IR-DROP Analysis and Thermal Assessment of Planar Electromagnetic Bandgap Structures for Power Integrity Applications

F. Paulis, L. Raimondo, Antonio Orlandi
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引用次数: 40

Abstract

This paper investigates the relationship among the high-frequency performances of a planar electromagnetic bandgap structure for power integrity applications and its static (dc) behavior. The IR-Drop and the thermal performances are accurately investigated through 3-D simulations. Measurements of the high-frequency electromagnetic properties and of the temperature variation are also performed for validating the models employed in the analysis.
用于电源完整性的平面电磁带隙结构的IR-DROP分析和热评估
本文研究了用于电源完整性应用的平面电磁带隙结构的高频性能与其静态(直流)性能之间的关系。通过三维仿真准确地研究了红外降和热性能。为了验证分析中使用的模型,还进行了高频电磁特性和温度变化的测量。
本文章由计算机程序翻译,如有差异,请以英文原文为准。
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来源期刊
IEEE Transactions on Advanced Packaging
IEEE Transactions on Advanced Packaging 工程技术-材料科学:综合
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