2015 IEEE 3rd Workshop on Wide Bandgap Power Devices and Applications (WiPDA)最新文献

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An E-mode GaN HEMTs based three-level bidirectional DC/DC converter used in Robert Bosch DC-grid system 基于e型GaN hemt的三电平双向DC/DC变换器应用于Robert Bosch直流电网系统
2015 IEEE 3rd Workshop on Wide Bandgap Power Devices and Applications (WiPDA) Pub Date : 2015-11-01 DOI: 10.1109/WIPDA.2015.7369254
Juncheng Lu, Hua Bai, S. Averitt, Di Chen, J. Styles
{"title":"An E-mode GaN HEMTs based three-level bidirectional DC/DC converter used in Robert Bosch DC-grid system","authors":"Juncheng Lu, Hua Bai, S. Averitt, Di Chen, J. Styles","doi":"10.1109/WIPDA.2015.7369254","DOIUrl":"https://doi.org/10.1109/WIPDA.2015.7369254","url":null,"abstract":"Instead of using 1200V SiC MOSFETs for the >600V applications, this paper utilized 650V E-mode GaN HEMTs to build a three-level DC/DC converter. The DC-bus voltage is 800V, the output voltage of 380V and the power is 2.5kW with the bidirectional power-flow capability. Simulation and experimental results show that such design strategy is superior to a single 1200V SiC MOSFET based DC/DC converter in terms of the switching and conduction performance. On the other hand, in order to better understand the performance of GaN HEMTs, hard-switching technology is used to fully test the switching behaviors. Two GaN HEMTs are in parallel to enhance the power capability, which requires the special focus on the parasitic parameters. The effects of parasitics especially the stray inductance in the commutation loop and the gate-drive loop during switching transitions have been comprehensively analyzed and discussed in this paper.","PeriodicalId":6538,"journal":{"name":"2015 IEEE 3rd Workshop on Wide Bandgap Power Devices and Applications (WiPDA)","volume":"64 1","pages":"334-340"},"PeriodicalIF":0.0,"publicationDate":"2015-11-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"77941683","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 18
Turn-on capability of 22 kV SiC Emitter Turn-off (ETO) Thyristor 22kv碳化硅发射极关断(ETO)晶闸管的导通能力
2015 IEEE 3rd Workshop on Wide Bandgap Power Devices and Applications (WiPDA) Pub Date : 2015-11-01 DOI: 10.1109/WIPDA.2015.7369275
Lin Liang, A. Huang, Woongje Sung, Meng-Chia Lee, Xiaoqing Song, Chang Peng, Lin Cheng, J. Palmour, C. Scozzie
{"title":"Turn-on capability of 22 kV SiC Emitter Turn-off (ETO) Thyristor","authors":"Lin Liang, A. Huang, Woongje Sung, Meng-Chia Lee, Xiaoqing Song, Chang Peng, Lin Cheng, J. Palmour, C. Scozzie","doi":"10.1109/WIPDA.2015.7369275","DOIUrl":"https://doi.org/10.1109/WIPDA.2015.7369275","url":null,"abstract":"The turn-on characteristics for the SiC p-ETO are researched in this paper. By establishing the two-dimensional numerical model of the SiC p-ETO, the influence of the device parameters and external circuit conditions on the turn-on speed is discussed. The experiments agree with the simulated results well. The npn turn-on mode of ETO is captured in a high di/dt experiment, which proves the existence of the FBSOA for this time hence the possibility of its application in converters without di/dt snubber. According to the intrinsic temperature limitation of the SiC material, the simulation shows that the peak power density of the SiC p-ETO during turn-on could reach several tens of MW/cm2.","PeriodicalId":6538,"journal":{"name":"2015 IEEE 3rd Workshop on Wide Bandgap Power Devices and Applications (WiPDA)","volume":"92 1","pages":"192-195"},"PeriodicalIF":0.0,"publicationDate":"2015-11-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"80416512","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 2
Sizing SiC storage inverters for fast grid frequency support 尺寸SiC存储逆变器用于快速电网频率支持
2015 IEEE 3rd Workshop on Wide Bandgap Power Devices and Applications (WiPDA) Pub Date : 2015-11-01 DOI: 10.1109/WIPDA.2015.7369262
A. Hoke, K. Bennion, V. Gevorgian, S. Chakraborty, E. Muljadi
{"title":"Sizing SiC storage inverters for fast grid frequency support","authors":"A. Hoke, K. Bennion, V. Gevorgian, S. Chakraborty, E. Muljadi","doi":"10.1109/WIPDA.2015.7369262","DOIUrl":"https://doi.org/10.1109/WIPDA.2015.7369262","url":null,"abstract":"As wind and solar displace synchronous generators whose inertia stabilizes the AC grid frequency on fast time scales, it has been proposed to use energy storage systems (ESSs) to mitigate frequency transient events. Such events require a rapid surge of power from the ESS, but they occur only rarely. The high temperature tolerance of SiC MOSFETs and diodes presents an opportunity for innovative ESS inverter designs. Herein we investigate a SiC ESS inverter design such that the SiC device ratings are obeyed during mild frequency events but are exceeded during rare, major events, for a potentially more economical inverter design. In support of this proposal we present: 1. An analysis of four years of grid frequency events in the U.S. Western Interconnection. 