IEEE Transactions on Advanced Packaging最新文献_第4页

A Multidimensional Krylov Reduction Technique With Constraint Variables to Model Nonlinear Distributed Networks 非线性分布式网络的约束变量多维Krylov约简技术

IEEE Transactions on Advanced Packaging Pub Date : 2010-07-19 DOI: 10.1109/TADVP.2010.2042808

E. Rasekh, A. Dounavis

引用次数: 2

Modeling and Analysis of Power Supply Noise Imbalance on Ultra High Frequency Differential Low Noise Amplifiers in a System-in-Package 系统级封装中超高频差分低噪声放大器电源噪声不平衡建模与分析

IEEE Transactions on Advanced Packaging Pub Date : 2010-07-19 DOI: 10.1109/TADVP.2010.2047395

Kyoungchoul Koo, Yujeong Shim, C. Yoon, Jaemin Kim, Jeongsik Yoo, J. Pak, Joungho Kim

引用次数: 11

Alignment and Performance Considerations for Capacitive, Inductive, and Optical Proximity Communication 电容式、电感式和光学近距离通信的对准和性能考虑

IEEE Transactions on Advanced Packaging Pub Date : 2010-07-01 DOI: 10.1109/TADVP.2010.2049355

A. Majumdar, J. Cunningham, A. Krishnamoorthy

{"title":"Alignment and Performance Considerations for Capacitive, Inductive, and Optical Proximity Communication","authors":"A. Majumdar, J. Cunningham, A. Krishnamoorthy","doi":"10.1109/TADVP.2010.2049355","DOIUrl":"https://doi.org/10.1109/TADVP.2010.2049355","url":null,"abstract":"We present a comparative analysis of different physical approaches to chip-to-chip proximity communication, PxC, based on capacitive, inductive and optical signalling. Each method is modeled theoretically and the tolerances for packaging are identified. Analytical formulas for performance in terms of the pad size and pad spacing are derived and compared to reported experimental data. The tolerance of each communication method to misalignment is reported. The design space in terms of channel density and chip separation for capacitive and inductive proximity communication is explored for a specified bit-error-rate (BER) or signal-to-noise ratio (SNR) and transmitter power or voltage. The relative merits of each technology are discussed. A general conclusion is that capacitive proximity communication is advantageous for dense communication with small pads at low voltages and when low raw bit-error rates are required; however a hard requirement for vertical separation between chips is identified, independent of the area of the pads, and fixed by the supply voltage and the technology parameters. On the other hand, inductive communication provides a larger working range of chip separations, and is advantageous when larger pad sizes are used; however the minimum voltage is similarly constrained in order to maintain low bit-error rates. Optical proximity communication potentially provides the largest chip separations, but has low tolerance to in-plane misalignment.","PeriodicalId":55015,"journal":{"name":"IEEE Transactions on Advanced Packaging","volume":"33 1","pages":"690-701"},"PeriodicalIF":0.0,"publicationDate":"2010-07-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"https://sci-hub-pdf.com/10.1109/TADVP.2010.2049355","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"62397936","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}

引用次数: 26

Optical Chip-to-Chip Link System by Using Optical Wiring Method for Reducing EMI 利用光布线方法降低电磁干扰的光片对片链路系统

IEEE Transactions on Advanced Packaging Pub Date : 2010-06-28 DOI: 10.1109/TADVP.2010.2049018

In-Kui Cho, J. Yun, M. Jeong, Hyo-Hoon Park

引用次数: 2

Electromagnetic Modeling of Through-Silicon Via (TSV) Interconnections Using Cylindrical Modal Basis Functions 利用圆柱模态基函数对硅通孔互连进行电磁建模

IEEE Transactions on Advanced Packaging Pub Date : 2010-06-28 DOI: 10.1109/TADVP.2010.2050769

K. Han, Madhavan Swaminathan, T. Bandyopadhyay

引用次数: 105

Parameterized Model Order Reduction of Electromagnetic Systems Using Multiorder Arnoldi 基于多阶Arnoldi的电磁系统参数化模型降阶

IEEE Transactions on Advanced Packaging Pub Date : 2010-06-14 DOI: 10.1109/TADVP.2010.2050203

M. Ahmadloo, A. Dounavis

引用次数: 30

Electro-Thermo-Mechanical Characterizations of Various Wire Bonding Interconnects Illuminated by an Electromagnetic Pulse 电磁脉冲照射下各种线键连接的电-热-机械特性

IEEE Transactions on Advanced Packaging Pub Date : 2010-06-03 DOI: 10.1109/TADVP.2010.2048902

Fan-Zhi Kong, W. Yin, J. Mao, Qingtang Liu

{"title":"Electro-Thermo-Mechanical Characterizations of Various Wire Bonding Interconnects Illuminated by an Electromagnetic Pulse","authors":"Fan-Zhi Kong, W. Yin, J. Mao, Qingtang Liu","doi":"10.1109/TADVP.2010.2048902","DOIUrl":"https://doi.org/10.1109/TADVP.2010.2048902","url":null,"abstract":"A comprehensive electro-thermo-mechanical transient investigation is carried out to characterize time-dependent thermal and mechanical responses of metal wire bonding interconnects, as they suffer from the impact of an electromagnetic pulse (EMP) with different current or voltage waveforms. In our mathematical implementation, a hybrid time-domain finite element method is applied to simulate mutual interactions among electrical, thermal, and mechanical fields, with all nonlinearities of temperature-dependent electrical conductivities, thermal conductivities, thermal expansion coefficients, and even the Young's modulus of materials being treated appropriately. The developed algorithm is partially validated by computing transient temperature and thermal stress of other interconnects with good agreement with reference results. Parametric studies are performed to show the effects of EMP waveform parameters, geometrical and physical parameters of various wire bonding interconnects on their transient thermal and mechanical responses, thus providing basic information for their electromagnetic protection so as to suppress the impact of an intentional EMP.","PeriodicalId":55015,"journal":{"name":"IEEE Transactions on Advanced Packaging","volume":"33 1","pages":"729-737"},"PeriodicalIF":0.0,"publicationDate":"2010-06-03","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"https://sci-hub-pdf.com/10.1109/TADVP.2010.2048902","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"62397781","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}

