{"title":"用于电源完整性的平面电磁带隙结构的IR-DROP分析和热评估","authors":"F. Paulis, L. Raimondo, Antonio Orlandi","doi":"10.1109/TADVP.2009.2033572","DOIUrl":null,"url":null,"abstract":"This paper investigates the relationship among the high-frequency performances of a planar electromagnetic bandgap structure for power integrity applications and its static (dc) behavior. The IR-Drop and the thermal performances are accurately investigated through 3-D simulations. Measurements of the high-frequency electromagnetic properties and of the temperature variation are also performed for validating the models employed in the analysis.","PeriodicalId":55015,"journal":{"name":"IEEE Transactions on Advanced Packaging","volume":"115 1","pages":"617-622"},"PeriodicalIF":0.0000,"publicationDate":"2010-08-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"https://sci-hub-pdf.com/10.1109/TADVP.2009.2033572","citationCount":"40","resultStr":"{\"title\":\"IR-DROP Analysis and Thermal Assessment of Planar Electromagnetic Bandgap Structures for Power Integrity Applications\",\"authors\":\"F. Paulis, L. Raimondo, Antonio Orlandi\",\"doi\":\"10.1109/TADVP.2009.2033572\",\"DOIUrl\":null,\"url\":null,\"abstract\":\"This paper investigates the relationship among the high-frequency performances of a planar electromagnetic bandgap structure for power integrity applications and its static (dc) behavior. The IR-Drop and the thermal performances are accurately investigated through 3-D simulations. Measurements of the high-frequency electromagnetic properties and of the temperature variation are also performed for validating the models employed in the analysis.\",\"PeriodicalId\":55015,\"journal\":{\"name\":\"IEEE Transactions on Advanced Packaging\",\"volume\":\"115 1\",\"pages\":\"617-622\"},\"PeriodicalIF\":0.0000,\"publicationDate\":\"2010-08-01\",\"publicationTypes\":\"Journal Article\",\"fieldsOfStudy\":null,\"isOpenAccess\":false,\"openAccessPdf\":\"https://sci-hub-pdf.com/10.1109/TADVP.2009.2033572\",\"citationCount\":\"40\",\"resultStr\":null,\"platform\":\"Semanticscholar\",\"paperid\":null,\"PeriodicalName\":\"IEEE Transactions on Advanced Packaging\",\"FirstCategoryId\":\"1085\",\"ListUrlMain\":\"https://doi.org/10.1109/TADVP.2009.2033572\",\"RegionNum\":0,\"RegionCategory\":null,\"ArticlePicture\":[],\"TitleCN\":null,\"AbstractTextCN\":null,\"PMCID\":null,\"EPubDate\":\"\",\"PubModel\":\"\",\"JCR\":\"\",\"JCRName\":\"\",\"Score\":null,\"Total\":0}","platform":"Semanticscholar","paperid":null,"PeriodicalName":"IEEE Transactions on Advanced Packaging","FirstCategoryId":"1085","ListUrlMain":"https://doi.org/10.1109/TADVP.2009.2033572","RegionNum":0,"RegionCategory":null,"ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"","JCRName":"","Score":null,"Total":0}
IR-DROP Analysis and Thermal Assessment of Planar Electromagnetic Bandgap Structures for Power Integrity Applications
This paper investigates the relationship among the high-frequency performances of a planar electromagnetic bandgap structure for power integrity applications and its static (dc) behavior. The IR-Drop and the thermal performances are accurately investigated through 3-D simulations. Measurements of the high-frequency electromagnetic properties and of the temperature variation are also performed for validating the models employed in the analysis.
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