IEEE Transactions on Electromagnetic Compatibility最新文献_第8页

Passive Intermodulation Model Based on Conductors Cross-Section for Printed Transmission Line 基于印刷传输线导体截面的无源互调模型

IF 2 3区计算机科学

IEEE Transactions on Electromagnetic Compatibility Pub Date : 2024-12-16 DOI: 10.1109/TEMC.2024.3511254

Mingtai Li;Tuanjie Li

{"title":"Passive Intermodulation Model Based on Conductors Cross-Section for Printed Transmission Line","authors":"Mingtai Li;Tuanjie Li","doi":"10.1109/TEMC.2024.3511254","DOIUrl":"10.1109/TEMC.2024.3511254","url":null,"abstract":"When the cross section of a transmission line (TL) with a complex shape affects the internal electromagnetic field distribution of the conductor, it is necessary to combine the numerical method and the cross-sectional shape of the conductor to calculate the electrothermal passive intermodulation (ET PIM) current density caused by the uneven current distribution. Therefore, to analyze the influence of TL cross-sectional geometry on ET PIM, an ET PIM model of TL considering conductor cross-sectional geometry and transmission loss is derived. In the model, the modified gradient model is defined to characterize the nonlinear conductivity and conductor loss. Meanwhile, the PIM measurement experiments of the microstrip line, meshed microstrip line and parallel plate waveguide are designed to compare numerical solutions of the ET PIM3 model. Finally, numerical analyses of cross-sectional geometry effects on ET PIM3 generation are made to explain the phenomenon of ET PIM3 measurement. Combined with the measurement results, the numerical solution shows that the ET PIM produced in the high current density region is affected by the cross-sectional geometry, frequency offset, and thermal flux.","PeriodicalId":55012,"journal":{"name":"IEEE Transactions on Electromagnetic Compatibility","volume":"67 2","pages":"634-643"},"PeriodicalIF":2.0,"publicationDate":"2024-12-16","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"142832620","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":3,"RegionCategory":"计算机科学","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}

引用次数: 0

Design of an LISN for Low-Frequency Conducted Emissions Measurement 设计用于低频传导发射测量的 LISN

IF 2 3区计算机科学

IEEE Transactions on Electromagnetic Compatibility Pub Date : 2024-12-16 DOI: 10.1109/TEMC.2024.3510390

Lu Wan;Arun D. Khilnani;Xinglong Wu;Xiaokang Liu;Sergio A. Pignari;David W. P. Thomas;Mark Sumner;Flavia Grassi

{"title":"Design of an LISN for Low-Frequency Conducted Emissions Measurement","authors":"Lu Wan;Arun D. Khilnani;Xinglong Wu;Xiaokang Liu;Sergio A. Pignari;David W. P. Thomas;Mark Sumner;Flavia Grassi","doi":"10.1109/TEMC.2024.3510390","DOIUrl":"10.1109/TEMC.2024.3510390","url":null,"abstract":"In this article, a line impedance stabilization network (LISN) with frequency bandwidth extended down to 2 kHz is designed, to address low-frequency measurement not currently <styled-content>aligned</styled-content> by the IEC and CISPR standards. <styled-content>For instance, different evaluation methods and limits are defined for the frequency range from 2 to 150 kHz in IEC 61000-4-7, IEC 61000-4-30, and CISPR 16-2-1.</styled-content> To this end, the limitations of existing LISNs for conducted emission (CE) measurement are first investigated, and a two-stage cascaded filter LISN topology is designed by resorting to multiobjective optimization. To ensure the desired performance, the influence of component tolerance and parasitic effects are studied. Eventually, <styled-content>an</styled-content> LISN prototype was manufactured and characterized. It was proven that the proposed LISN assures <styled-content>improved performance in terms of decoupling factor, voltage division factor, and LISN impedance</styled-content> in the frequency interval starting from 2 kHz.","PeriodicalId":55012,"journal":{"name":"IEEE Transactions on Electromagnetic Compatibility","volume":"67 2","pages":"351-361"},"PeriodicalIF":2.0,"publicationDate":"2024-12-16","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"142832106","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":3,"RegionCategory":"计算机科学","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}