引用次数: 40

Multiparameter Sensitivity Analysis of Multiple Coupled Vias in Board and Package Structures for Early Design and Optimization 板封装结构中多耦合过孔的多参数灵敏度分析及早期设计与优化

IEEE Transactions on Advanced Packaging Pub Date : 2010-05-27 DOI: 10.1109/TADVP.2010.2047723

Ying Li, V. Jandhyala

引用次数: 6

A Hierarchical Simulation Flow for Return-Loss Optimization of Microprocessor Package Vertical Interconnects 微处理器封装垂直互连回波损耗优化的分层仿真流程

IEEE Transactions on Advanced Packaging Pub Date : 2010-05-27 DOI: 10.1109/TADVP.2010.2049490

A. Sathanur, Vikram Jandhyala, Henning Braunisch

{"title":"A Hierarchical Simulation Flow for Return-Loss Optimization of Microprocessor Package Vertical Interconnects","authors":"A. Sathanur, Vikram Jandhyala, Henning Braunisch","doi":"10.1109/TADVP.2010.2049490","DOIUrl":"https://doi.org/10.1109/TADVP.2010.2049490","url":null,"abstract":"Design of package- and board-level interconnects utilizing full-wave electromagnetic solvers, is becoming increasingly important owing to increased frequencies of operation, miniaturization, and reduced time to market. Thus, parameterization, optimization, and statistical analysis tools are becoming an invaluable part of a designer's armory. Leveraging a previously developed fast full-wave electromagnetic solver, this paper addresses the development of a framework for package interconnect design. Parametric sweeps are conducted to show the existence of optimal designs and to select the best routing strategies. Having applied the popular response surface methodology for optimization and having outlined its limitations for higher-dimensional problems, a general optimization scheme is proposed and illustrated on a differential package interconnect line. The proposed methodology features a dimensionality reduction scheme and a reusable, multidimensional look-up table preceding the global optimization phase, which is facilitated by a smooth interpolation scheme based on splines. The second phase features a custom local optimizer incorporating all the variables without any dimension reduction. This methodology has been applied to automated synthesis of a differential package line resulting in a significant improvement of the return loss performance. A statistical analysis methodology, based on utilizing the gradient, has been presented to arrive at the spread in the differential return loss, occurring due to manufacturing tolerances, around the designed response.","PeriodicalId":55015,"journal":{"name":"IEEE Transactions on Advanced Packaging","volume":"33 1","pages":"1021-1033"},"PeriodicalIF":0.0,"publicationDate":"2010-05-27","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"https://sci-hub-pdf.com/10.1109/TADVP.2010.2049490","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"62398214","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}

引用次数: 10

A 3-D X-Band T/R Module Package With an Anodized Aluminum Multilayer Substrate for Phased Array Radar Applications 一种用于相控阵雷达的3-D x波段T/R模块封装与阳极化铝多层基板

IEEE Transactions on Advanced Packaging Pub Date : 2010-05-27 DOI: 10.1109/TADVP.2010.2049109

Sung-Ku Yeo, Jong-Hoon Chun, Young-Se Kwon

{"title":"A 3-D X-Band T/R Module Package With an Anodized Aluminum Multilayer Substrate for Phased Array Radar Applications","authors":"Sung-Ku Yeo, Jong-Hoon Chun, Young-Se Kwon","doi":"10.1109/TADVP.2010.2049109","DOIUrl":"https://doi.org/10.1109/TADVP.2010.2049109","url":null,"abstract":"This paper presents the design and development of a compact 3-D transmit/receive (T/R) module with a selectively anodized aluminum multilayer package for X-band phased array radar applications. The proposed multilayer package consists of anodized aluminum substrates and vertical interconnects with embedded vias. The proposed package platform is based on thick anodized aluminum oxide layers and active bare chips directly mounted on bulk aluminum substrates for high electrical isolation and an effective heat sink. With its combination of thin-film embedded passive components and multilayer structure, the proposed module features a compact size of 20 mm × 20 mm, with a package height of 3.7 mm. To transfer radio-frequency (RF) signals vertically, we used coaxial hermetic seal vias with characteristic 50 Ω impedances and embedded anodized aluminum vias with a solder ball attachment and flip-chip bonding. The optimized vertical interconnect structure demonstrates RF characteristics with an insertion loss of less than 1.55 dB and a return loss of less than 12.25 dB over a broad bandwidth ranging from 0.1 to 10 GHz. The fabricated X-band 3-D T/R module has a maximum transmit output power of 39.81 dBm (9.5 W), a maximum transmit gain of 41.25 dB, and a receive gain of 19.15 dB over the 9-10 GHz frequency band. The RF-signal phase amplitude control is achieved by means of a 6 bit phase shifter with an rms accuracy of more than 5° and a gain setting range of 24 dB with an rms accuracy of more than 1.5 dB. The proposed multilayer aluminum package has the advantages of reducing the module size, decreasing the cost, and managing the thermal problem for X-band high-power T/R module package applications.","PeriodicalId":55015,"journal":{"name":"IEEE Transactions on Advanced Packaging","volume":"33 1","pages":"883-891"},"PeriodicalIF":0.0,"publicationDate":"2010-05-27","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"https://sci-hub-pdf.com/10.1109/TADVP.2010.2049109","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"62397564","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}

引用次数: 46