Reliability Study of Direct Au (Au-Cu plating) Surface Treatment on PKG Substrate

Abstract

Recent developments in electronics have led to the pursuit of highly efficient technologies that reduce resistance and minimize signal loss rates. While Direct Au Surface Treatment in PKG Substrate is one of the ways to minimize signal loss rates, Direct Au Surface Treatment is not preferred option due to lack of technology and reliability issues. In this paper, the surface adhesion (reliability) of PKG substrates with Direct Au surface treatment is studied. After heat treatment of substrates, Cu was not detected during surface component analysis using SEM/EDS equipment, and sufficient wire bonding and soldering were obtained through dedicated tester, It was confirmed that the test results did not fluctuate significantly even after heat treatment. Results of this experiment show that there is no problem with Direct Au surface treatment surface adhesion. The results of this study can be used as a reference to type of surface treatment can be applied to PKG substrates and a guide to the type of analysis should be made to verify the reliability of surface treatment in semiconductor packages.