2011 6th International Microsystems, Packaging, Assembly and Circuits Technology Conference (IMPACT)最新文献_第7页

Hyper-generation LEDs VCPCB 超代led VCPCB

2011 6th International Microsystems, Packaging, Assembly and Circuits Technology Conference (IMPACT) Pub Date : 2011-12-29 DOI: 10.1109/IMPACT.2011.6117205

Jung-Chang Wang, Tian-Shiang Sung, Wan-Ping Chen

{"title":"Hyper-generation LEDs VCPCB","authors":"Jung-Chang Wang, Tian-Shiang Sung, Wan-Ping Chen","doi":"10.1109/IMPACT.2011.6117205","DOIUrl":"https://doi.org/10.1109/IMPACT.2011.6117205","url":null,"abstract":"Vapor chamber (VC) has been proven the excellent heat spreading performance utilized particularly in high-power light-emitting diode (LED). As high-power LEDs array are utilized for more general lighting systems, more significant amount of heat flux being generated while it is operating. The main challenge is that the lifetime of high-brightness LEDs is easily shortened by thermal problem generated at the device junction and ambient temperature. The printed circuit board (PCB) composite made up variables of dielectric, copper and solder layer thicknesses affected the thermal performance of high-power LEDs lighting system. Therefore, combination VC and PCB (VCPCB) can perfectly serve the high-power LEDs package system. This study reports the manufacturing characteristics and utilizes experimental analysis with window program VCTM V1.0 to investigate the thermal performance of VCPCB applying in a high-brightness LED array package module. Results show that the effective thermal conductivity of the VCPCB is many times higher than that of the AlN, copper and aluminum PCB, proving that it can effectively reduce the temperature of the LEDs and obtain more uniform illuminance. And the thermal performance of the LEDs VCPCB is better than that of the LEDs Copper PCB and has the highest effective thermal conductivity of 965 W/m°C at 187.5 W/cm2. The LEDs VCPCB works out hot-spot problem of 100 Watt high-power LEDs, successfully.","PeriodicalId":6360,"journal":{"name":"2011 6th International Microsystems, Packaging, Assembly and Circuits Technology Conference (IMPACT)","volume":"2015 1","pages":"332-335"},"PeriodicalIF":0.0,"publicationDate":"2011-12-29","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"87949636","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}

引用次数: 3

On mold corner effects of EMC adhesion for IC encapsulation process 集成电路封装过程中EMC粘接的模具角效应研究

2011 6th International Microsystems, Packaging, Assembly and Circuits Technology Conference (IMPACT) Pub Date : 2011-12-29 DOI: 10.1109/IMPACT.2011.6117263

Chia-Hsun Yeh, Chen-hung Deng, Huei-Huang Lee, Sheng-Jye Hwang, D. Huang

{"title":"On mold corner effects of EMC adhesion for IC encapsulation process","authors":"Chia-Hsun Yeh, Chen-hung Deng, Huei-Huang Lee, Sheng-Jye Hwang, D. Huang","doi":"10.1109/IMPACT.2011.6117263","DOIUrl":"https://doi.org/10.1109/IMPACT.2011.6117263","url":null,"abstract":"In the IC packaging process, epoxy molding compound (EMC) was filling the mold cavity and cured in the mold. At the same time, adhesion may occur in the interface between the surface of mold and cured EMC. Large adhesion force could cause many problems, which may influence the ejection process. Some other critical problems may also happen in the IC molding process if adhesion problem occurs, such as distortion or crack on ejecting finished parts, residue of cured EMC on the surface of mold affecting the quality of the products, and regular, tedious and not effective mold cleaning. So how to improve the mold adhesion force effectively is an important issue for industry and research institutes. To avoid the mold adhesion problems, improving the mold design and applying suitable surface treatments such as mold surface coating are the common approaches. Among these, applying suitable surface coating is a more popular and practical approach. This study described the approach of using a semi-automatic EMC adhesion force test instrument to measure adhesion force between the mold surface and EMC and studied the corner effect during the encapsulation process. Three different cavity arcs were designed in three specimens and molded and tested during molding to observe the corner effects. Engineers could determine the best type of surface treatment and the type of corner to reduce the amount of mold adhesion force. This paper also discussed the issue of successive adhesion force test and the variation of adhesion force during successive molding test to predict the time for mold cleaning. It was found that larger corner would cause smaller adhesion force. Repeat experiments were executed and found that the test results could be repeated.","PeriodicalId":6360,"journal":{"name":"2011 6th International Microsystems, Packaging, Assembly and Circuits Technology Conference (IMPACT)","volume":"16 1","pages":"280-283"},"PeriodicalIF":0.0,"publicationDate":"2011-12-29","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"75259221","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}

