IEEE Transactions on Electromagnetic Compatibility最新文献

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Failure Analysis of PLCs Under High Power Electromagnetic Pulses 大功率电磁脉冲下 PLC 的故障分析
IF 2.1 3区 计算机科学
IEEE Transactions on Electromagnetic Compatibility Pub Date : 2024-08-29 DOI: 10.1109/temc.2024.3446845
Yong Li, Jianguo Wang, Haiyan Xie, Hui Yan, Feng Qin, Yayun Dong, Hailiang Qiao, Maoyu Zhang, Xinyang Zhai, Xin Nie, Wei Wang
{"title":"Failure Analysis of PLCs Under High Power Electromagnetic Pulses","authors":"Yong Li, Jianguo Wang, Haiyan Xie, Hui Yan, Feng Qin, Yayun Dong, Hailiang Qiao, Maoyu Zhang, Xinyang Zhai, Xin Nie, Wei Wang","doi":"10.1109/temc.2024.3446845","DOIUrl":"https://doi.org/10.1109/temc.2024.3446845","url":null,"abstract":"","PeriodicalId":55012,"journal":{"name":"IEEE Transactions on Electromagnetic Compatibility","volume":"97 1","pages":""},"PeriodicalIF":2.1,"publicationDate":"2024-08-29","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"142100918","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":3,"RegionCategory":"计算机科学","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 0
Chip-Backside Vulnerability to Intentional Electromagnetic Interference in Integrated Circuits 集成电路中芯片背面易受有意电磁干扰影响的问题
IF 2 3区 计算机科学
IEEE Transactions on Electromagnetic Compatibility Pub Date : 2024-08-28 DOI: 10.1109/TEMC.2024.3440919
Takuya Wadatsumi;Kazuki Monta;Yusuke Hayashi;Takuji Miki;Alkis A. Hatzopoulos;Adrijan Barić;Makoto Nagata
{"title":"Chip-Backside Vulnerability to Intentional Electromagnetic Interference in Integrated Circuits","authors":"Takuya Wadatsumi;Kazuki Monta;Yusuke Hayashi;Takuji Miki;Alkis A. Hatzopoulos;Adrijan Barić;Makoto Nagata","doi":"10.1109/TEMC.2024.3440919","DOIUrl":"10.1109/TEMC.2024.3440919","url":null,"abstract":"The backside of integrated circuits (ICs) in flip-chip assembly is susceptible to intentional electromagnetic interference due to its open surface. In this article, we propose a model in which conducted current noise from a localized area of the Si substrate on the chip-backside causes errors in complementary metal-oxide-semiconductor (CMOS) digital circuits. This model explains for the first time the mechanism of bit-flip errors in bistable circuits caused by high-voltage pulse (HVP) injection on the backside of the IC. The injected current from the backside of the IC not only flows into the power distribution network, but also charges the gate capacitance of the next stage via p–n junction diodes of body/drain or body/source in N-channel \u0000<sc>mosfet</small>\u0000s (NMOS) with twin-well structures, resulting in bit-flip errors. In this study, circuit simulations were performed using a three-dimensional \u0000<italic>RC</i>\u0000 network model of the IC chip and an HVP injector. These simulations have shown that the P-well voltage is biased depending on the arrangement of the tap cells, reproducing bit-flip errors in the bistable circuit of a D flip-flop. The simulation results were validated on a fabricated prototype IC chip, which confirmed the trend of data dependency for errors related to the physical layout.","PeriodicalId":55012,"journal":{"name":"IEEE Transactions on Electromagnetic Compatibility","volume":"66 5","pages":"1556-1566"},"PeriodicalIF":2.0,"publicationDate":"2024-08-28","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"https://ieeexplore.ieee.org/stamp/stamp.jsp?tp=&arnumber=10654642","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"142090377","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":3,"RegionCategory":"计算机科学","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"OA","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 0
Triple Bandstop 2.5D Frequency Selective Surface for Sub-6 GHz 5G Communication 用于 6 千兆赫以下 5G 通信的三重带阻 2.5D 频率选择表面
IF 2 3区 计算机科学
IEEE Transactions on Electromagnetic Compatibility Pub Date : 2024-08-26 DOI: 10.1109/TEMC.2024.3445292
Kanishka Katoch;Naveen Jaglan;Binod Kumar Kanaujia;Pai-Yen Chen;Ahmed A. Kishk
{"title":"Triple Bandstop 2.5D Frequency Selective Surface for Sub-6 GHz 5G Communication","authors":"Kanishka Katoch;Naveen Jaglan;Binod Kumar Kanaujia;Pai-Yen Chen;Ahmed A. Kishk","doi":"10.1109/TEMC.2024.3445292","DOIUrl":"10.1109/TEMC.2024.3445292","url":null,"abstract":"The design of a miniaturized triple bandstop frequency selective surface (FSS) is presented for 5th generation (5G) communication systems. Meander lines in a spiral shape have been etched on the top and bottom of a dielectric substrate. To increase the electrical length of the FSS, the spirals are interconnected using four vias at the edges. The proposed design with a 5.2 × 5.2 mm\u0000<sup>2</sup>\u0000 footprint exhibits a triple bandstop response at sub-6 GHz frequency bands NR n46, LTE 42/LTE43, and LTE 46. The design is simple and cost-effective. As