Modeling and Analysis of Power Supply Noise Imbalance on Ultra High Frequency Differential Low Noise Amplifiers in a System-in-Package

Kyoungchoul Koo, Yujeong Shim, C. Yoon, Jaemin Kim, Jeongsik Yoo, J. Pak, Joungho Kim
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引用次数: 11

Abstract

In this paper, we analyze the power supply noise imbalance and its effects on simultaneous switching noise coupling to an ultra high frequency differential low noise amplifier (LNA) in a system-in-package (SiP) through an off-chip power distribution network (PDN). On and off-chip sources of power supply noise imbalance in a LNA in a SiP were analyzed. A simultaneous switching noise coupling coefficient for the differential LNA output caused by power supply noise imbalance was simulated through co-modeling a hierarchical on and off-chip PDN. The simulation results were validated by measuring the simultaneous switching noise coupling voltage at the differential LNA output. Further validation of four types of a LNA with different PDN designs demonstrates that simultaneous switching noise coupling to the differential LNA output caused by power supply noise imbalance highly depends on the design of the PDN of the SiP.
系统级封装中超高频差分低噪声放大器电源噪声不平衡建模与分析
本文通过片外配电网络(PDN)分析了系统级封装(SiP)中电源噪声不平衡及其对同时开关噪声耦合到超高频差分低噪声放大器(LNA)的影响。分析了SiP中LNA电源噪声不平衡的片内和片外来源。通过对层次化片上和片外PDN共同建模,模拟了由电源噪声不平衡引起的差分LNA输出同时开关噪声耦合系数。通过测量差分LNA输出端的同步开关噪声耦合电压,验证了仿真结果。对采用不同PDN设计的四种LNA的进一步验证表明,由电源噪声不平衡引起的同时交换噪声耦合到差分LNA输出高度依赖于SiP的PDN设计。
本文章由计算机程序翻译,如有差异,请以英文原文为准。
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来源期刊
IEEE Transactions on Advanced Packaging
IEEE Transactions on Advanced Packaging 工程技术-材料科学:综合
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