IEEE Transactions on Advanced Packaging最新文献

A Novel High-Capacity Electromagnetic Compression Technique Based on a Direct Matrix Solution 一种基于直接矩阵解的新型大容量电磁压缩技术

IEEE Transactions on Advanced Packaging Pub Date : 2010-12-17 DOI: 10.1109/TADVP.2010.2089788

Youngae Han, Jinsong Zhao

{"title":"A Novel High-Capacity Electromagnetic Compression Technique Based on a Direct Matrix Solution","authors":"Youngae Han, Jinsong Zhao","doi":"10.1109/TADVP.2010.2089788","DOIUrl":"https://doi.org/10.1109/TADVP.2010.2089788","url":null,"abstract":"Electromagnetic solvers based on integral equations in conjunction with the method of moments or the partial element equivalent circuit method (PEEC) proved to be popular because of their efficiency and accuracy. There is one serious drawback of the integral equation approach: it often leads to a linear system involving a full matrix. Many efficient approaches have been proposed to overcome this, largely based on compressing the matrix-vector product operation and using an iterative solver. Iterative EM solvers, however, suffer from slow convergence, which does not have a totally reliable method to address; further, large multiple right-hand sides significantly increase the solving time. In this paper, we present a novel method to compress low rank sub-block matrixes into sparse matrix to be used with a direct sparse matrix solver to obtain an efficient high-capacity electromagnetic solver based on an integral equation formulation. The full-rank system matrix is represented in a hierarchical matrix format that has its sub-matrixes compressed with numerically controllable accuracy; it is then analytically converted to a sparse matrix which is further solved by a direct sparse matrix solver. Analytically this method results in O(N (log N)2) complexity for computing the inverse of a hierarchical matrix presented in Fig. 2 where N is the number of unknowns.","PeriodicalId":55015,"journal":{"name":"IEEE Transactions on Advanced Packaging","volume":"65 1","pages":"787-793"},"PeriodicalIF":0.0,"publicationDate":"2010-12-17","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"https://sci-hub-pdf.com/10.1109/TADVP.2010.2089788","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"62400438","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}

引用次数: 0

Random Rough Surface Effects on Wave Propagation in Interconnects 随机粗糙表面对互连中波传播的影响

IEEE Transactions on Advanced Packaging Pub Date : 2010-12-17 DOI: 10.1109/TADVP.2010.2089789

L. Tsang, H. Braunisch, R. Ding, X. Gu

{"title":"Random Rough Surface Effects on Wave Propagation in Interconnects","authors":"L. Tsang, H. Braunisch, R. Ding, X. Gu","doi":"10.1109/TADVP.2010.2089789","DOIUrl":"https://doi.org/10.1109/TADVP.2010.2089789","url":null,"abstract":"To address the rough surface effects in high-speed interconnects on printed circuit boards (PCBs) and microelectronic packages, we study the electromagnetic wave propagation in a rough surface environment. In our model, the rough surface is characterized by a stochastic random process with correlation function or spectral density. This paper reviews the analytical theory, numerical simulations and experimental results based on such a model. We describe the rough surface characterization and the extraction of roughness parameters from 3D profile measurements. Initially we study the 2D case with the rough surface height function varying in only one horizontal direction and consider the case of plane wave incidence. Analytic second-order small perturbation method (SPM2) was used to obtain simple closed-form expressions for the absorption enhancement factor. The numerical transfer matrix (T-matrix) method and the method of moments (MoM) were also used. We next consider the case of the 3D problem with the rough surface height varying in both horizontal directions. We also used SPM2 to obtain a simple closed form expression for the enhancement factor. In interconnect problems, electromagnetic (EM) waves propagate in a guided wave environment. Thus, we next considered a waveguide model to study the effects of random roughness on wave propagation and compare with results from the plane wave formulation. Analytic SPM2 and numerical finite element method (FEM) with mode matching were used to obtain the enhancement factor. We also describe experimental results and correlation with the theoretical models. Finally, we explain how the enhancement factor concept used throughout lends itself to direct inclusion of rough surface effects in a wide variety of modeling problems.","PeriodicalId":55015,"journal":{"name":"IEEE Transactions on Advanced Packaging","volume":"77 1","pages":"839-856"},"PeriodicalIF":0.0,"publicationDate":"2010-12-17","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"https://sci-hub-pdf.com/10.1109/TADVP.2010.2089789","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"62400154","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}

