2020 IEEE 22nd Electronics Packaging Technology Conference (EPTC)最新文献_第4页

Wafer Level Void-Free Molded Underfill for High-Density Fan-out Packages 用于高密度扇出封装的晶圆级无空隙模制下填料

2020 IEEE 22nd Electronics Packaging Technology Conference (EPTC) Pub Date : 2020-12-02 DOI: 10.1109/EPTC50525.2020.9315128

I. Mok, JaeHun Bae, WonMyoung Ki, HoDol Yoo, S. Ryu, SooHyun Kim, Gyuick Jung, Taekyeong Hwang, Wonchul Do

{"title":"Wafer Level Void-Free Molded Underfill for High-Density Fan-out Packages","authors":"I. Mok, JaeHun Bae, WonMyoung Ki, HoDol Yoo, S. Ryu, SooHyun Kim, Gyuick Jung, Taekyeong Hwang, Wonchul Do","doi":"10.1109/EPTC50525.2020.9315128","DOIUrl":"https://doi.org/10.1109/EPTC50525.2020.9315128","url":null,"abstract":"In this study, experiments and mold flow simulation results are presented for a void-free wafer level molded underfill (WLMUF) process with High-Density Fan-Out (HDFO) test vehicles using a wafer-level compression molding process. The redistribution layer (RDL)-first technology was applied with 3 layers of a fine-pitch RDL structure. The test samples comprised $11.5 times 12.5-text{mm}^{2}$ die with tall copper (Cu) pillars around the die. Destructive analysis was used to clearly inspect MUF voids on the whole wafer area. The molded wafer was ground to the bump area where the MUF voids exist using a mold grinding machine and MUF voids were inspected through a high-resolution scope. The WLMUF characteristics of the conventional compression molding process with various epoxy molding compound (EMC) types have been investigated. A void-free WLMUF process was achieved by applying an optimized EMC dispensing method and parameters. These results are verified through the mold flow simulation, which correlated to the experimental results. Finally, the void-free WLMUF HDFO samples passed reliability tests of temperature cycling (TC), high temperature storage (HTS) and Unbiased Highly Accelerated Stress Test (UHAST) after moisture resistance test (MRT) Level 3.","PeriodicalId":6790,"journal":{"name":"2020 IEEE 22nd Electronics Packaging Technology Conference (EPTC)","volume":"55 1","pages":"419-424"},"PeriodicalIF":0.0,"publicationDate":"2020-12-02","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"80306666","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}

引用次数: 1

Reliability Study of Direct Au (Au-Cu plating) Surface Treatment on PKG Substrate PKG基板上直接镀金(Au- cu)表面处理的可靠性研究

2020 IEEE 22nd Electronics Packaging Technology Conference (EPTC) Pub Date : 2020-12-02 DOI: 10.1109/EPTC50525.2020.9315136

J. Ahn, Jungyeop Kim, young-Seok Kim, Jeong-Geun Moon, Oh-Gul Kwon, Kyungyea Park, Sun-Yong Lee, Kwang-Seop Youm, J. Jeong, E. Ahn

{"title":"Reliability Study of Direct Au (Au-Cu plating) Surface Treatment on PKG Substrate","authors":"J. Ahn, Jungyeop Kim, young-Seok Kim, Jeong-Geun Moon, Oh-Gul Kwon, Kyungyea Park, Sun-Yong Lee, Kwang-Seop Youm, J. Jeong, E. Ahn","doi":"10.1109/EPTC50525.2020.9315136","DOIUrl":"https://doi.org/10.1109/EPTC50525.2020.9315136","url":null,"abstract":"Recent developments in electronics have led to the pursuit of highly efficient technologies that reduce resistance and minimize signal loss rates. While Direct Au Surface Treatment in PKG Substrate is one of the ways to minimize signal loss rates, Direct Au Surface Treatment is not preferred option due to lack of technology and reliability issues. In this paper, the surface adhesion (reliability) of PKG substrates with Direct Au surface treatment is studied. After heat treatment of substrates, Cu was not detected during surface component analysis using SEM/EDS equipment, and sufficient wire bonding and soldering were obtained through dedicated tester, It was confirmed that the test results did not fluctuate significantly even after heat treatment. Results of this experiment show that there is no problem with Direct Au surface treatment surface adhesion. The results of this study can be used as a reference to type of surface treatment can be applied to PKG substrates and a guide to the type of analysis should be made to verify the reliability of surface treatment in semiconductor packages.","PeriodicalId":6790,"journal":{"name":"2020 IEEE 22nd Electronics Packaging Technology Conference (EPTC)","volume":"19 1","pages":"326-329"},"PeriodicalIF":0.0,"publicationDate":"2020-12-02","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"84183181","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}

