Component Tolerance Effect on Ultra-Wideband Low-Noise Amplifier Performance

A. Serban, M. Karlsson, Shaofang Gong
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引用次数: 14

Abstract

A study of the component tolerances on an ultra-wideband (UWB) low-noise amplifier designed on a conventional printed circuit board is presented in this paper. The low-noise amplifier design employs dual-section input and output microstrip matching networks for wideband operation with a low noise figure and a flat power gain. First, the effect of passive component and manufacturing process tolerances on the low-noise amplifier performance is theoretically studied by means of sensitivity analyses. Second, simulation and measurement results are presented for verification of the analytical results. It is shown that, compared with a lumped matching network design, a microstrip matching network design significantly reduces the UWB low-noise amplifier sensitivity to component tolerances.
元件容差对超宽带低噪声放大器性能的影响
本文研究了在传统印刷电路板上设计的超宽带(UWB)低噪声放大器的元件公差。低噪声放大器设计采用双段输入和输出微带匹配网络进行宽带操作,具有低噪声系数和平坦功率增益。首先,通过灵敏度分析,从理论上研究了无源元件公差和制造工艺公差对低噪声放大器性能的影响。其次,给出了仿真和测量结果来验证分析结果。结果表明,与集总匹配网络设计相比,微带匹配网络设计显著降低了UWB低噪声放大器对元件容差的灵敏度。
本文章由计算机程序翻译,如有差异,请以英文原文为准。
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来源期刊
IEEE Transactions on Advanced Packaging
IEEE Transactions on Advanced Packaging 工程技术-材料科学:综合
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