IEEE Transactions on Advanced Packaging最新文献_第3页

Waveform Relaxation Time Domain Solver for Subsystem Arrays 子系统阵列的波形松弛时域求解器

IEEE Transactions on Advanced Packaging Pub Date : 2010-08-05 DOI: 10.1109/TADVP.2010.2061229

G. Antonini, A. Ruehli

引用次数: 10

Tapered Through-Silicon-Via Interconnects for Wafer-Level Packaging of Sensor Devices 用于传感器器件晶圆级封装的锥形通硅互连

IEEE Transactions on Advanced Packaging Pub Date : 2010-08-03 DOI: 10.1109/TADVP.2009.2026950

J. Leib, F. Bieck, U. Hansen, Kok-Kheong Looi, H. Ngo, V. Seidemann, D. Shariff, D. Studzinski, N. Suthiwongsunthorn, K. Tan, R. Wilke, Kwong-Loon Yam, M. Töpper

引用次数: 12

IR-DROP Analysis and Thermal Assessment of Planar Electromagnetic Bandgap Structures for Power Integrity Applications 用于电源完整性的平面电磁带隙结构的IR-DROP分析和热评估

IEEE Transactions on Advanced Packaging Pub Date : 2010-08-01 DOI: 10.1109/TADVP.2009.2033572

F. Paulis, L. Raimondo, Antonio Orlandi

引用次数: 40

Design and Fabrication of Large-Area, Redundant, Stretchable Interconnect Meshes Using Excimer Laser Photoablation and In Situ Masking 利用准分子激光光烧蚀和原位掩模设计和制造大面积、冗余、可拉伸的互连网

IEEE Transactions on Advanced Packaging Pub Date : 2010-08-01 DOI: 10.1109/TADVP.2009.2032158

K. L. Lin, J. Chae, K. Jain

{"title":"Design and Fabrication of Large-Area, Redundant, Stretchable Interconnect Meshes Using Excimer Laser Photoablation and In Situ Masking","authors":"K. L. Lin, J. Chae, K. Jain","doi":"10.1109/TADVP.2009.2032158","DOIUrl":"https://doi.org/10.1109/TADVP.2009.2032158","url":null,"abstract":"Stretchable interconnects play an important role towards the realization of the realm of systems that include large-area sensor skins and wearable electronics. These interconnects must be reliable and robust for viability, and must be flexible, stretchable, and conformable to nonplanar surfaces for diverse applicability. This research describes the design, modeling, fabrication, and testing of stretchable interconnects on polymer substrates using metal patterns both as functional interconnect layers and as in situ masks for excimer laser photoablation. The fluences for photoablation of polymers are generally much lower than the threshold fluence for removal or damage of metals; thus, metal thin films that are designed as structural layers in the sensor skin can be used as in situ masks for polymers if the proper fluence is used. Self-aligned single-layer and multilayer interconnects of various designs (rectilinear and “meandering”) have been fabricated, and certain “meandering” interconnect designs can be stretched up to 50% uniaxially while maintaining good electrical conductivity and structural integrity. Furthermore, redundant interconnect meshes have been modeled and fabricated that increase the viability of the interconnect mesh while stretching up to 30% uniaxially and a prototype redundant interconnect mesh has been fabricated using seamless-scanning large-area fabrication techniques.","PeriodicalId":55015,"journal":{"name":"IEEE Transactions on Advanced Packaging","volume":"33 1","pages":"592-601"},"PeriodicalIF":0.0,"publicationDate":"2010-08-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"https://sci-hub-pdf.com/10.1109/TADVP.2009.2032158","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"62394270","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}

引用次数: 27

Self-Consistent Simulation of Opto-Electronic Circuits Using a Modified Nodal Analysis Formulation 基于改进节点分析公式的光电电路自洽仿真

IEEE Transactions on Advanced Packaging Pub Date : 2010-07-29 DOI: 10.1109/TADVP.2010.2054089