2. A switch-level ESS inverter simulation using SiC devices with detailed loss estimates. 3. Thermal analysis of the SiC power modules during a worst-case frequency event, showing that the modules can likely withstand the brief overcurrent. This analysis supports the conclusion that it may be advantageous for economical designs (acknowledging the increased risks) to undersize the SiC switches when designing inverters to perform active power control for grid frequency support. Such a strategy may result in SiC-based designs being more competitive with less costly silicon IGBT-based designs.","PeriodicalId":6538,"journal":{"name":"2015 IEEE 3rd Workshop on Wide Bandgap Power Devices and Applications (WiPDA)","volume":"3 1","pages":"328-333"},"PeriodicalIF":0.0,"publicationDate":"2015-11-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"76728929","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 3
Design of a high-bandwidth Rogowski current sensor for gate-drive shortcircuit protection of 1.7 kV SiC MOSFET power modules 用于1.7 kV SiC MOSFET电源模块栅极驱动短路保护的高带宽Rogowski电流传感器设计
2015 IEEE 3rd Workshop on Wide Bandgap Power Devices and Applications (WiPDA) Pub Date : 2015-11-01 DOI: 10.1109/WIPDA.2015.7369315
Jun Wang, Zhiyu Shen, R. Burgos, D. Boroyevich
{"title":"Design of a high-bandwidth Rogowski current sensor for gate-drive shortcircuit protection of 1.7 kV SiC MOSFET power modules","authors":"Jun Wang, Zhiyu Shen, R. Burgos, D. Boroyevich","doi":"10.1109/WIPDA.2015.7369315","DOIUrl":"https://doi.org/10.1109/WIPDA.2015.7369315","url":null,"abstract":"This presents a PCB-based Rogowski current sensor design for the purpose of shortcircuit protection for 1.7 kV SiC MOSFET modules. Firstly, the paper shows that using the DeSat protection method for SiC MOSFET protection is not as effective as that in conventional IGBT applications. Therefore, a direct measurement of device switching current is proposed to achieve shortcircuit protection. The Rogowski-coil-based current sensor is selected among several high-bandwidth candidates for its better overall performance. Then the PCB-based Rogowski coil and its signal processing circuit design are shown in the paper. Finally, experimental results validate that the designed sensor has good performance in both accuracy and bandwidth when compared to a commercial Rogowki probe.","PeriodicalId":6538,"journal":{"name":"2015 IEEE 3rd Workshop on Wide Bandgap Power Devices and Applications (WiPDA)","volume":"23 1","pages":"104-107"},"PeriodicalIF":0.0,"publicationDate":"2015-11-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"74954883","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 66
An optimized gate-loop layout for multi-chip SiC MOSFET power modules 一种优化的多片SiC MOSFET功率模块的门环布局
2015 IEEE 3rd Workshop on Wide Bandgap Power Devices and Applications (WiPDA) Pub Date : 2015-11-01 DOI: 10.1109/WIPDA.2015.7369279
Miao Wang, F. Luo, Longya Xu
{"title":"An optimized gate-loop layout for multi-chip SiC MOSFET power modules","authors":"Miao Wang, F. Luo, Longya Xu","doi":"10.1109/WIPDA.2015.7369279","DOIUrl":"https://doi.org/10.1109/WIPDA.2015.7369279","url":null,"abstract":"This paper investigates the impact of gate-loop layouts on the switching loss of a multi-chip silicon carbide metal-oxide-semiconductor field-effect-transistor (MSOFET) power module. Six gate loop layouts are proposed and evaluated in switching simulations. A 16.2% difference on the total switching loss is observed between a good and a bad gate loop layout. The results shows that the total switching loss can be reduced with a \"reverse matching arrangement\" between the gate loop and the power loop. Specifically, to assign a short gate loop to the device that has a large power-loop inductance, and vice versa. In addition, shared traces from the gate driver to the paralleled devices could further reduce the total switching loss.","PeriodicalId":6538,"journal":{"name":"2015 IEEE 3rd Workshop on Wide Bandgap Power Devices and Applications (WiPDA)","volume":"26 1","pages":"215-219"},"PeriodicalIF":0.0,"publicationDate":"2015-11-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"75606122","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 4
Design of a high-density, diode-less 1.2 kV, 90 A SiC MOSFET half-bridge power module 高密度、无二极管1.2 kV、90a SiC MOSFET半桥功率模块的设计
2015 IEEE 3rd Workshop on Wide Bandgap Power Devices and Applications (WiPDA) Pub Date : 2015-11-01 DOI: 10.1109/WIPDA.2015.7369278