引用次数: 0

MIMO Performance and Uncertainty Analysis in a Reverberation Chamber With Phase Stirring 相位搅拌混响室内MIMO性能及不确定度分析

IF 2 3区计算机科学

IEEE Transactions on Electromagnetic Compatibility Pub Date : 2024-12-13 DOI: 10.1109/TEMC.2024.3507287

Yifan Wang;Hanzhi Ma;Gangzha Liu;Er-Ping Li

{"title":"MIMO Performance and Uncertainty Analysis in a Reverberation Chamber With Phase Stirring","authors":"Yifan Wang;Hanzhi Ma;Gangzha Liu;Er-Ping Li","doi":"10.1109/TEMC.2024.3507287","DOIUrl":"10.1109/TEMC.2024.3507287","url":null,"abstract":"Source-stirred reverberation chamber (SSRC) is a typical type of reverberation chambers (RCs) that can produce an electromagnetic environment suitable for electromagnetic compatibility (EMC) testing without a mechanical stirrer. This article proposes an SSRC based on phased array antennas, which achieves stirring by changing the phase difference, helping to improve test efficiency and reduce costs. The stirring effects and the multiple-input multiple-output (MIMO) performance of SSRC is investigated, with a focus on the measurement and uncertainty analysis of the Rician <italic>K</i>-factor. The results demonstrate that the phase stirring method can achieve sufficient stirring. Moreover, four sample selection methods are employed to evaluate the measurement uncertainty. It is found that the correlation matrix method yielding the smallest relative uncertainty among them, approximately 1.2<inline-formula><tex-math>$%$</tex-math></inline-formula> at 10 GHz. Through a uniformity and MIMO performance test, this article demonstrates the potential of phase stirring technology in EMC and MIMO over-the-air testing, providing a significant option for improving efficiency and reducing costs.","PeriodicalId":55012,"journal":{"name":"IEEE Transactions on Electromagnetic Compatibility","volume":"67 1","pages":"42-50"},"PeriodicalIF":2.0,"publicationDate":"2024-12-13","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"142820984","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":3,"RegionCategory":"计算机科学","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}

引用次数: 0

GHz-Range Modeling of Power Integrity in an Array of Simultaneously Switching Power Converters 同时开关的功率转换器阵列的 GHz 范围功率完整性建模

IF 2 3区计算机科学

IEEE Transactions on Electromagnetic Compatibility Pub Date : 2024-12-13 DOI: 10.1109/TEMC.2024.3509375

Gabriel Nobert;Nicolas G. Constantin;Yves Blaquière

{"title":"GHz-Range Modeling of Power Integrity in an Array of Simultaneously Switching Power Converters","authors":"Gabriel Nobert;Nicolas G. Constantin;Yves Blaquière","doi":"10.1109/TEMC.2024.3509375","DOIUrl":"10.1109/TEMC.2024.3509375","url":null,"abstract":"Power integrity issues and voltage fluctuations on power rails in emerging system-in-packages (SiP) that integrate switch-mode converters can impede the performances of embedded sensitive analog devices. Indeed, the progress of power device downsizing allows higher switching frequencies and shorter switching times, which create significant high-frequency switching noise in power rails. More specifically for converters that operate under a range of loading, gate driving and biasing conditions, a behavioral model is necessary in the context where simulation only is not sufficient for proper prediction of the power integrity characteristics of a system under that range of conditions. This article proposes a power integrity model and a characterization methodology to predict voltage fluctuations on the power rails in simultaneous switching conditions on an array of switch-mode converters integrated in SiP. Results show that for every condition studied in this work, accuracy better than 6 dB, aside from some limited discrete frequencies, is obtained between <inline-formula><tex-math>$0$</tex-math></inline-formula> and 1.9 <inline-formula><tex-math>$text{G}$</tex-math></inline-formula><inline-formula><tex-math>$text{Hz}$</tex-math></inline-formula> when the fluctuations caused by a single or multiple converters are measured. In terms of overall shape, for every condition studied both under simultaneous switching or not, the variance-normalized mean squared error is in a worst case of 0.624 and under numerous conditions better than 0.25.","PeriodicalId":55012,"journal":{"name":"IEEE Transactions on Electromagnetic Compatibility","volume":"67 1","pages":"316-327"},"PeriodicalIF":2.0,"publicationDate":"2024-12-13","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"142820740","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":3,"RegionCategory":"计算机科学","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}

