Alberto Gascón Bravo;Luis Manuel Diaz Angulo;Ferran Silva;Marcos Quílez;Kenan Tekbaş;Salvador G. García
{"title":"多导体传输线求解器与电路求解器Ngspice的杂交处理线路互连和终端","authors":"Alberto Gascón Bravo;Luis Manuel Diaz Angulo;Ferran Silva;Marcos Quílez;Kenan Tekbaş;Salvador G. García","doi":"10.1109/TEMC.2025.3560361","DOIUrl":null,"url":null,"abstract":"This article presents the hybridization of a multiconductor transmission line (MTL) solver, implemented using the finite-difference time-domain method, with the circuit solver ngspice to treat the terminations and interconnections of transmission lines. Transient analysis and crosstalk in MTLs have been widely studied, but the line terminations and the connections between lines are mostly restricted to lumped resistors, inductors and capacitors (RLC) components. However, realistic systems, such as power distribution or communication systems, typically involve more complex and a priori unknown connections. By integrating the MTL solver with a circuit solver, the proposed approach enables the inclusion of any component for which a circuit model can be written or already exists, i.e., dispersive elements, such as ferrites, and electronic components, such as diodes, amplifiers, or transistors. This capability makes it possible to simulate the MTL networks with complex, including nonlinear, terminations and interconnections modeled by circuits. The proposed method is validated through comparison with experimental laboratory measurements.","PeriodicalId":55012,"journal":{"name":"IEEE Transactions on Electromagnetic Compatibility","volume":"67 3","pages":"931-939"},"PeriodicalIF":2.5000,"publicationDate":"2025-04-28","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"https://ieeexplore.ieee.org/stamp/stamp.jsp?tp=&arnumber=10978881","citationCount":"0","resultStr":"{\"title\":\"Hybridization of Multiconductor Transmission Line Solver With Circuit Solver Ngspice to Treat Line Interconnections and Terminations\",\"authors\":\"Alberto Gascón Bravo;Luis Manuel Diaz Angulo;Ferran Silva;Marcos Quílez;Kenan Tekbaş;Salvador G. García\",\"doi\":\"10.1109/TEMC.2025.3560361\",\"DOIUrl\":null,\"url\":null,\"abstract\":\"This article presents the hybridization of a multiconductor transmission line (MTL) solver, implemented using the finite-difference time-domain method, with the circuit solver ngspice to treat the terminations and interconnections of transmission lines. Transient analysis and crosstalk in MTLs have been widely studied, but the line terminations and the connections between lines are mostly restricted to lumped resistors, inductors and capacitors (RLC) components. However, realistic systems, such as power distribution or communication systems, typically involve more complex and a priori unknown connections. By integrating the MTL solver with a circuit solver, the proposed approach enables the inclusion of any component for which a circuit model can be written or already exists, i.e., dispersive elements, such as ferrites, and electronic components, such as diodes, amplifiers, or transistors. This capability makes it possible to simulate the MTL networks with complex, including nonlinear, terminations and interconnections modeled by circuits. The proposed method is validated through comparison with experimental laboratory measurements.\",\"PeriodicalId\":55012,\"journal\":{\"name\":\"IEEE Transactions on Electromagnetic Compatibility\",\"volume\":\"67 3\",\"pages\":\"931-939\"},\"PeriodicalIF\":2.5000,\"publicationDate\":\"2025-04-28\",\"publicationTypes\":\"Journal Article\",\"fieldsOfStudy\":null,\"isOpenAccess\":false,\"openAccessPdf\":\"https://ieeexplore.ieee.org/stamp/stamp.jsp?tp=&arnumber=10978881\",\"citationCount\":\"0\",\"resultStr\":null,\"platform\":\"Semanticscholar\",\"paperid\":null,\"PeriodicalName\":\"IEEE Transactions on Electromagnetic Compatibility\",\"FirstCategoryId\":\"94\",\"ListUrlMain\":\"https://ieeexplore.ieee.org/document/10978881/\",\"RegionNum\":3,\"RegionCategory\":\"计算机科学\",\"ArticlePicture\":[],\"TitleCN\":null,\"AbstractTextCN\":null,\"PMCID\":null,\"EPubDate\":\"\",\"PubModel\":\"\",\"JCR\":\"Q3\",\"JCRName\":\"ENGINEERING, ELECTRICAL & ELECTRONIC\",\"Score\":null,\"Total\":0}","platform":"Semanticscholar","paperid":null,"PeriodicalName":"IEEE Transactions on Electromagnetic Compatibility","FirstCategoryId":"94","ListUrlMain":"https://ieeexplore.ieee.org/document/10978881/","RegionNum":3,"RegionCategory":"计算机科学","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"Q3","JCRName":"ENGINEERING, ELECTRICAL & ELECTRONIC","Score":null,"Total":0}
Hybridization of Multiconductor Transmission Line Solver With Circuit Solver Ngspice to Treat Line Interconnections and Terminations
This article presents the hybridization of a multiconductor transmission line (MTL) solver, implemented using the finite-difference time-domain method, with the circuit solver ngspice to treat the terminations and interconnections of transmission lines. Transient analysis and crosstalk in MTLs have been widely studied, but the line terminations and the connections between lines are mostly restricted to lumped resistors, inductors and capacitors (RLC) components. However, realistic systems, such as power distribution or communication systems, typically involve more complex and a priori unknown connections. By integrating the MTL solver with a circuit solver, the proposed approach enables the inclusion of any component for which a circuit model can be written or already exists, i.e., dispersive elements, such as ferrites, and electronic components, such as diodes, amplifiers, or transistors. This capability makes it possible to simulate the MTL networks with complex, including nonlinear, terminations and interconnections modeled by circuits. The proposed method is validated through comparison with experimental laboratory measurements.
期刊介绍:
IEEE Transactions on Electromagnetic Compatibility publishes original and significant contributions related to all disciplines of electromagnetic compatibility (EMC) and relevant methods to predict, assess and prevent electromagnetic interference (EMI) and increase device/product immunity. The scope of the publication includes, but is not limited to Electromagnetic Environments; Interference Control; EMC and EMI Modeling; High Power Electromagnetics; EMC Standards, Methods of EMC Measurements; Computational Electromagnetics and Signal and Power Integrity, as applied or directly related to Electromagnetic Compatibility problems; Transmission Lines; Electrostatic Discharge and Lightning Effects; EMC in Wireless and Optical Technologies; EMC in Printed Circuit Board and System Design.