C. Dimarino, Wenli Zhang, R. Burgos, D. Boroyevich
{"title":"Design of a high-density, diode-less 1.2 kV, 90 A SiC MOSFET half-bridge power module","authors":"C. Dimarino, Wenli Zhang, R. Burgos, D. Boroyevich","doi":"10.1109/WIPDA.2015.7369278","DOIUrl":"https://doi.org/10.1109/WIPDA.2015.7369278","url":null,"abstract":"SiC devices with current ratings close to 100 A per chip have recently been released. These devices decrease the number of paralleled die needed in high-current power modules, thus increasing power density. By utilizing these devices in synchronous operation with the body diode used for dead time commutation, the external antiparallel diode can be eliminated. This mode reduces cost, and further increases the power density without sacrificing efficiency. In this work, a 1.2 kV, 90 A diode-less SiC MOSFET half-bridge module was designed, fabricated and tested. A survey of packaging materials and technologies was conducted, and the selections were based on the tradeoff between cost and performance. The fabricated module has low gate- and power-loop parasitic inductances (3 and 2.4 nH, respectively), and has more than twice the power density (7.8 W/mm3) and less than half of the switching loss (1.3 mJ) as similarly-rated commercial half-bridge modules.","PeriodicalId":6538,"journal":{"name":"2015 IEEE 3rd Workshop on Wide Bandgap Power Devices and Applications (WiPDA)","volume":"59 1","pages":"210-214"},"PeriodicalIF":0.0,"publicationDate":"2015-11-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"85846302","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 9
A new AlGaN/GaN power HFET employing partial deep trench drain structure for high voltage application 一种新型的AlGaN/GaN功率HFET,采用部分深沟槽排水结构
2015 IEEE 3rd Workshop on Wide Bandgap Power Devices and Applications (WiPDA) Pub Date : 2015-11-01 DOI: 10.1109/WIPDA.2015.7369277
I. Ji, Bongmook Lee, Sizhen Wang, V. Misra, A. Huang
{"title":"A new AlGaN/GaN power HFET employing partial deep trench drain structure for high voltage application","authors":"I. Ji, Bongmook Lee, Sizhen Wang, V. Misra, A. Huang","doi":"10.1109/WIPDA.2015.7369277","DOIUrl":"https://doi.org/10.1109/WIPDA.2015.7369277","url":null,"abstract":"A new AlGaN/GaN heterojuction field effect transistor (HFET) employing the partial deep trench drain structure for high voltage application has been proposed and verified successfully to achieve low leakage current and small Rdson. In order to reduce leakage current and on-resistance of HFET devices, we propose a partial deep trench on drain edge adjacent to access region for the first time, which contributes to reducing the surface electric field under the off-state. In addition, trenched area under drain Ohmic metal enhances Ohmic contact on the surface of AlGaN layer which reduces contact resistivity of drain Ohmic contact. The proposed deep trench drain successfully reduces Ohmic contact resistance under the on-state and leakage current under the off-state at the same time.","PeriodicalId":6538,"journal":{"name":"2015 IEEE 3rd Workshop on Wide Bandgap Power Devices and Applications (WiPDA)","volume":"101 1","pages":"147-149"},"PeriodicalIF":0.0,"publicationDate":"2015-11-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"85901601","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 1
Design of GaN transistor-based class E DC-DC converter with resonant rectifier circuit 基于GaN晶体管谐振整流电路的E类DC-DC变换器设计
2015 IEEE 3rd Workshop on Wide Bandgap Power Devices and Applications (WiPDA) Pub Date : 2015-11-01 DOI: 10.1109/WIPDA.2015.7369269
Kyung-Hwan Lee, Euihoon Chung, Gab-Su Seo, Jung-Ik Ha
{"title":"Design of GaN transistor-based class E DC-DC converter with resonant rectifier circuit","authors":"Kyung-Hwan Lee, Euihoon Chung, Gab-Su Seo, Jung-Ik Ha","doi":"10.1109/WIPDA.2015.7369269","DOIUrl":"https://doi.org/10.1109/WIPDA.2015.7369269","url":null,"abstract":"This paper proposes a novel design of class E dc-dc converter with a resonant rectifier circuit. Class E converter is advantageous in several-MHz switching since it achieves zero voltage switching (ZVS) and has the single ground-referenced switch. In this paper, the resonant rectifier is used to construct a dc-dc converter in conjunction with the class E inverter instead of the conventional rectifiers such as a half-wave rectifier and a full-wave bridge rectifier. The main benefit of the resonant rectifier is that the rectifier diode turns on and off at low dv/dt, thereby reducing switching loss and noise mainly attributed to the parasitic inductance and capacitance. Here we focus on the analysis and design of the resonant rectifier and analytically