引用次数: 0

New and Unique CMP Material Solution for the Enablement of High Removal Rate Polymer CMP and other Advanced Packaging Applications 新的和独特的CMP材料解决方案，使高去除率的聚合物CMP和其他先进的包装应用

2020 IEEE 22nd Electronics Packaging Technology Conference (EPTC) Pub Date : 2020-12-02 DOI: 10.1109/EPTC50525.2020.9314866

T. Chakraborty, P. Goradia, S. Verhaverbeke, Han-Wen Chen, C. Buch, Prayudi Lianto

{"title":"New and Unique CMP Material Solution for the Enablement of High Removal Rate Polymer CMP and other Advanced Packaging Applications","authors":"T. Chakraborty, P. Goradia, S. Verhaverbeke, Han-Wen Chen, C. Buch, Prayudi Lianto","doi":"10.1109/EPTC50525.2020.9314866","DOIUrl":"https://doi.org/10.1109/EPTC50525.2020.9314866","url":null,"abstract":"Polymer materials like epoxy mold compounds (EMC), polyimides (PI) are used in the advanced packaging applications. Chemical mechanical planarization (CMP) is a process useful in removing undesired surface topography and surface defects and in forming features on a substrate by removing excess deposited material. However, removal rates (RR) of polymers are too low by conventional CMP to be useful in advanced packaging technology. A novel slurry system has been developed. A two-step sequence combining both high-speed mechanical abrasion with novel slurries for coarse polishing and conventional polymer CMP technology for final fine polishing has been evaluated. A removal rate of more than $10 mu mathrm{m}/min$ has been observed for EMC which is roughly one order of magnitude higher than that obtained with conventional CMP process. A final fine polish step with a regular CMP slurry has almost restored the initial roughness in case of PI. The novel slurry has shown high RR for multiple substrates and has shown about 7:1 selectivity for PI removal against copper. This solution can bring grinding and CMP under one platform with more process control compared to grinding alone.","PeriodicalId":6790,"journal":{"name":"2020 IEEE 22nd Electronics Packaging Technology Conference (EPTC)","volume":"28 1","pages":"41-43"},"PeriodicalIF":0.0,"publicationDate":"2020-12-02","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"90915053","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}

引用次数: 3

Process Optimization Study on Leadframe Surface Enhancements for Delamination Mitigation 引线架表面增强以减轻脱层的工艺优化研究

2020 IEEE 22nd Electronics Packaging Technology Conference (EPTC) Pub Date : 2020-12-02 DOI: 10.1109/EPTC50525.2020.9315025

S. Buenviaje, R. Rodriguez, Rammil A. Seguido, F. R. Gomez

引用次数: 15

Roll-to-Roll Gravure Printing of Electric Heaters on Polymeric Substrates 聚合物基材上电加热器的卷对卷凹版印刷

2020 IEEE 22nd Electronics Packaging Technology Conference (EPTC) Pub Date : 2020-12-02 DOI: 10.1109/EPTC50525.2020.9315005

X. Shan, V. Sunappan, B. Salam, B. Lok

引用次数: 0

Resolution of Tie Bar Protrusion Issue in Over-Molded Plastic Package 解决过模塑料包装中拉杆突出问题

2020 IEEE 22nd Electronics Packaging Technology Conference (EPTC) Pub Date : 2020-12-02 DOI: 10.1109/EPTC50525.2020.9314865

Bal Lajom, Jan Joseph Miranda, Gerry Alvano

{"title":"Resolution of Tie Bar Protrusion Issue in Over-Molded Plastic Package","authors":"Bal Lajom, Jan Joseph Miranda, Gerry Alvano","doi":"10.1109/EPTC50525.2020.9314865","DOIUrl":"https://doi.org/10.1109/EPTC50525.2020.9314865","url":null,"abstract":"The tie bars are critical component of the leadframe as it provides structural support to the entire package body during assembly. Its design must be strong enough to withstand the mechanical stresses but should be optimal to be effectively cut during singulation. Common issues such as premature singulation can be associated with poor designs. Tie bar protrusion, on the other hand is typically linked to tool wear-out or incorrect tooling tolerances. In the development of the Over-Molded Plastic (OMP) package, the tie bar protrusion was resolved by adding enhancement features on the cutting tool and via leadframe design change. The heatsink of the package is initially connected to the tie bars through riveting. After singulation, tie bars protruding outside the package outline poses risk of electrical shorting to the adjacent leads or with other components in the PCB. One key customer required a specific package size to be shorter than the standard (called short package OMP). This requirement led to the qualification of new mold tool and new leadframe design. Initial trial showed that the design requirement specification is not met because tie bar protrusions are appearing randomly. Mechanical stress modelling revealed a potential issue on the leadframe design. Further review with the leadframe supplier also revealed some manufacturing limitations that need to be comprehended for new designs to avoid similar issue. The leadframe for short package OMP was redesigned to correct the flaws identified from the stress modelling. In addition, a design improvement in the cutting tool was evaluated. Evaluation results showed that both solutions are successful in eliminating the protrusion issue. Because of these corrective actions, the business continuity with the key customer was guaranteed. The learnings also enabled better development lead times by eliminating the potential risk, thus meeting the first-time right target for new package development.","PeriodicalId":6790,"journal":{"name":"2020 IEEE 22nd Electronics Packaging Technology Conference (EPTC)","volume":"16 1","pages":"112-115"},"PeriodicalIF":0.0,"publicationDate":"2020-12-02","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"72941505","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}

