含氧回流的无铅HBGA组件的焊料稳定性

2011 6th International Microsystems, Packaging, Assembly and Circuits Technology Conference (IMPACT) Pub Date : 2011-12-29 DOI:10.1109/IMPACT.2011.6117249

Tien-Tsorng Shih, Wei-Chih Chen, Win-Der Lee, Mu-Chun Wang

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引用次数: 1

摘要

在球栅阵列(BGA)封装工艺中，流动过程中的氧浓度主要影响焊点的氧化致老化效应和金属间化合物的质量。此外，助焊剂也是决定载体HBGA衬底与焊料球之间焊料粘附能力的关键因素。通过温度循环试验、剪切试验和跌落试验对不同助焊剂对HBGA衬底上无铅钎料球的粘附性能进行了对比，得出了最佳工艺配方。焊接性能令人印象深刻。

本文章由计算机程序翻译，如有差异，请以英文原文为准。

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Solder stability for Pb-free HBGA assembly with oxygenous reflow

In ball-grid-array (BGA) package technology, the oxygen concentration in flow process predominantly influences the quality of solder conjunction such as oxidation causing aged effect and quality of inter-metallic compound. In addition, the flux as solder assistance is also a key factor determining the solder adhesion ability between carrier HBGA substrate and solder ball. Using the temperature cycling test, shear test and drop test to distinguish the adhesion ability for lead-free solder balls on HBGA substrate assisted with several fluxes, the optimal process recipe was achieved. The soldering performance was impressive.

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2011 6th International Microsystems, Packaging, Assembly and Circuits Technology Conference (IMPACT)

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