Hyper-generation LEDs VCPCB

Vapor chamber (VC) has been proven the excellent heat spreading performance utilized particularly in high-power light-emitting diode (LED). As high-power LEDs array are utilized for more general lighting systems, more significant amount of heat flux being generated while it is operating. The main challenge is that the lifetime of high-brightness LEDs is easily shortened by thermal problem generated at the device junction and ambient temperature. The printed circuit board (PCB) composite made up variables of dielectric, copper and solder layer thicknesses affected the thermal performance of high-power LEDs lighting system. Therefore, combination VC and PCB (VCPCB) can perfectly serve the high-power LEDs package system. This study reports the manufacturing characteristics and utilizes experimental analysis with window program VCTM V1.0 to investigate the thermal performance of VCPCB applying in a high-brightness LED array package module. Results show that the effective thermal conductivity of the VCPCB is many times higher than that of the AlN, copper and aluminum PCB, proving that it can effectively reduce the temperature of the LEDs and obtain more uniform illuminance. And the thermal performance of the LEDs VCPCB is better than that of the LEDs Copper PCB and has the highest effective thermal conductivity of 965 W/m°C at 187.5 W/cm2. The LEDs VCPCB works out hot-spot problem of 100 Watt high-power LEDs, successfully.