引用次数: 0

Intelligent Prediction Method for Radiation Emission of Printed Circuit Board by Using Deep Learning 基于深度学习的印刷电路板辐射发射智能预测方法

IF 2 3区计算机科学

IEEE Transactions on Electromagnetic Compatibility Pub Date : 2024-12-13 DOI: 10.1109/TEMC.2024.3491822

Kai Wei;Dan Shi;Chengyu Li;Yanchi Liu;Na Sun;Dan Xiao;Xingguo Jiang

{"title":"Intelligent Prediction Method for Radiation Emission of Printed Circuit Board by Using Deep Learning","authors":"Kai Wei;Dan Shi;Chengyu Li;Yanchi Liu;Na Sun;Dan Xiao;Xingguo Jiang","doi":"10.1109/TEMC.2024.3491822","DOIUrl":"10.1109/TEMC.2024.3491822","url":null,"abstract":"This article introduces a novel deep learning approach, utilizing a seq2seq model, to predict far-field radiation emissions (REs) in high-density, multilayer, and complex printed circuit boards (PCBs). To address the challenges of weak long-term dependencies and information ambiguity arising from excessively long network sequences in RE prediction for complex PCBs, our method begins by tokenizing and modeling each network combination. These combinations are then fed into the seq2seq model for training, supplemented with a multihead attention mechanism to enhance information connectivity. To validate the model's accuracy and efficiency, we compared our prediction results with those obtained from traditional full-wave electromagnetic simulations. Our approach significantly reduces the RE prediction time for the entire board from several hours to nearly one second. Moreover, the model exhibits high performance in RE prediction, with a mean absolute error of approximately 0.001 V/m. To verify the model's reliability, we applied the trained model to predict RE for brand-new entire boards and key networks, demonstrating its ability to accurately predict RE in previously unseen PCBs. Therefore, this method can be implemented for intelligent, full-automatic RE prediction in practical applications.","PeriodicalId":55012,"journal":{"name":"IEEE Transactions on Electromagnetic Compatibility","volume":"66 6","pages":"2027-2038"},"PeriodicalIF":2.0,"publicationDate":"2024-12-13","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"142820741","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":3,"RegionCategory":"计算机科学","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}

引用次数: 0

Investigation of Thin Absorber With Big Incident Angle Absorption and RCS Reduction 大入射角吸收和减小RCS的薄吸收体研究

IF 2 3区计算机科学

IEEE Transactions on Electromagnetic Compatibility Pub Date : 2024-12-13 DOI: 10.1109/TEMC.2024.3506939

Chaoyi Ma;Haoran Xing;Yue Wu;Mengjun Wang;Chao Fan;Hongxing Zheng;Erping Li

引用次数: 0

A Slot-Type Ez Probe With a Lower Effective Center 低有效中心槽型Ez探针

IF 2 3区计算机科学

IEEE Transactions on Electromagnetic Compatibility Pub Date : 2024-12-11 DOI: 10.1109/TEMC.2024.3503725

Yu Tian;Xing-Chang Wei;Di Wang;Richard Xian-Ke Gao

引用次数: 0

Modeling and Suppression of Common-Mode Current Resonance in an All-in-One Motor Drive Module of Electric Vehicle 电动汽车一体化电机驱动模块共模电流谐振建模与抑制

IF 2 3区计算机科学

IEEE Transactions on Electromagnetic Compatibility Pub Date : 2024-12-11 DOI: 10.1109/TEMC.2024.3503070

