利用共享功能元件的射频/光电器件封装双模无线通信模块

J. Liao, J. Zeng, Shengling Deng, A. Boryssenko, V. Joyner, Z. Huang
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引用次数: 11

摘要

本文报道了一种小型射频/自由空间光双模无线通信系统的设计、制造和测试。一种改进的分体式双指向性准八木天线通过共享布局结构元件与光发射接收机集成在一起。裸模垂直腔面发射激光器(VCSEL)和P-i-N光电二极管(PIN)被放置在天线导向垫上,导线粘接在印刷电路板(PCB)上安装的激光驱动器和跨阻放大器(TIA)电路上。详细分析了射频信道和FSO信道的相关电气连接之间的耦合,并使用商业仿真工具来预测其对链路退化的影响。尽管射频和光信道之间存在串扰,但原型系统在FSO链路中显示了双模高速率通信能力,测量数据速率为2.5 Gb/s。通过使用近场扫描仪的辐射方向图测量,估计了由于来自FSO子系统的耦合而导致的射频子系统特征的变化。
本文章由计算机程序翻译,如有差异,请以英文原文为准。
Packaging of Dual-Mode Wireless Communication Module Using RF/Optoelectronic Devices With Shared Functional Components
This paper reports the design, fabrication, and testing of a compact radio-frequency (RF)/ free space optical (FSO) dual mode wireless communication system. A modified split dual-director quasi-Yagi antenna is integrated with optical transmitter and receiver by sharing layout structural components. Bare die vertical-cavity surface-emitting laser (VCSEL) and P-i-N photodiode (PIN) are placed on antenna director pads and wire bonded to printed circuit board (PCB)-mounted laser driver and transimpedance amplifier (TIA) circuits. Detailed analysis of coupling between RF channel and associated electrical connections for the FSO channel is presented using commercial simulation tools to predict its impact on link degradation. Although crosstalk appears between RF and optical channels, the prototyped system demonstrated dual-mode high-rate communication capability with measured 2.5 Gb/s data rate in FSO link. Variations in RF subsystem features due to coupling from the FSO subsystem is estimated through radiation pattern measurement using near-field scanner.
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来源期刊
IEEE Transactions on Advanced Packaging
IEEE Transactions on Advanced Packaging 工程技术-材料科学:综合
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