P. Gunupudi, T. Smy, J. Klein, Z. Jakubczyk

{"title":"Self-Consistent Simulation of Opto-Electronic Circuits Using a Modified Nodal Analysis Formulation","authors":"P. Gunupudi, T. Smy, J. Klein, Z. Jakubczyk","doi":"10.1109/TADVP.2010.2054089","DOIUrl":"https://doi.org/10.1109/TADVP.2010.2054089","url":null,"abstract":"This paper addresses the need for self-consistent simulation of mixed electrical and optical circuits and systems. Drawing on the use of modified nodal analysis (MNA) techniques ubiquitous in circuit simulation, an optical node is formulated which includes the magnitude and phase of the optical signal being simulated. This node consists of two propagating complex envelopes one for the forward direction and the other for the reverse direction. Using this formulation models are developed for a variety of devices including: lasers, photodiodes, multimode fiber, and optical connectors. The formulation allows for definition of multiple optical channels at different carrier frequencies, enables quick simulation of systems with large optical delays and optical interference effects. Several numerical examples are presented in this paper to illustrate the capability of the proposed framework and where practicable the results were compared to commercial simulators. These examples include a multimode fiber optical link, an integrated array of laser sources and a feedback controlled laser source used in a optical link with modulation achieved by the use of an electro-absorption device.","PeriodicalId":55015,"journal":{"name":"IEEE Transactions on Advanced Packaging","volume":"33 1","pages":"979-993"},"PeriodicalIF":0.0,"publicationDate":"2010-07-29","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"https://sci-hub-pdf.com/10.1109/TADVP.2010.2054089","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"62398991","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}

引用次数: 35

Low-Frequency and Low-Cost Test Methodology for Integrated RF Substrates 集成射频基板的低频低成本测试方法

IEEE Transactions on Advanced Packaging Pub Date : 2010-07-29 DOI: 10.1109/TADVP.2010.2052923

A. Goyal, M. Swaminathan, A. Chatterjee

{"title":"Low-Frequency and Low-Cost Test Methodology for Integrated RF Substrates","authors":"A. Goyal, M. Swaminathan, A. Chatterjee","doi":"10.1109/TADVP.2010.2052923","DOIUrl":"https://doi.org/10.1109/TADVP.2010.2052923","url":null,"abstract":"A low-cost test method is proposed for testing integrated radio-frequency (RF) substrates with embedded RF passive filters. The proposed method enables the testing of embedded high-frequency gigahertz filters by the analysis of low-frequency signal of the order of 100 MHz. In addition, the test method allows the testing without injecting external test stimulus into RF filters. Hence, significant reduction in the test cost is achieved by the proposed test method. As compared to the conventional test method which uses vector network analyzer (VNA), the proposed method reduces the test-setup cost by around 75%. The proposed test method relies on three core principles. First, the RF filter is made a part of the feedback network of an external RF amplifier circuit located on the probe card, thereby causing the amplifier to oscillate. Second, the output spectrum of the amplifier (GHz) is down-converted to a lower frequency (MHz) to facilitate test response measurement. Third, RF (GHz) specifications of the filters are predicted by the analysis of the low-frequency (MHz) test-setup output. Both parametric and catastrophic failures in the embedded high-frequency (GHz) passive filter can be detected at low-frequency (MHz) by monitoring the change in the oscillation frequency of the proposed test setup. The test method is demonstrated with both simulations and measurements.","PeriodicalId":55015,"journal":{"name":"IEEE Transactions on Advanced Packaging","volume":"33 1","pages":"669-680"},"PeriodicalIF":0.0,"publicationDate":"2010-07-29","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"https://sci-hub-pdf.com/10.1109/TADVP.2010.2052923","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"62398809","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}

