring Active Feedforward Ripple Shaping and On-Chip Power Noise Analyzer","authors":"Xiaosen Liu, H. Krishnamurthy, Renzhi Liu, K. Ravichandran, Zakir Ahmed, Nachiket V. Desai, N. Butzen, J. Tschanz, V. De","doi":"10.1109/ISSCC42614.2022.9731792","DOIUrl":"https://doi.org/10.1109/ISSCC42614.2022.9731792","url":null,"abstract":"Complex SoCs in nanoscale CMOS integrate a variety of digital compute/memory and analog/mixed-signal circuits such as SerDes transceivers, RF/wireless front-end, PLLs, sensors, etc. On-chip low-dropout regulators (LDOs) isolate the input $mathrm{V}_{text{in}}$ noise from switching DC-DC converters powering the digital blocks (Fig. 30.4.1) and provide high power-supply rejection (PSR) to the noise-sensitive analog/mixed-signal circuits by modulating the small-signal output resistance $(mathrm{R}_{0}$) of the power FET in the saturation region. Therefore, the minimum dropout (DO) voltage must be larger than the necessary gate overdrive (OV). While larger DO enables higher Ro and better PSR, it degrades the LDO power conversion efficiency (PCE). Using larger power FETs can reduce OV and DO for a target $mathrm{l}_{max}$ but at the cost of more die area. Therefore, LDO designs that provide the required high PSR while maximizing PCE and area efficiency are essential for high-performance SoCs [1].","PeriodicalId":6830,"journal":{"name":"2022 IEEE International Solid- State Circuits Conference (ISSCC)","volume":"137 1","pages":"478-480"},"PeriodicalIF":0.0,"publicationDate":"2022-02-20","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"86283913","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}

{"title":"F3: The Path to 6G: Architectures, Circuits, Technologies for Sub-THz Communications, Sensing and Imaging","authors":"","doi":"10.1109/isscc42614.2022.9731693","DOIUrl":"https://doi.org/10.1109/isscc42614.2022.9731693","url":null,"abstract":"","PeriodicalId":6830,"journal":{"name":"2022 IEEE International Solid- State Circuits Conference (ISSCC)","volume":"34 1","pages":""},"PeriodicalIF":0.0,"publicationDate":"2022-02-20","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"73085080","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}

{"title":"184QPS/W 64Mb/mm23D Logic-to-DRAM Hybrid Bonding with Process-Near-Memory Engine for Recommendation System","authors":"Dimin Niu, Shuangchen Li, Yuhao Wang, Wei Han, Zhe Zhang, Yijin Guan, Tianchan Guan, F. Sun, Fei Xue, Lide Duan, Yuanwei Fang, Hongzhong Zheng, Xiping Jiang, Song Wang, Fengguo Zuo, Yubing Wang, Bing Yu, Qiwei Ren, Yuan Xie","doi":"10.1109/ISSCC42614.2022.9731694","DOIUrl":"https://doi.org/10.1109/ISSCC42614.2022.9731694","url":null,"abstract":"The era of AI computing brings significant challenges to traditional computer systems. As shown in Fig. 29.1.1, while the AI model computation requirement increases 750x every two years, we only observe a very slow-paced improvement of memory system capability in terms of both capacity and bandwidth. There are many memory-bound applications, such as natural language processing, recommendation systems, graph analytics, graph neural networks, as well as multi-task online inference, that become dominating AI applications in modern cloud datacenters. Current primary memory technologies that power AI systems and applications include on-chip memory (SRAM), 2.5D integrated memory (HBM [1]), and off-chip memory (DDR, LPDDR, or GDDR SDRAM). Although on-chip memory enjoys low energy access compared to off-chip memory, limited on-chip memory capacity prevents the efficient adoption of large AI models due to intensive and costly off-chip memory access. In addition, the energy consumption of data movement of off-chip memory solutions (HBM and DRAM) is several orders of magnitude larger than that of on-chip memory, bringing the well-known “memory wall [2]“problem to AI systems. Process-near-memory (PNM) and computing-in-memory (CIM) have become promising candidates to tackle the “memory wall” problem in recent years.","PeriodicalId":6830,"journal":{"name":"2022 IEEE International Solid- State Circuits Conference (ISSCC)","volume":"117 1","pages":"1-3"},"PeriodicalIF":0.0,"publicationDate":"2022-02-20","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"89410129","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}

{"title":"A 68.3% Efficiency Reconfigurable 400-/800-mW Capacitive Isolated DC-DC Converter with Common-Mode Transient Immunity and Fast Dynamic Response by Through-Power-Link Hysteretic Control","authors":"Junyao Tang, Lei Zhao, Cheng Huang","doi":"10.1109/ISSCC42614.2022.9731748","DOIUrl":"https://doi.org/10.1109/ISSCC42614.2022.9731748","url":null,"abstract":"Galvanically isolated voltage regulators (GIVRs) are widely used in industrial automation, electric vehicles, and medical devices to deliver power to low-voltage circuits across isolated domains and ensure human safety and device reliability in hazardous environments. Traditional bulky transformer-based GIVRs can deliver 2W output power with 80% peak efficiency [1]. However, transformers are relatively expensive, and their size limits the overall physical size of the system from being further minimized. Inductive GIVRs using micro transformers have been introduced in [2]–[9] with a significantly reduced form factor; however, their efficiency is also significantly compromised to around 50% [2]–[4], or even lower in the 7-to-40% range [5]–[9]. This is mainly due to the much lower quality of the micro transformers compared to traditional ones, as well as the associated much higher switching frequency. In addition, the manufacturing/packaging may introduce extra cost due to the need for special processes [2], [3], [5], [6]. A capacitive GIVR has been introduced in [10]; however, the efficiency is also limited to 50.7%, with a maximum power capacity of only 62mW. Besides, common-mode transient (CMT) immunity (CMTI), which ensures the robustness of operation when fast and strong voltage transients happen between the isolated domains due to current/voltage spikes in motor drivers or other fast switching applications, is an important specification for galvanically isolated devices [2], [4], [8]. This is especially important for capacitive designs due to the direct capacitive links between the two domains. However, no discussions, mitigations, or measurements were provided in [10]. In addition, most state-of-the-art designs require an extra transformer [2], [3], [6] or a pair of capacitors [4], [10] to establish feedback links for voltage regulation, which also increase the cost and form factor, or they only work in open loop [5], [7], [9].","PeriodicalId":6830,"journal":{"name":"2022 IEEE International Solid- State Circuits Conference (ISSCC)","volume":"3 15","pages":"1-3"},"PeriodicalIF":0.0,"publicationDate":"2022-02-20","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"91506360","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}

