IEEE Transactions on Advanced Packaging最新文献_第8页

An Integration Technology for RF and Microwave Circuits Based on Interconnect Programming 基于互连编程的射频与微波电路集成技术

IEEE Transactions on Advanced Packaging Pub Date : 2010-02-25 DOI: 10.1109/TADVP.2009.2038234

L. Rabieirad, E. Martinez, S. Mohammadi

引用次数: 2

Aligning Chips Face-to-Face for Dense Capacitive and Optical Communication 面向密集电容和光通信的芯片面对面对齐

IEEE Transactions on Advanced Packaging Pub Date : 2010-02-25 DOI: 10.1109/TADVP.2009.2037437

J. Cunningham, A. Krishnamoorthy, I. Shubin, Xuezhe Zheng, M. Asghari, D. Feng, James G. Mitchell

{"title":"Aligning Chips Face-to-Face for Dense Capacitive and Optical Communication","authors":"J. Cunningham, A. Krishnamoorthy, I. Shubin, Xuezhe Zheng, M. Asghari, D. Feng, James G. Mitchell","doi":"10.1109/TADVP.2009.2037437","DOIUrl":"https://doi.org/10.1109/TADVP.2009.2037437","url":null,"abstract":"We report a new method that precisely self-aligns face-to-face semiconductor chips or wafers to enable communication between the chips using electromagnetic waves. Our alignment mechanism takes advantage of miniaturized versions of two of nature's idealized shapes: an inverse pyramidal shape defined by a self-terminating wet-etch process in silicon and micro-spheres with radii accurate to submicron accuracy. This approach allows chips to be packaged using passive alignment that is self locating and reaches nearly one micron level of chip misalignment tolerance. Packages for applications to capacitive and optical connections are presented. Additionally, we describe a physical architecture for a multi-chip array packages with ¿bridge¿ and ¿island¿ chips where the function of the bridge is to transfer electromagnetic signals between island chips using either capacitive or optical proximity communication. The bridge chip can provide a predetermined amount of compliance to help maintain alignment and thereby accommodate topology variants in first level package or in chip thickness when required. Experimental packages providing precise alignment between 1-D arrays and 2-D arrays of chips are presented. We show that our precision alignment mechanism enables high fidelity 10 Gb/s optical-proximity-communication with reflecting mirrors micro-machined into Silicon and co-integrated to low loss silicon-on-insulator waveguides for chip-to-chip communication. The alignment mechanism was also applied to a demonstration of chip-to-chip capacitive proximity communication in a linear array of six chips. Alignment measurements on a 4 × 4 array of chips are reported.","PeriodicalId":55015,"journal":{"name":"IEEE Transactions on Advanced Packaging","volume":"33 1","pages":"389-397"},"PeriodicalIF":0.0,"publicationDate":"2010-02-25","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"https://sci-hub-pdf.com/10.1109/TADVP.2009.2037437","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"62395974","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}

引用次数: 16

Component Tolerance Effect on Ultra-Wideband Low-Noise Amplifier Performance 元件容差对超宽带低噪声放大器性能的影响

IEEE Transactions on Advanced Packaging Pub Date : 2010-02-25 DOI: 10.1109/TADVP.2010.2041348

A. Serban, M. Karlsson, Shaofang Gong

引用次数: 14

Packaging of Dual-Mode Wireless Communication Module Using RF/Optoelectronic Devices With Shared Functional Components 利用共享功能元件的射频/光电器件封装双模无线通信模块

IEEE Transactions on Advanced Packaging Pub Date : 2010-02-17 DOI: 10.1109/TADVP.2009.2038359

