IEEE Transactions on Advanced Packaging最新文献_第2页

A Pluggable Large Core Step Index Plastic Optical Fiber With Built-In Mode Conditioners for Gigabit Ultra Short Reach Networks 一种可插拔的大芯阶跃索引塑料光纤，内置模式调节器，用于千兆超短距离网络

IEEE Transactions on Advanced Packaging Pub Date : 2010-09-20 DOI: 10.1109/TADVP.2010.2072504

J. Chandrappan, Z. Jing, Ng Rui Jie, P. Damaruganath, J. Lau

引用次数: 3

Wafer-Level Vacuum Packaging of Micromachined Thermoelectric IR Sensors 微机械热电红外传感器的晶片级真空封装

IEEE Transactions on Advanced Packaging Pub Date : 2010-09-20 DOI: 10.1109/TADVP.2010.2072925

Dehui Xu, E. Jing, B. Xiong, Yuelin Wang

{"title":"Wafer-Level Vacuum Packaging of Micromachined Thermoelectric IR Sensors","authors":"Dehui Xu, E. Jing, B. Xiong, Yuelin Wang","doi":"10.1109/TADVP.2010.2072925","DOIUrl":"https://doi.org/10.1109/TADVP.2010.2072925","url":null,"abstract":"In the trend towards low-cost, high-performance, and miniaturization, a wafer-level vacuum package is developed for micromachined thermoelectric infrared (IR) sensor. An IR sensor wafer and a cap wafer are bonded together in a vacuum chamber using Au-Au thermocompression bonding, where the cap wafer not only protects the floating thermopile structure but also selects IR light for the sensor. The device fabrication and Au-Au thermocompression hermetic bonding process as well as the packaged IR sensor characterization is presented in this paper. Experimental results show that the wafer-level vacuum packaged IR sensor has a four times higher responsivity and detectivity than the IR sensor with atmosphere pressure package, which confirms the IR performance improvement due to vacuum packaging. IR microscope image of the packaged device proved that the Au-Au thermocompression bonding process is compatible to the handling of fragile micromachined thermopile structure. Average leak rate and shear strength are, respectively, 3.9 × 10-9 atm cc/s and 16.709 Kgf, which shows that the Au-Au thermocompression hermetic bonding is suitable for the wafer-level vacuum packaging of micromachined thermoelectric IR sensor.","PeriodicalId":55015,"journal":{"name":"IEEE Transactions on Advanced Packaging","volume":"61 1","pages":"904-911"},"PeriodicalIF":0.0,"publicationDate":"2010-09-20","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"https://sci-hub-pdf.com/10.1109/TADVP.2010.2072925","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"62399850","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}

引用次数: 44

Proximity Lithography in Sub-10 Micron Circuitry for Packaging Substrate 亚10微米封装基板电路中的接近光刻技术

IEEE Transactions on Advanced Packaging Pub Date : 2010-09-16 DOI: 10.1109/TADVP.2010.2072505

Fengtao Wang, Fuhan Liu, Linghua Kong, V. Sundaram, R. Tummala, A. Adibi

引用次数: 4

Design of a Controllable Delay Line 可控延迟线的设计

IEEE Transactions on Advanced Packaging Pub Date : 2010-08-16 DOI: 10.1109/TADVP.2010.2064166

A. Kabiri, Qing He, Mohammed H. Kermani, Omar M. Ramahi

{"title":"Design of a Controllable Delay Line","authors":"A. Kabiri, Qing He, Mohammed H. Kermani, Omar M. Ramahi","doi":"10.1109/TADVP.2010.2064166","DOIUrl":"https://doi.org/10.1109/TADVP.2010.2064166","url":null,"abstract":"Delay lines are used in printed circuit boards (PCBs) to produce delay between two points (or devices) while occupying as little board space as possible. As higher clock frequency is used in circuits, electromagnetic coupling between adjacent traces of delay line increases. The coupling that takes place between all the parallel adjoining traces combines synchronously or asynchronously to cause dispersion. Consequently, simple analytic techniques that predict delay line behavior are ineffective to predict precise delay and costly full-wave modeling or measurement becomes essential. In this paper, we consider microstrip meander delay lines and study the effect of the number of segments on resulting delay using full-wave modeling and measurement. We show that for short segments and when the number of segments is large enough, the resulting delay per segment is almost uniform and does not change as the number of segments increases. We show a linear relationship between the number of segments and the total delay, thus allowing for simple delay line design without the prohibitive cost of full-wave three-dimensional modeling of the entire delay line structure. Demonstration of these findings is supported by numerical simulations and experimental measurement.","PeriodicalId":55015,"journal":{"name":"IEEE Transactions on Advanced Packaging","volume":"33 1","pages":"1080-1087"},"PeriodicalIF":0.0,"publicationDate":"2010-08-16","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"https://sci-hub-pdf.com/10.1109/TADVP.2010.2064166","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"62399307","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}