引用次数: 3

An LU Decomposition Based Direct Integral Equation Solver of Linear Complexity and Higher-Order Accuracy for Large-Scale Interconnect Extraction 基于LU分解的线性复杂度和高阶精度的大规模互连提取直接积分方程求解器

IEEE Transactions on Advanced Packaging Pub Date : 2010-07-26 DOI: 10.1109/TADVP.2010.2053537

Wenwen Chai, D. Jiao

引用次数: 21

Reliability and Flexibility of Ultra-Thin Chip-on-Flex (UTCOF) Interconnects With Anisotropic Conductive Adhesive (ACA) Joints 各向异性导电胶(ACA)接头的超薄挠性芯片(UTCOF)互连的可靠性和灵活性

IEEE Transactions on Advanced Packaging Pub Date : 2010-07-26 DOI: 10.1109/TADVP.2010.2052806

Su-Tsai Lu, Wen-Hwa Chen

{"title":"Reliability and Flexibility of Ultra-Thin Chip-on-Flex (UTCOF) Interconnects With Anisotropic Conductive Adhesive (ACA) Joints","authors":"Su-Tsai Lu, Wen-Hwa Chen","doi":"10.1109/TADVP.2010.2052806","DOIUrl":"https://doi.org/10.1109/TADVP.2010.2052806","url":null,"abstract":"The need for flexible interconnects in advanced applications in consumer electronic products is increasing rapidly. The reliability and flexibility of ultra-thin chip-on-flex (UTCOF) interconnects formed using anisotropic conductive adhesive (ACA) are thus investigated. Two films of ACA materials, namely ACA-P and ACA-F, are assembled at different bonding temperatures to study the effect of temperature on the adhesion at the substrate-adhesive and adhesive-chip interfaces using differential scanning calorimetry (DSC) and a 90° peeling test. The contact resistance of a daisy chain with 188 input/output (I/O) is measured to examine the quality of bonding through dummy test samples with an 80-μm pitch. The reliability of the fabricated UTCOF interconnects bonded via selected ACA joints is evaluated by performing an 85°C/85% RH thermal humidity storage test (THST) for 1000 h, and their flexibility is evaluated in static bending and four-point bending tests. The interfaces between the ultra-thin silicon chip and the substrate of failed samples in the THST and four-point bending testing are then investigated by scanning electron microscopy (SEM), which is utilized to obtain cross-sectional images. Finite element analysis is also conducted to elucidate the failure mechanism of the UTCOF interconnects in the four-point bending test. The averaged maximum allowable deflections of the fabricated UTCOF interconnects with ACA-P and ACA-F materials are 26% and 168%, respectively, higher than those of the COF interconnects with a chip thickness of 670 μm. Moreover, the contact resistance remains stable, varying by less than 10%, in the static bending test with a bending radius of 30 mm. According to the results thus obtained, give the appropriate choice of an ACA material and the optimal curing conditions, the UTCOF interconnects with ACA joints reliably serve as flexible interconnects for use in consumer electronic products.","PeriodicalId":55015,"journal":{"name":"IEEE Transactions on Advanced Packaging","volume":"33 1","pages":"702-712"},"PeriodicalIF":0.0,"publicationDate":"2010-07-26","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"https://sci-hub-pdf.com/10.1109/TADVP.2010.2052806","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"62398898","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}

引用次数: 29

Physics-Based Gridding for Electrical Package Analysis Codes 基于物理的电气包分析代码网格划分

IEEE Transactions on Advanced Packaging Pub Date : 2010-07-26 DOI: 10.1109/TADVP.2010.2052360

Barry J. Rubin

引用次数: 0

Passivity Check of $S$-Parameter Descriptor Systems via $S$-Parameter Generalized Hamiltonian Methods 用广义哈密顿方法检验$S$参数描述子系统的无源性

IEEE Transactions on Advanced Packaging Pub Date : 2010-07-19 DOI: 10.1109/TADVP.2010.2052807

Zheng Zhang, N. Wong

引用次数: 20