FOWLP RF Passive Circuit Designs for 77GHz MIMO radar applications

Abstract

Fan-Out Wafer-Level-Packaging (FOWLP) that directly molds the bare die inside the package with the antenna fabricating on the package stands out a very elegant and compact solution for 77GHz MIMO radar. This paper presents key RF passive circuit designs used to implement such MIMO radar, including RDL lines, power dividers and solder ball connections. The presented RF passive circuit low loss designs and studies are important to ensure FOWLP AiP performance for 77GHz MIMO radar applications.