引用次数: 15

High Quality and Low Loss Millimeter Wave Passives Demonstrated to 77-GHz for SiP Technologies Using Embedded Wafer-Level Packaging Platform (EMWLP) 基于嵌入式晶圆级封装平台(EMWLP)的77 ghz SiP技术高质量低损耗毫米波无源演示

IEEE Transactions on Advanced Packaging Pub Date : 2010-08-16 DOI: 10.1109/TADVP.2010.2058849

Y. Lim, Xianghua Xiao, S. Vempati, N. Su, Aditya Kumar, G. Sharma, T. Lim, K. Vaidyanathan, Jinglin Shi, J. Lau, Shiguo Liu

{"title":"High Quality and Low Loss Millimeter Wave Passives Demonstrated to 77-GHz for SiP Technologies Using Embedded Wafer-Level Packaging Platform (EMWLP)","authors":"Y. Lim, Xianghua Xiao, S. Vempati, N. Su, Aditya Kumar, G. Sharma, T. Lim, K. Vaidyanathan, Jinglin Shi, J. Lau, Shiguo Liu","doi":"10.1109/TADVP.2010.2058849","DOIUrl":"https://doi.org/10.1109/TADVP.2010.2058849","url":null,"abstract":"With the increasing demand for system integration to cater to continuously increasing number of I/Os as well as higher operating frequencies, reconfigured wafer-level packaging, or embedded WLP (EMWLP) is emerging as a promising technology for integration. This platform allows integrated passives to be designed in the redistribution layers using the mold compound as a substrate, which significantly improves the passives performance compared to those of on-chip. In this paper, we present low loss passives on EMWLP platform demonstrated in a 5.5-GHz band pass filter targeted for wireless local area network (WLAN) applications. To ascertain the feasibility of designing for low loss millimeter wave passives on EMWLP, transmission lines were designed and their loss characteristics investigated up to 110 GHz, which are reported here. Subsequently we demonstrate for the first time a narrowband low loss 77-GHz band pass filter on EMWLP platform, with a good correlation obtained between simulation and measurement results. In addition, a temperature dependence characterization was performed on the 77-GHz filter, with little variation in the measured filter characteristics observed.","PeriodicalId":55015,"journal":{"name":"IEEE Transactions on Advanced Packaging","volume":"33 1","pages":"1061-1071"},"PeriodicalIF":0.0,"publicationDate":"2010-08-16","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"https://sci-hub-pdf.com/10.1109/TADVP.2010.2058849","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"62399393","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}

引用次数: 23

Issues in the Use of Thermal Transients to Achieve Accurate Time-Constant Spectrums and Differential Structure Functions 利用热瞬变实现精确的时间常数光谱和微分结构函数的问题

IEEE Transactions on Advanced Packaging Pub Date : 2010-08-16 DOI: 10.1109/TADVP.2010.2049572

M. Salleras, M. Carmona, S. Marco

{"title":"Issues in the Use of Thermal Transients to Achieve Accurate Time-Constant Spectrums and Differential Structure Functions","authors":"M. Salleras, M. Carmona, S. Marco","doi":"10.1109/TADVP.2010.2049572","DOIUrl":"https://doi.org/10.1109/TADVP.2010.2049572","url":null,"abstract":"An analysis of accuracy of time-constant spectrum extraction from thermal transients has been performed. Numerical calculations based on analytical models and finite element method simulations have been used in order to obtain the thermal transients. Simple geometries have been used such that analytical expressions for their time-constant spectrums are known. Results show that a large error in the time-constant spectrum is obtained for very small rms error (<;1 mK) in the thermal transient. The estimation problem is ill-conditioned. Moreover, the differential structure function shows a low accuracy identifying stacked structures. The initial part of the differential structure function shows numerical oscillations and the final part has an asymptotic behavior to infinity that has been identified as an artifact related to errors in the time-constant spectrum estimation. Peak identification from the differential structure function heavily depends on an accurate determination of the time-constant spectrum. The limited spectral resolution and dynamic range of the differential structure function are a direct consequence of the time-constant spectrum imprecision.","PeriodicalId":55015,"journal":{"name":"IEEE Transactions on Advanced Packaging","volume":"33 1","pages":"918-923"},"PeriodicalIF":0.0,"publicationDate":"2010-08-16","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"https://sci-hub-pdf.com/10.1109/TADVP.2010.2049572","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"62398452","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}

引用次数: 8

Guard Trace Design for Improvement on Transient Waveforms and Eye Diagrams of Serpentine Delay Lines 改进蛇形延迟线瞬态波形和眼图的保护道设计