引用次数: 0

Roll-to-Roll Manufacturing of Printed Biosensor Electrodes for ECG Monitoring 用于心电监测的印刷生物传感器电极的卷对卷制造

2020 IEEE 22nd Electronics Packaging Technology Conference (EPTC) Pub Date : 2020-12-02 DOI: 10.1109/EPTC50525.2020.9315165

Rachel Lee Siew Tan, J. N. Tey, W. T. Kerk, B. Lok

引用次数: 1

Temperature detection system for Renal Denervation Catheter application 温度检测系统在肾去神经导管中的应用

2020 IEEE 22nd Electronics Packaging Technology Conference (EPTC) Pub Date : 2020-12-02 DOI: 10.1109/EPTC50525.2020.9315073

Sajay Bhuvanendran Nair Gourikutty, D. Choong, Ruiqi Lim, M. R. Damalerio, J. Oh, Yuri Kim, I. Bae, Ming-Yuan Cheng

{"title":"Temperature detection system for Renal Denervation Catheter application","authors":"Sajay Bhuvanendran Nair Gourikutty, D. Choong, Ruiqi Lim, M. R. Damalerio, J. Oh, Yuri Kim, I. Bae, Ming-Yuan Cheng","doi":"10.1109/EPTC50525.2020.9315073","DOIUrl":"https://doi.org/10.1109/EPTC50525.2020.9315073","url":null,"abstract":"Hypertension, in other words called high blood pressure, is a chronic and serious medical condition that considerably increases the risks of other ailments associated with the heart, brain, and kidney. Minimally invasive catheter-based renal denervation procedure is an effective way to treat hypertension for patients whose blood pressure level was unable to be brought under control by medication. However, for such systems an accurate temperature monitoring system is required to control the ablation power for a successful procedure and to avoid unwanted tissue damage. In this paper, the development of a platinum-based resistance temperature detector is presented. The temperature sensor is modeled using finite element analysis simulation and realized by silicon microfabrication. To ensure the performance of each fabricated sensor die, the test and characterization methodology of the sensor is translated and carried out using fully automatic test equipment. In this work, we are able to achieve a relatively large change in resistance of more than 15% with respect to the temperature change from 20 °C to 85 °C. Platinum as sensor material provided a linear relationship between change in resistance and temperature. This biocompatible resistance temperature detector sensor with its linear and consistent performance will allow us to accurately monitor the temperature in the renal denervation application.","PeriodicalId":6790,"journal":{"name":"2020 IEEE 22nd Electronics Packaging Technology Conference (EPTC)","volume":"71 1","pages":"198-202"},"PeriodicalIF":0.0,"publicationDate":"2020-12-02","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"89422122","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}

引用次数: 3

FOWLP RF Passive Circuit Designs for 77GHz MIMO radar applications 用于77GHz MIMO雷达应用的FOWLP射频无源电路设计

2020 IEEE 22nd Electronics Packaging Technology Conference (EPTC) Pub Date : 2020-12-02 DOI: 10.1109/EPTC50525.2020.9315111

Sun Mei, Lim Teck Guan, Xie Dan Peng, C. T. Chong, S. Bhattacharya

引用次数: 3

Improvement of PCB reliability under HAST conditions by enhancing adhesion of DFSR on PPG 通过增强DFSR在PPG上的附着力来提高HAST条件下PCB的可靠性

2020 IEEE 22nd Electronics Packaging Technology Conference (EPTC) Pub Date : 2020-12-02 DOI: 10.1109/EPTC50525.2020.9315143

Hyung-Do Lee, Han-Gyu Kim, Jeong-Geun Moon, Hyo-Sang Jang, Byeong-Hwa Kang, P. Kim, C. Park, Su-Nam Kim, Seunghwan Hong, Hwa-Dong Oh, E. Ahn

引用次数: 0