引用次数: 52

Foreword Special Section on Recent Progress in Electrical Modeling and Simulation of High-Speed ICs and Packages 引言:关于高速集成电路和封装的电气建模和仿真的最新进展的专题部分

IEEE Transactions on Advanced Packaging Pub Date : 2010-12-17 DOI: 10.1109/TADVP.2010.2099155

D. Jiao

引用次数: 0

A Markov Chain Based Hierarchical Algorithm for Fabric-Aware Capacitance Extraction 基于马尔可夫链的织物感知电容提取分层算法

IEEE Transactions on Advanced Packaging Pub Date : 2010-12-17 DOI: 10.1109/TADVP.2010.2091504

T. El-Moselhy, Ibrahim M. Elfadel, Luca Daniel

引用次数: 16

A Thermal Simulation Process Based on Electrical Modeling for Complex Interconnect, Packaging, and 3DI Structures 基于复杂互连、封装和3DI结构电建模的热仿真过程

IEEE Transactions on Advanced Packaging Pub Date : 2010-11-01 DOI: 10.1109/TADVP.2010.2090348

Lijun Jiang, Chuan Xu, B. Rubin, A. Weger, A. Deutsch, H. Smith, A. Caron, K. Banerjee

{"title":"A Thermal Simulation Process Based on Electrical Modeling for Complex Interconnect, Packaging, and 3DI Structures","authors":"Lijun Jiang, Chuan Xu, B. Rubin, A. Weger, A. Deutsch, H. Smith, A. Caron, K. Banerjee","doi":"10.1109/TADVP.2010.2090348","DOIUrl":"https://doi.org/10.1109/TADVP.2010.2090348","url":null,"abstract":"To reduce the product development time and achieve first-pass silicon success, fast and accurate estimation of very-large-scale integration (VLSI) interconnect, packaging and 3DI (3D integrated circuits) thermal profiles has become important. Present commercial thermal analysis tools are incapable of handling very complex structures and have integration difficulties with existing design flows. Many analytical thermal models, which could provide fast estimates, are either too specific or oversimplified. This paper highlights a methodology, which exploits electrical resistance solvers for thermal simulation, to allow acquisition of thermal profiles of complex structures with good accuracy and reasonable computation cost. Moreover, a novel accurate closed-form thermal model is developed. The model allows an isotropic or anisotropic equivalent medium to replace the noncritical back-end-of-line (BEOL) regions so that the simulation complexity is dramatically reduced. Using these techniques, this paper introduces the thermal modeling of practical complex VLSI structures to facilitate thermal guideline generation. It also demonstrates the benefits of the proposed anisotropic equivalent medium approximation for real VLSI structures in terms of the accuracy and computational cost.","PeriodicalId":55015,"journal":{"name":"IEEE Transactions on Advanced Packaging","volume":"33 1","pages":"777-786"},"PeriodicalIF":0.0,"publicationDate":"2010-11-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"https://sci-hub-pdf.com/10.1109/TADVP.2010.2090348","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"62400277","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}

引用次数: 13

Accurate Characterization of Broadband Multiconductor Transmission Lines for High-Speed Digital Systems 高速数字系统宽带多导体传输线的精确表征

IEEE Transactions on Advanced Packaging Pub Date : 2010-11-01 DOI: 10.1109/TADVP.2010.2050204

Joong-Ho Kim, D. Oh, Woopoung Kim

引用次数: 55

Interfacial Design of Anisotropic Conductive Adhesive Based Interconnects Using Molecular Wires and Understanding of Their Electrical Conduction 基于分子线的各向异性导电胶粘剂互连界面设计及其导电性研究

IEEE Transactions on Advanced Packaging Pub Date : 2010-10-14 DOI: 10.1109/TADVP.2010.2081987

Rongwei Zhang, K. Moon, Wei Lin, Yiqun Duan, S. Lotz, C. Wong

引用次数: 2

A Wideband Common-Mode Suppression Filter for Bend Discontinuities in Differential Signaling Using Tightly Coupled Microstrips 基于紧密耦合微带的差分信号弯曲不连续宽带共模抑制滤波器

IEEE Transactions on Advanced Packaging Pub Date : 2010-10-04 DOI: 10.1109/TADVP.2010.2077287