{"title":"Electronic THz Pencil Beam Forming and 2D Steering for High Angular-Resolution Operation: A 98 $times$ 98-Unit 265GHz CMOS Reflectarray with In-Unit Digital Beam Shaping and Squint Correction","authors":"N. Monroe, Georgios C. Doqiamis, R.A. Stingel, Preston Myers, Xibi Chen, R. Han","doi":"10.1109/ISSCC42614.2022.9731671","DOIUrl":"https://doi.org/10.1109/ISSCC42614.2022.9731671","url":null,"abstract":"Ultra-sharp beam forming and high-angular-resolution steering in both azimuth and elevation directions are required in high-performance imaging sensors, spatial-multiplexed wireless links and other applications. This poses great challenges due to the fundamental relationship between the beamwidth and the dimension of the antenna aperture. As shown in Fig. 4.5.1, the aperture size required to achieve 1 ° of 3dB beamwidth is $0.6times 0.6mathrm{m}^{2}$ and $0.2times 0.2mathrm{m}^{2}$ at 24GHz and 77GHz, respectively. In current radars, sparse MIMO antenna schemes are adopted to synthesize virtual arrays with the above size in one dimension. However, they require intensive signal processing of many channels. The complex signal routing and placement of active electronics also leads to challenges in the 2D scaling required for pencil beam forming. By increasing the wave frequency to 265GHz, the work in this paper significantly reduces the aperture area, allowing it to be fully realized by digitally controlled, reflective antennas in CMOS microelectronic chips (Fig. 4.5.1). Similar to a concave mirror, a reflectarray, when illuminated by a single radar source, applies incident-angle-dependent phase shifts (e.g. $varphi_{1}$ and $varphi_{2}$ in Fig. 4.5.1) to the wave and re-focuses it towards a desired direction. This quasi-optical spatial feed eliminates the high-frequency signal routing and complex processing inherent to MIMO arrays. Employing $98times 98$ antenna elements, we experimentally demonstrate the forming and electronic steering of a THz pencil beam with- 1 ° beamwidth in two dimensions. With under-antenna integration of dense memory cells, sidelobe reduction and squint correction are also achieved.","PeriodicalId":6830,"journal":{"name":"2022 IEEE International Solid- State Circuits Conference (ISSCC)","volume":"7 1","pages":"1-3"},"PeriodicalIF":0.0,"publicationDate":"2022-02-20","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"84951892","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}

{"title":"A 1/1.57-inch 50Mpixel CMOS Image Sensor With 1.0μm All-Directional Dual Pixel by 0.5μm-Pitch Full-Depth Deep-Trench Isolation Technology","authors":"T. Jung, M. Fujita, Jeong Cho, Kyung-Hoon Lee, D. Seol, Sung-Jin An, Chanhee Lee, Youjin Jeong, Minji Jung, Sachoun Park, Seungki Baek, Seungki Jung, Seunghwan Lee, Jungbin Yun, E. Shim, Heetak Han, Eunkyung Park, Haesick Sul, Se-Won Kang, Kyungho Lee, JungChak Ahn, Duckhyun Chang","doi":"10.1109/ISSCC42614.2022.9731567","DOIUrl":"https://doi.org/10.1109/ISSCC42614.2022.9731567","url":null,"abstract":"As the strong demand for higher resolution and new functionality is rapidly increasing in the mobile CMOS Image Sensor (CIS) market, we have seen the emergence of: submicron pixels, >200M pixels, fast readout, global shutter, high dynamic range, and phase-detection autofocus (PDAF) [1 – 3]. Among these, PDAF is an essential feature of cutting-edge CIS for accurate autofocus at extremely low-light situations, and dual-pixel technology has been widely used for AF of the entire image area [4]. To implement high pixel resolution in a limited optical size, the pixel size has continued to shrink, and the pixel structure has evolved to maintain high image quality. However, for a dual pixel, integrating two photodiodes (PDs) in one pixel by backside deep trench isolation (BDTI) has technical limitations and causes degradation of image AF performance as well as image quality.","PeriodicalId":6830,"journal":{"name":"2022 IEEE International Solid- State Circuits Conference (ISSCC)","volume":"1 1","pages":"102-104"},"PeriodicalIF":0.0,"publicationDate":"2022-02-20","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"90062057","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}

{"title":"Session 8 Overview: Advanced RF Building Blocks","authors":"","doi":"10.1109/isscc42614.2022.9731782","DOIUrl":"https://doi.org/10.1109/isscc42614.2022.9731782","url":null,"abstract":"","PeriodicalId":6830,"journal":{"name":"2022 IEEE International Solid- State Circuits Conference (ISSCC)","volume":"43 1","pages":""},"PeriodicalIF":0.0,"publicationDate":"2022-02-20","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"82339332","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}