Zhaocheng Zhong;Zili Zhu;Jing Sun;Henglin Chen

{"title":"Modeling and Suppression of Common-Mode Current Resonance in an All-in-One Motor Drive Module of Electric Vehicle","authors":"Zhaocheng Zhong;Zili Zhu;Jing Sun;Henglin Chen","doi":"10.1109/TEMC.2024.3503070","DOIUrl":"10.1109/TEMC.2024.3503070","url":null,"abstract":"In all-in-one motor drive module of electric vehicle, common-mode (CM) current resonance seriously affects the electromagnetic compatibility (EMC) performance of the motor drive module. To achieve low-cost and effective elimination of CM current resonance, it is necessary to construct an all-in-one motor drive module electromagnetic interference (EMI) model and find out the relevant influencing factors. Due to complex structures, it is difficult to extract the parasitic parameters of dc busbar and bus capacitor in the all-in-one module. This article proposes an extraction method for stray inductance of dc busbar based on current-oscillation frequency, and builds a high-frequency model of multiport bus capacitor based on partial element equivalent circuit and genetic algorithm method. Accordingly, an overall EMI coupling model of the all-in-one module is constructed. The accuracy of the EMI model is verified by comparing simulation results with measurement results. Based on the EMI model, sensitivity analysis is performed to identify the primary CM resonant paths, and resonance mechanism of CM current of the system is analyzed. To eliminate CM current resonance, an EMC quantitative design method is developed. Experiments are performed to validate the effectiveness of the EMC quantitative design method. The problem of CM current resonance in the all-in-one motor drive module is solved effectively.","PeriodicalId":55012,"journal":{"name":"IEEE Transactions on Electromagnetic Compatibility","volume":"67 2","pages":"477-486"},"PeriodicalIF":2.0,"publicationDate":"2024-12-11","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"142809224","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":3,"RegionCategory":"计算机科学","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}

引用次数: 0

Effect of a Longitudinal Aperture's Position Uncertainty on the Electromagnetic Fields Excited in a Finite Length Cylindrical Cavity 纵向孔径位置不确定性对有限长圆柱腔内电磁场的影响

IF 2 3区计算机科学

IEEE Transactions on Electromagnetic Compatibility Pub Date : 2024-12-09 DOI: 10.1109/TEMC.2024.3506623

Secil E. Dogan;Joel T. Johnson;Robert J. Burkholder

引用次数: 0

A High-Efficiency Crosstalk Control Method of the Staggered High-Speed via Array in PCB for Chiplet-Based System 基于芯片系统的PCB交错高速通孔阵列的高效串扰控制方法

IF 2 3区计算机科学

IEEE Transactions on Electromagnetic Compatibility Pub Date : 2024-12-04 DOI: 10.1109/TEMC.2024.3502412

Ruan Jiang;Xianglong Wang;DongDong Chen;DI Li;Yingtang Yang

{"title":"A High-Efficiency Crosstalk Control Method of the Staggered High-Speed via Array in PCB for Chiplet-Based System","authors":"Ruan Jiang;Xianglong Wang;DongDong Chen;DI Li;Yingtang Yang","doi":"10.1109/TEMC.2024.3502412","DOIUrl":"10.1109/TEMC.2024.3502412","url":null,"abstract":"In this research, a high-efficiency crosstalk control method of the staggered high-speed via array in printed circuit board for Chiplet-based system is developed based on the neural network (NN) model and particle swarm optimization (PSO) algorithm. Based on the high frequency structure simulator (HFSS) and Q3D software, the simulation results of the staggered high-speed via array are obtained. The complex relationship among the structural parameters, crosstalk indexes, and characteristic impedance of the staggered high-speed via array is described by NN model. Then, the structural parameters of the staggered high-speed via array are optimized by PSO algorithm according to the multiobjective function including eight crosstalk indexes and eight characteristic impedance indexes. According to the optimized structural parameters, the effectiveness is verified through the finite element simulation. The simulated indexes agree with the desired indexes. In the four cases, the maximum error between the simulated and optimized indexes is 2.00%, which indicates that the developed method can accurately optimize the structural parameters of the staggered high-speed via array to control the crosstalk and characteristic impedance. Therefore, the developed high-efficiency design method can achieve the performance indexes control of the staggered high-speed via array, which can improve the performance of Chiplet-based system.","PeriodicalId":55012,"journal":{"name":"IEEE Transactions on Electromagnetic Compatibility","volume":"67 2","pages":"619-633"},"PeriodicalIF":2.0,"publicationDate":"2024-12-04","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"142776648","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":3,"RegionCategory":"计算机科学","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}

引用次数: 0