引用次数: 0

Effective moduli prediction for silicon interposer with high-density Cu-filled through-silicon via 高密度铜填充硅通孔硅中间层的有效模量预测

2011 6th International Microsystems, Packaging, Assembly and Circuits Technology Conference (IMPACT) Pub Date : 2011-12-29 DOI: 10.1109/IMPACT.2011.6117215

Chang-Chun Lee, Y. Shih, C. Wu

引用次数: 0

Oxygenous reflow affecting performance of Pb-free TFBGA assembly 氧回流对无铅TFBGA组件性能的影响

2011 6th International Microsystems, Packaging, Assembly and Circuits Technology Conference (IMPACT) Pub Date : 2011-12-29 DOI: 10.1109/IMPACT.2011.6117251

Tien-Tsorng Shih, Wei-Chih Chen, Win-Der Lee, Mu-Chun Wang

{"title":"Oxygenous reflow affecting performance of Pb-free TFBGA assembly","authors":"Tien-Tsorng Shih, Wei-Chih Chen, Win-Der Lee, Mu-Chun Wang","doi":"10.1109/IMPACT.2011.6117251","DOIUrl":"https://doi.org/10.1109/IMPACT.2011.6117251","url":null,"abstract":"More high-pin count package and thinner thickness of ball-grid-array (BGA) substrate are appreciated in the recent commercial electronic products. Using thin profile fine-pitch BGA (TFBGA) substrate incorporated into the assembly line is a feasible solution. To expose the possibility with this substrate, two species of lead-free solder balls with and without nickel were applied and the oxygen concentration impacting the solder quality in reflow process was considered. The flux assistance for solderability was adopted to verify the integration capability in assembly mass production. The temperature effect attacking the solder adhesion due to the thermal stress and the difference of thermal expansion coefficients for entire package products was also taken into concern. Using the shear test and drop test could clarify the solder adherence between solder ball and TFBGA carrier substrate. Finally, the Cpk values for all of test groups were greater than 1.33, which demonstrated the TFBGA substrate was suitable to be employed in the high-pin count and high-profit electronic products.","PeriodicalId":6360,"journal":{"name":"2011 6th International Microsystems, Packaging, Assembly and Circuits Technology Conference (IMPACT)","volume":"1 1","pages":"443-446"},"PeriodicalIF":0.0,"publicationDate":"2011-12-29","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"75720511","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}

引用次数: 0

System-in-Packages with embedded components for modular systems 系统包与嵌入式组件的模块化系统

2011 6th International Microsystems, Packaging, Assembly and Circuits Technology Conference (IMPACT) Pub Date : 2011-12-29 DOI: 10.1109/IMPACT.2011.6117180

A. Ostmann, B. Bruehl, D. Manessis, M. Seckel, K. Lang

{"title":"System-in-Packages with embedded components for modular systems","authors":"A. Ostmann, B. Bruehl, D. Manessis, M. Seckel, K. Lang","doi":"10.1109/IMPACT.2011.6117180","DOIUrl":"https://doi.org/10.1109/IMPACT.2011.6117180","url":null,"abstract":"In coming applications a further increase of diversity and higher complexity of electronic systems is expected. As a consequence it will be an increasingly challenging and time consuming task to design these systems. Although various new components are coming up, the problem of increasing cost for system design, debugging and verification is generally not addressed by conventional technology developments. A new concept to face these challenges will be presented. It is based on the constitution of a system by miniaturised modules, each representing a complete functionality like system control, data storage or sensing. The modules are planar System-in-Packages with embedded active and passive components, having typically 4 contacts on bottom and top. Besides the hardware an integral part of each module is its firmware, a small piece of software which controls a basic functionality, e. g. sensor data filtering and the communication with other modules. The realisation of a Smart Pixel SiP with I²C bus interface and embedded components as well as the design of a modular sensor system will be described. The data communication between modules is also realised by an I²C bus. By combining these modules in different ways, various systems can be realised. The capabilities and challenges of such systems will be discussed.","PeriodicalId":6360,"journal":{"name":"2011 6th International Microsystems, Packaging, Assembly and Circuits Technology Conference (IMPACT)","volume":"9 1","pages":"294-297"},"PeriodicalIF":0.0,"publicationDate":"2011-12-29","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"73365716","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}