J. Liao, J. Zeng, Shengling Deng, A. Boryssenko, V. Joyner, Z. Huang

{"title":"Packaging of Dual-Mode Wireless Communication Module Using RF/Optoelectronic Devices With Shared Functional Components","authors":"J. Liao, J. Zeng, Shengling Deng, A. Boryssenko, V. Joyner, Z. Huang","doi":"10.1109/TADVP.2009.2038359","DOIUrl":"https://doi.org/10.1109/TADVP.2009.2038359","url":null,"abstract":"This paper reports the design, fabrication, and testing of a compact radio-frequency (RF)/ free space optical (FSO) dual mode wireless communication system. A modified split dual-director quasi-Yagi antenna is integrated with optical transmitter and receiver by sharing layout structural components. Bare die vertical-cavity surface-emitting laser (VCSEL) and P-i-N photodiode (PIN) are placed on antenna director pads and wire bonded to printed circuit board (PCB)-mounted laser driver and transimpedance amplifier (TIA) circuits. Detailed analysis of coupling between RF channel and associated electrical connections for the FSO channel is presented using commercial simulation tools to predict its impact on link degradation. Although crosstalk appears between RF and optical channels, the prototyped system demonstrated dual-mode high-rate communication capability with measured 2.5 Gb/s data rate in FSO link. Variations in RF subsystem features due to coupling from the FSO subsystem is estimated through radiation pattern measurement using near-field scanner.","PeriodicalId":55015,"journal":{"name":"IEEE Transactions on Advanced Packaging","volume":"33 1","pages":"323-332"},"PeriodicalIF":0.0,"publicationDate":"2010-02-17","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"https://sci-hub-pdf.com/10.1109/TADVP.2009.2038359","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"62396251","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}

引用次数: 11

GaN-Based Power Flip-Chip LEDs With an Internal ESD Protection Diode on Cu Sub-Mount 基于gan的内置ESD保护二极管的电源倒装led

IEEE Transactions on Advanced Packaging Pub Date : 2010-02-02 DOI: 10.1109/TADVP.2009.2037806

Y. X. Sun, W. Chen, S. Hung, K. Lam, C. H. Liu, S. Chang

引用次数: 11

The Investigation of Nano-Roughening Effect on the Reliability Enhancement of Adhesive Bond for NEMS Manufacture Application 纳米粗化对NEMS制造中粘合剂可靠性提高的影响研究

IEEE Transactions on Advanced Packaging Pub Date : 2010-02-02 DOI: 10.1109/TADVP.2009.2038235

Chia-Yeh Yang, Yu-Ting Cheng, W. Hsu

引用次数: 2

Enhanced Microstrip Guard Trace for Ringing Noise Suppression Using a Dielectric Superstrate 利用介电层抑制振铃噪声的增强型微带保护走线

IEEE Transactions on Advanced Packaging Pub Date : 2010-02-02 DOI: 10.1109/TADVP.2010.2040033

Yung-Shou Cheng, Wei-Da Guo, C. Hung, R. Wu, D. De Zutter

引用次数: 26

Fine-Pitch Capabilities of the Flat Ultra-Thin Chip Packaging (UTCP) Technology 扁平超薄芯片封装(UTCP)技术的细间距性能

IEEE Transactions on Advanced Packaging Pub Date : 2010-02-01 DOI: 10.1109/TADVP.2009.2018134

J. Govaerts, E. Bosman, W. Christiaens, J. Vanfleteren

引用次数: 16

Characterization of Next Generation Thin Low-K and Low-Loss Organic Dielectrics From 1 to 110 GHz 1 ~ 110 GHz新一代薄低k低损耗有机介质的特性研究

IEEE Transactions on Advanced Packaging Pub Date : 2010-02-01 DOI: 10.1109/TADVP.2009.2023413

Seunghyun Hwang, S. Min, Madhavan Swaminathan, Venkatesan Venkatakrishnan, H. Chan, Fuhan Liu, V. Sundaram, S. Kennedy, D. Baars, B. Lacroix, Yuan Li, J. Papapolymerou

引用次数: 20

Fast Passivity Enforcement for S-Parameter Models by Perturbation of Residue Matrix Eigenvalues 基于剩余矩阵特征值摄动的s参数模型快速无源增强

IEEE Transactions on Advanced Packaging Pub Date : 2010-02-01 DOI: 10.1109/TADVP.2008.2010508

B. Gustavsen

引用次数: 75