C. Gazda, D. Vande Ginste, H. Rogier, R. Wu, D. De Zutter

{"title":"A Wideband Common-Mode Suppression Filter for Bend Discontinuities in Differential Signaling Using Tightly Coupled Microstrips","authors":"C. Gazda, D. Vande Ginste, H. Rogier, R. Wu, D. De Zutter","doi":"10.1109/TADVP.2010.2077287","DOIUrl":"https://doi.org/10.1109/TADVP.2010.2077287","url":null,"abstract":"A new type of bend is proposed that reduces differential-to-common mode conversion occuring at the bend discontinuity in coupled microstrip lines for high-speed digital circuits. Simultaneously, great care has been taken to minimize the differential reflection coefficient and insertion loss, leading to an overall improved signal integrity. This is achieved by tapering the microstrip lines to tightly or very tightly coupled ones in the area of the bend. Full-wave simulations in the DC to 6 GHz frequency range show that over 9 dB and 14 dB suppression of conversion noise is achieved for tightly coupled and very tightly coupled bends, respectively. Also for these new structures, with a total length of 100 mm, the insertion loss remains below 0.6 dB. Measurements on prototype bends show very good agreement with full-wave simulations. Also time domain measurements demonstrate the significant reduction in conversion noise while keeping return loss low. Moreover, for design purposes, a dedicated circuit model which closely matches the full-wave characteristics of the proposed bends is presented.","PeriodicalId":55015,"journal":{"name":"IEEE Transactions on Advanced Packaging","volume":"33 1","pages":"969-978"},"PeriodicalIF":0.0,"publicationDate":"2010-10-04","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"https://sci-hub-pdf.com/10.1109/TADVP.2010.2077287","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"62399567","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}

引用次数: 69

Transient Thermal Network Modeling Applied to Multiscale Systems. Part II: Application to an Electronic Control Unit of an Automobile 瞬态热网络建模在多尺度系统中的应用第二部分:在汽车电子控制单元中的应用

IEEE Transactions on Advanced Packaging Pub Date : 2010-10-04 DOI: 10.1109/TADVP.2010.2074201

M. Miana, C. Cortés, J. Pelegay, J. R. Valdés, T. Pütz, M. Moczala

{"title":"Transient Thermal Network Modeling Applied to Multiscale Systems. Part II: Application to an Electronic Control Unit of an Automobile","authors":"M. Miana, C. Cortés, J. Pelegay, J. R. Valdés, T. Pütz, M. Moczala","doi":"10.1109/TADVP.2010.2074201","DOIUrl":"https://doi.org/10.1109/TADVP.2010.2074201","url":null,"abstract":"This paper applies the methodology of transient thermal network modelling (TTNM) introduced in Part I to the heat transfer analysis of an electronic control unit (ECU) located in the engine enclosure of a motorcar. The complexity of the geometry, the diverse heat transfer mechanisms involved and the duration of the operating cycle prevent the use of both simple, lumped models and detailed numerical simulations. The TTNM methodology relies instead in steady, approximate heat transfer correlations and a division of the system into the largest possible isothermal elements, based on the analysis of characteristic time and length scales. The dynamic heat balance of each element is then written down, conforming the TTNM of the system, which is numerically integrated with an adequate time step. The practical aspects of the TTNM methodology (design stage) are finally demonstrated; in this particular case-study, the model reveals a very high risk of damage of electronic components due to the radiative heat load received from the exhaust pipe of the engine. A design modification consisting of a radiative shield is proposed and model-tested, achieving an appropriate reduction of heat flux and temperatures, and thus an adequate protection of critical components.","PeriodicalId":55015,"journal":{"name":"IEEE Transactions on Advanced Packaging","volume":"32 1","pages":"938-952"},"PeriodicalIF":0.0,"publicationDate":"2010-10-04","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"https://sci-hub-pdf.com/10.1109/TADVP.2010.2074201","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"62399515","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}

引用次数: 10

Transient Thermal Network Modeling Applied to Multiscale Systems. Part I: Definition and Validation 瞬态热网络建模在多尺度系统中的应用第一部分:定义和验证

IEEE Transactions on Advanced Packaging Pub Date : 2010-10-04 DOI: 10.1109/TADVP.2010.2074200

M. Miana, C. Cortés, J. Pelegay, J. R. Valdés, T. Pütz

引用次数: 8