引用次数: 0

Solder stability for Pb-free HBGA assembly with oxygenous reflow 含氧回流的无铅HBGA组件的焊料稳定性

2011 6th International Microsystems, Packaging, Assembly and Circuits Technology Conference (IMPACT) Pub Date : 2011-12-29 DOI: 10.1109/IMPACT.2011.6117249

Tien-Tsorng Shih, Wei-Chih Chen, Win-Der Lee, Mu-Chun Wang

引用次数: 1

A high temperature MEMS heater for optical sensors 一种用于光学传感器的高温MEMS加热器

2011 6th International Microsystems, Packaging, Assembly and Circuits Technology Conference (IMPACT) Pub Date : 2011-12-29 DOI: 10.1109/IMPACT.2011.6117255

Jing-Yuan Lin, Yu-Sheng Hsieh, Shang-Chian Su

引用次数: 1

Feasibility study for copper bump with tin plating bonding by using NCP adhesive and ultrasonic bonding technique 采用NCP胶粘剂和超声粘接技术对铜凸包镀锡进行粘接的可行性研究

2011 6th International Microsystems, Packaging, Assembly and Circuits Technology Conference (IMPACT) Pub Date : 2011-12-29 DOI: 10.1109/IMPACT.2011.6117262

Jardar Yang, Hi Huang

{"title":"Feasibility study for copper bump with tin plating bonding by using NCP adhesive and ultrasonic bonding technique","authors":"Jardar Yang, Hi Huang","doi":"10.1109/IMPACT.2011.6117262","DOIUrl":"https://doi.org/10.1109/IMPACT.2011.6117262","url":null,"abstract":"The aim of this project is to develop an alternative material for bumps of LCD driver ICs and to establish a feasible packaging process for the alternative material. With the continuously escalating price of gold, an alternative material to replace the widely used gold bumps in LCD driver IC packaging is eagerly demanded. Therefore, copper bumps are selected for evaluation in this study. To comply with the oxidation-prone and higher hardness characteristics of Cu bumps, nonconductive paste (NCP) resin and ultrasonic bonding are introduced as well in the packaging process. Compared with the commonly used thermo compression bonding technology for Au-bumped LCD driver IC packaging, the ultrasonic bonding method with NCP resin employs relatively lower temperature and bonding force. In the feasibility evaluation of the Cu bumps, the objective is to achieve a bonding reliability and adhesion quality similar to or even better than that of Au bumps under thermo compression bonding. In the experiment, fine tuning of some operative parameters was executed in order to get the positive results. These operative factors include the following: (a) NCP resin viscosity, (b) NCP resin dispense pattern, (c) dispense temperatures, (d) bonding sequence, (e) bonding temperature, (f) ultrasonic power, (g) bonding force, and (h) bonding time, which play key roles in the study.","PeriodicalId":6360,"journal":{"name":"2011 6th International Microsystems, Packaging, Assembly and Circuits Technology Conference (IMPACT)","volume":"100 1","pages":"284-286"},"PeriodicalIF":0.0,"publicationDate":"2011-12-29","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"80989698","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}

引用次数: 0

Low temperature bonding of 30um pitch micro bump interconnection for 3D IC stacking using non-conductive adhesive 用非导电胶粘剂低温粘合30um间距的3D集成电路堆叠微凹凸互连

2011 6th International Microsystems, Packaging, Assembly and Circuits Technology Conference (IMPACT) Pub Date : 2011-12-29 DOI: 10.1109/IMPACT.2011.6117284

