{"title":"IR-DROP Analysis and Thermal Assessment of Planar Electromagnetic Bandgap Structures for Power Integrity Applications","authors":"F. Paulis, L. Raimondo, Antonio Orlandi","doi":"10.1109/TADVP.2009.2033572","DOIUrl":null,"url":null,"abstract":"This paper investigates the relationship among the high-frequency performances of a planar electromagnetic bandgap structure for power integrity applications and its static (dc) behavior. The IR-Drop and the thermal performances are accurately investigated through 3-D simulations. Measurements of the high-frequency electromagnetic properties and of the temperature variation are also performed for validating the models employed in the analysis.","PeriodicalId":55015,"journal":{"name":"IEEE Transactions on Advanced Packaging","volume":"115 1","pages":"617-622"},"PeriodicalIF":0.0000,"publicationDate":"2010-08-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"https://sci-hub-pdf.com/10.1109/TADVP.2009.2033572","citationCount":"40","resultStr":null,"platform":"Semanticscholar","paperid":null,"PeriodicalName":"IEEE Transactions on Advanced Packaging","FirstCategoryId":"1085","ListUrlMain":"https://doi.org/10.1109/TADVP.2009.2033572","RegionNum":0,"RegionCategory":null,"ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"","JCRName":"","Score":null,"Total":0}
引用次数: 40
Abstract
This paper investigates the relationship among the high-frequency performances of a planar electromagnetic bandgap structure for power integrity applications and its static (dc) behavior. The IR-Drop and the thermal performances are accurately investigated through 3-D simulations. Measurements of the high-frequency electromagnetic properties and of the temperature variation are also performed for validating the models employed in the analysis.