find the condition that the rectifier circuit can be seen as a resistor. Compared to other studies, the proposed design of the rectifier requires no large filter inductor. Also, its resonant frequency differs from the fundamental frequency, allowing the rectifier to be resistive. A 6.78-MHz prototype converter is implemented by using an enhancement-mode GaN FET, and experimental results validate the proposed design scheme.","PeriodicalId":6538,"journal":{"name":"2015 IEEE 3rd Workshop on Wide Bandgap Power Devices and Applications (WiPDA)","volume":"53 1","pages":"275-280"},"PeriodicalIF":0.0,"publicationDate":"2015-11-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"90825888","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 6
Evaluation of 600 V GaN based gate injection transistors for high temperature and high efficiency applications 600 V GaN基栅注入晶体管的高温高效应用评估
2015 IEEE 3rd Workshop on Wide Bandgap Power Devices and Applications (WiPDA) Pub Date : 2015-11-01 DOI: 10.1109/WIPDA.2015.7369300
He Li, Chengcheng Yao, Chaoran Han, J. Brothers, Xuan Zhang, Jin Wang
{"title":"Evaluation of 600 V GaN based gate injection transistors for high temperature and high efficiency applications","authors":"He Li, Chengcheng Yao, Chaoran Han, J. Brothers, Xuan Zhang, Jin Wang","doi":"10.1109/WIPDA.2015.7369300","DOIUrl":"https://doi.org/10.1109/WIPDA.2015.7369300","url":null,"abstract":"In this paper, we present a comprehensive evaluation of the latest 600 V class Gallium Nitride based Gate Injection Transistor (GaN-GIT) for high temperature and high efficiency applications. In this study, the Panasonic GITs are used as the reference for latest GaN-GIT technology. Static and dynamic testing was performed on the two GaN-GIT versions to extract critical static parameters and switching losses. A curve tracer was used to measure the gate-to-source threshold value and static Rds(on) across the full operating temperature range. A double pulse setup was developed to test the devices switching time and hard-switching loss. The switching performance is temperature insensitive. Then, the dynamic on-resistance of the GaN-GIT was measured with an additional clamping circuit. Finally, an improved gate drive circuit for the GaN-GIT was proposed and validated to achieve MHz operation with smaller switching loss.","PeriodicalId":6538,"journal":{"name":"2015 IEEE 3rd Workshop on Wide Bandgap Power Devices and Applications (WiPDA)","volume":"8 1","pages":"85-91"},"PeriodicalIF":0.0,"publicationDate":"2015-11-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"81959966","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 32
Experimental performance comparison of six-pack SiC MOSFET and Si IGBT modules paralleled in a half-bridge configuration for high temperature applications 六封装SiC MOSFET和Si IGBT模块在高温半桥结构中并联的实验性能比较
2015 IEEE 3rd Workshop on Wide Bandgap Power Devices and Applications (WiPDA) Pub Date : 2015-11-01 DOI: 10.1109/WIPDA.2015.7369260
R. Lund, S. Tiwari, O. Midtgård, Tore Undeland
{"title":"Experimental performance comparison of six-pack SiC MOSFET and Si IGBT modules paralleled in a half-bridge configuration for high temperature applications","authors":"R. Lund, S. Tiwari, O. Midtgård, Tore Undeland","doi":"10.1109/WIPDA.2015.7369260","DOIUrl":"https://doi.org/10.1109/WIPDA.2015.7369260","url":null,"abstract":"The switching performance of a six-pack SiC MOSFET module (CCS050M12CM2) is investigated experimentally using a standard double pulse test method. The upper three and the lower three MOSFETs of the CCS050M12CM2 are paralleled forming a half-bridge configuration. Moreover, the performance comparison of the CCS050M12CM2 is carried out with a pin to pin compatible Si IGBT module (FS75R12KT4_B15) of the same rating. Thus, switching and driving energy losses can be compared fairly. Laboratory results show that CCS050M12CM2 switches much faster compared to FS75R12KT4_B15 provided the same gate resistor is used. The measured total driving and switching energy losses are approximately 4 times in FS75R12KT4_B15 compared to CCS050M12CM2 at 25 °C. Moreover, the total switching energy loss is nearly independent of the temperature for CCS050M12CM2, whereas, FS75R12KT4_B15 has 1.6 times higher switching energy loss at a junction temperature of 175° C compared to 25 °C.","PeriodicalId":6538,"journal":{"name":"2015 IEEE 3rd Workshop on Wide Bandgap Power Devices and Applications (WiPDA)","volume":"2015 1","pages":"135-140"},"PeriodicalIF":0.0,"publicationDate":"2015-11-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"87095919","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 11
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