Yu-Min Lin, C. Zhan, Yu-wei Huang, Su-Ching Chung, Chia-Wen Fan, Su-Mei Chen, Yu-lan Lu, Tai-Hong Chen

{"title":"Low temperature bonding of 30um pitch micro bump interconnection for 3D IC stacking using non-conductive adhesive","authors":"Yu-Min Lin, C. Zhan, Yu-wei Huang, Su-Ching Chung, Chia-Wen Fan, Su-Mei Chen, Yu-lan Lu, Tai-Hong Chen","doi":"10.1109/IMPACT.2011.6117284","DOIUrl":"https://doi.org/10.1109/IMPACT.2011.6117284","url":null,"abstract":"For evaluating the feasibility of adhesive bonding by NCF (non-conductive film) in micro bump joints, three types of micro joints were adopted in this study. The structure of the type I micro joints was Cu/Ni/Au while that of the type II micro joints was Cu/Ni/Au micro bump joined with Cu/Sn solder micro bump. Both the type I and type II micro joint were bonded by using NCF. The structure of the type III micro joints were the same, but the type III micro joints were produced by eutectic bonding. For the type III micro joints, the micro gap between chips was wrapped by a capillary underfill. The bonding results revealed that the contact resistance of the NCF joints was in the range of 100 Qm ∼ 400 Qm which was higher than that of eutectic joints. Electrical continuity of micro bump interconnection was monitored by measuring the contact resistance of four-point Kelvin structure and daisy chain during reliability test. Thermal cycling test and thermal humidity storage test were conducted to evaluate the reliability performance of these three types of micro interconnections. The reliability test displayed that the reliability performance of eutectic joints was better than that of the NCF joints. The study showed that NCF joints have great potential to be applied in low temperature bonding of fine pitch 3D IC stacking.","PeriodicalId":6360,"journal":{"name":"2011 6th International Microsystems, Packaging, Assembly and Circuits Technology Conference (IMPACT)","volume":"24 14 1","pages":"478-481"},"PeriodicalIF":0.0,"publicationDate":"2011-12-29","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"89187641","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}

引用次数: 0

Design and implementation of 3D-thermal test chip for exploration of package effects 用于封装效果探索的3d热测试芯片的设计与实现

2011 6th International Microsystems, Packaging, Assembly and Circuits Technology Conference (IMPACT) Pub Date : 2011-12-29 DOI: 10.1109/IMPACT.2011.6117289

Jui-Hung Chien, C. Lung, Ta‐Wei Lin, Kun-Ju Tsai, Ting-Sheng Chen, Yung-Fa Chou, Ping-Hei Chen, Shih-Chieh Chang, D. Kwai

{"title":"Design and implementation of 3D-thermal test chip for exploration of package effects","authors":"Jui-Hung Chien, C. Lung, Ta‐Wei Lin, Kun-Ju Tsai, Ting-Sheng Chen, Yung-Fa Chou, Ping-Hei Chen, Shih-Chieh Chang, D. Kwai","doi":"10.1109/IMPACT.2011.6117289","DOIUrl":"https://doi.org/10.1109/IMPACT.2011.6117289","url":null,"abstract":"Thermal solution and thermal management are critical issues in either 2.5D or 3D stacking design, especially when the hotspots are not located next to the heat sink. On the other hand, chip and package designers are eager to know the realtime temperature performance of the stacked chips therefore the workload can be assigned to the proper domain. Hence, a thermal test chip for evaluating the package is proposed in this paper. The thermal sensor network based on a ring oscillator is implemented in this work. Infrared radiation microscopic is employed for inspecting the real-time temperature performance of the chip and package. Four types of package are implemented and experimented by inspection of infrared radiation thermography. The experimental results show that one of proposed design provides good temperature consistency within difference of 0.6°C with the thermal sensors. Meanwhile, the proposed package has excellent capability for evaluating thermal management of the stacked dies by providing good thermal non-uniformity by 0.035 °C/mm.","PeriodicalId":6360,"journal":{"name":"2011 6th International Microsystems, Packaging, Assembly and Circuits Technology Conference (IMPACT)","volume":"42 1","pages":"238-241"},"PeriodicalIF":0.0,"publicationDate":"2011-12-29","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"91039421","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}

引用次数: 2