a miniaturized structure with rotational symmetry, it manifests polarization-independent characteristics with a stable frequency response for normal and oblique incident angles up to 84° (simulated) and 60° (measured). The transmission characteristics are verified using simulation and experiments. The proposed design can be used to shield 5G operational devices.","PeriodicalId":55012,"journal":{"name":"IEEE Transactions on Electromagnetic Compatibility","volume":"66 5","pages":"1420-1429"},"PeriodicalIF":2.0,"publicationDate":"2024-08-26","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"142084860","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":3,"RegionCategory":"计算机科学","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 0
A Fault Location Method Based on Polynomial Chaos Expansion for Non-uniform Power Transmission Lines With Uncertainty Parameters 基于多项式混沌展开的非均匀输电线路不确定参数故障定位方法
IF 2 3区 计算机科学
IEEE Transactions on Electromagnetic Compatibility Pub Date : 2024-08-26 DOI: 10.1109/TEMC.2024.3423006
Shao-Yin He;Yu Song;Andrea Cozza;Yan-Zhao Xie;Zhao-Yang Wang
{"title":"A Fault Location Method Based on Polynomial Chaos Expansion for Non-uniform Power Transmission Lines With Uncertainty Parameters","authors":"Shao-Yin He;Yu Song;Andrea Cozza;Yan-Zhao Xie;Zhao-Yang Wang","doi":"10.1109/TEMC.2024.3423006","DOIUrl":"10.1109/TEMC.2024.3423006","url":null,"abstract":"This article introduces a novel fault location method utilizing polynomial-chaos expansion (PCE) designed specifically for non-uniform transmission lines affected by uncertain parameters. It considers the uncertain parameters arising from height and ground conductivity in transmission lines, examining their impact on conventional fault location methods, such as natural frequency and full-transient analysis approach. These uncertainties lead to considerable location errors, particularly magnified with increasing fault distances. To address this issue, we propose a fault location approach based on PCE and correlation estimation. Simulations cover fault distances ranging from tens to hundreds of kilometers, considering variations in non-uniform line section-lengths, and examining scenarios with single and multiple conductors. Results demonstrate that the proposed method exhibits robustness across different degrees of uncertainty parameters in non-uniform settings, reducing the relative location error to below 1%. In terms of computational efficiency, the PCE method can accelerate calculations by up to 12 times compared to the Monte Carlo method. Furthermore, the PCE method has been validated using fault transient data from an actual 220 kV power line achieving a location error of 2.41%, which demonstrates its practical applicability in real-world power grid scenarios.","PeriodicalId":55012,"journal":{"name":"IEEE Transactions on Electromagnetic Compatibility","volume":"66 5","pages":"1665-1678"},"PeriodicalIF":2.0,"publicationDate":"2024-08-26","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"142084890","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":3,"RegionCategory":"计算机科学","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 0
3-D Printed All-Dielectric Ultrabroadband Microwave Absorber 3-D 打印全介质超宽带微波吸收器
IF 2.1 3区 计算机科学
IEEE Transactions on Electromagnetic Compatibility Pub Date : 2024-08-23 DOI: 10.1109/temc.2024.3440060
Jyoti Yadav, Rahul Vishwakarma, Mondeep Saikia, Kumar Vaibhav Srivastava, J. Ramkumar
{"title":"3-D Printed All-Dielectric Ultrabroadband Microwave Absorber","authors":"Jyoti Yadav, Rahul Vishwakarma, Mondeep Saikia, Kumar Vaibhav Srivastava, J. Ramkumar","doi":"10.1109/temc.2024.3440060","DOIUrl":"https://doi.org/10.1109/temc.2024.3440060","url":null,"abstract":"","PeriodicalId":55012,"journal":{"name":"IEEE Transactions on Electromagnetic Compatibility","volume":"49 1","pages":""},"PeriodicalIF":2.1,"publicationDate":"2024-08-23","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"142045504","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":3,"RegionCategory":"计算机科学","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 0
Low-Frequency Magnetic Shielding of a Double-Layered Planar Shield Against a Parallel Loop 双层平面屏蔽对平行环路的低频磁屏蔽
IF 2 3区 计算机科学
IEEE Transactions on Electromagnetic Compatibility Pub Date : 2024-08-23 DOI: 10.1109/TEMC.2024.3436551
Yiyi Jing;Sijia Liu;Jiahua Mei;Haidong Liu;Chongqing Jiao