IEEE Transactions on Advanced Packaging Pub Date : 2010-08-16 DOI: 10.1109/TADVP.2010.2064165

G. Shiue, C. Chao, R. Wu

引用次数: 19

Compromise Impedance Match Design for Pogo Pins With Different Single-Ended and Differential Signal-Ground Patterns 不同单端和差分信号地模式Pogo引脚的折衷阻抗匹配设计

IEEE Transactions on Advanced Packaging Pub Date : 2010-08-16 DOI: 10.1109/TADVP.2010.2044794

Ruey-Bo Sun, R. Wu, Shih-Wei Hsiao, D. De Zutter

{"title":"Compromise Impedance Match Design for Pogo Pins With Different Single-Ended and Differential Signal-Ground Patterns","authors":"Ruey-Bo Sun, R. Wu, Shih-Wei Hsiao, D. De Zutter","doi":"10.1109/TADVP.2010.2044794","DOIUrl":"https://doi.org/10.1109/TADVP.2010.2044794","url":null,"abstract":"A new concept of compromise impedance match design is proposed for pogo pins with various signal-ground patterns. To begin with, the methodologies of equivalent circuit modeling for single-ended and differential pogo pins are described. A de-embedding technique is proposed to eliminate the effect of a specialized test fixture for the characterization of the pogo pins. Good agreement is found from the comparison between measured and simulated results, which validates the modeling and simulation methodologies. Then, the reflection of pogo pins with various signal-ground patterns is investigated and the optimal pin radius to pitch ratio is found to be 0.20-0.21, thereby achieving a return loss better than 15 dB for all these patterns in both single-ended and differential configurations from dc to 10 GHz. In addition, the effects of pin length are considered and a general design chart is constructed for determining the pogo pin geometry and the applicable impedance range to meet the specification on the return loss. Several compromise impedance design applications demonstrating the proposed methods are given.","PeriodicalId":55015,"journal":{"name":"IEEE Transactions on Advanced Packaging","volume":"33 1","pages":"953-960"},"PeriodicalIF":0.0,"publicationDate":"2010-08-16","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"https://sci-hub-pdf.com/10.1109/TADVP.2010.2044794","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"62397007","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}

引用次数: 13

A Theoretically Rigorous Full-Wave Finite-Element-Based Solution of Maxwell's Equations From dc to High Frequencies 麦克斯韦方程组从直流到高频的理论上严格的全波有限元解

IEEE Transactions on Advanced Packaging Pub Date : 2010-08-09 DOI: 10.1109/TADVP.2010.2057428

J. Zhu, D. Jiao

{"title":"A Theoretically Rigorous Full-Wave Finite-Element-Based Solution of Maxwell's Equations From dc to High Frequencies","authors":"J. Zhu, D. Jiao","doi":"10.1109/TADVP.2010.2057428","DOIUrl":"https://doi.org/10.1109/TADVP.2010.2057428","url":null,"abstract":"It has been observed that finite element based solutions of full-wave Maxwell's equations break down at low frequencies. In this paper, we present a theoretically rigorous method to fundamentally eliminate the low-frequency breakdown problem. The key idea of this method is that the original frequency-dependent deterministic problem can be rigorously solved from a generalized eigenvalue problem that is frequency independent. In addition, we found that the zero eigenvalues of the generalized eigenvalue problem cannot be obtained as zeros because of finite machine precision. We hence correct the inexact zero eigenvalues to be exact zeros. The validity and accuracy of the proposed method have been demonstrated by the analysis of both lossless and lossy problems having on-chip circuit dimensions from dc to high frequencies. The proposed method is applicable to any frequency. Hence it constitutes a universal solution of Maxwell's equations in a full electromagnetic spectrum. The proposed method can be used to not only fundamentally eliminate the low-frequency breakdown problem, but also benchmark the accuracy of existing electromagnetic solvers at low frequencies including static solvers. Such a benchmark does not exist yet because full-wave solvers break down while static solvers involve theoretical approximations.","PeriodicalId":55015,"journal":{"name":"IEEE Transactions on Advanced Packaging","volume":"33 1","pages":"1043-1050"},"PeriodicalIF":0.0,"publicationDate":"2010-08-09","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"https://sci-hub-pdf.com/10.1109/TADVP.2010.2057428","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"62399163","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}

引用次数: 39

A Homogeneous Electrically Conductive Silver Paste 一种均匀的导电银浆料

IEEE Transactions on Advanced Packaging Pub Date : 2010-08-09 DOI: 10.1109/TADVP.2010.2062182

Jianguo Liu, Yu Cao, Xiaoye Wang, J. Duan, Xiaoyan Zeng

引用次数: 3