{"title":"Low-Frequency Magnetic Shielding of a Double-Layered Planar Shield Against a Parallel Loop","authors":"Yiyi Jing;Sijia Liu;Jiahua Mei;Haidong Liu;Chongqing Jiao","doi":"10.1109/TEMC.2024.3436551","DOIUrl":"10.1109/TEMC.2024.3436551","url":null,"abstract":"This article theoretically investigates the shielding problem of a double-layered planar shield of infinite extent against the magnetic field generated by a circular loop placed parallel to the shield. First, Moser's formulation of solving the vector wave equation is extended to obtain the exact integral expressions of the shielded fields. Second, the approximate expressions are developed for electrically thick, nonmagnetic, metallic sheets. Also, the conditions to validate the approximate expressions are illimulated. Finally, the calculated results for the aluminum, the low-carbon steel and the permalloy are presented according to the NSA 94-106 setup. Meanwhile, the effects of thickness distribution and sheet-to-sheet spacing are analyzed.","PeriodicalId":55012,"journal":{"name":"IEEE Transactions on Electromagnetic Compatibility","volume":"66 5","pages":"1430-1439"},"PeriodicalIF":2.0,"publicationDate":"2024-08-23","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"142045367","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":3,"RegionCategory":"计算机科学","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 0
A Novel Method for Tailoring the Electromagnetic Radiation Emission Limits of Equipment in Complex System 定制复杂系统中设备电磁辐射发射限值的新方法
IF 2 3区 计算机科学
IEEE Transactions on Electromagnetic Compatibility Pub Date : 2024-08-23 DOI: 10.1109/TEMC.2024.3437434
Yaoyao Li;Youwei Meng;Hao Chen;Houpu Xiao;Shaoxiong Cai
{"title":"A Novel Method for Tailoring the Electromagnetic Radiation Emission Limits of Equipment in Complex System","authors":"Yaoyao Li;Youwei Meng;Hao Chen;Houpu Xiao;Shaoxiong Cai","doi":"10.1109/TEMC.2024.3437434","DOIUrl":"10.1109/TEMC.2024.3437434","url":null,"abstract":"The trend toward integration in systems has led to the unpredictability of electromagnetic compatibility within the system. Fixed radiation emission standards struggle to meet the diverse and complex requirements of specific scenarios, making it essential to design or adjust emission limits for specific equipment. To address this issue, this article investigates a method for tailoring the emission limits standard RE102 of radiation equipment in complex systems that include multiple radiating and sensitive equipment. We establish a radiation coupling network model within the system and propose a solution based on the affine-scaling interior-point method for solving the emission limit indicators. This method abstracts the problem of tailoring radiation emission limits into a single-objective optimization problem. We establish a design cost calculation model for each piece of radiation equipment, with the total system design cost as the optimization objective, to obtain the optimal solution under constraints. Finally, through case design and testing involving multiple radiating equipment and sensitive equipment, the test results demonstrate the effectiveness and reliability of the proposed novel method in different scenarios.","PeriodicalId":55012,"journal":{"name":"IEEE Transactions on Electromagnetic Compatibility","volume":"66 5","pages":"1478-1489"},"PeriodicalIF":2.0,"publicationDate":"2024-08-23","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"142045503","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":3,"RegionCategory":"计算机科学","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 0
Deep Neural Network-Based Surrogate-Assisted Inverse Optimization for High-Speed Interconnects 基于深度神经网络的高速互联代用辅助逆向优化
IF 2.1 3区 计算机科学
IEEE Transactions on Electromagnetic Compatibility Pub Date : 2024-08-16 DOI: 10.1109/temc.2024.3440055
Quankun Chen, Ling Zhang, Hanzhi Ma, Da Li, Yan Li, En-Xiao Liu, Er-Ping Li
{"title":"Deep Neural Network-Based Surrogate-Assisted Inverse Optimization for High-Speed Interconnects","authors":"Quankun Chen, Ling Zhang, Hanzhi Ma, Da Li, Yan Li, En-Xiao Liu, Er-Ping Li","doi":"10.1109/temc.2024.3440055","DOIUrl":"https://doi.org/10.1109/temc.2024.3440055","url":null,"abstract":"","PeriodicalId":55012,"journal":{"name":"IEEE Transactions on Electromagnetic Compatibility","volume":"40 1","pages":""},"PeriodicalIF":2.1,"publicationDate":"2024-08-16","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"141994370","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":3,"RegionCategory":"计算机科学","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 0
A Hybrid 3-D Frequency Selective Structure Featuring Enhanced Stopband Suppression and Reduced Insertion Loss 具有增强的阻带抑制和降低的插入损耗的混合三维选频结构
IF 2.1 3区 计算机科学
IEEE Transactions on Electromagnetic Compatibility Pub Date : 2024-08-16 DOI: 10.1109/temc.2024.3439013
Pei Zhang, Da Li, Xiaodong An, Yudi Fan, Yan Li, Wenchao Chen, Er-Ping Li
{"title":"A Hybrid 3-D Frequency Selective Structure Featuring Enhanced Stopband Suppression and Reduced Insertion Loss","authors":"Pei Zhang, Da Li, Xiaodong An, Yudi Fan, Yan Li, Wenchao Chen, Er-Ping Li","doi":"10.1109/temc.2024.3439013","DOIUrl":"https://doi.org/10.1109/temc.2024.3439013","url":null,"abstract":"","PeriodicalId":55012,"journal":{"name":"IEEE Transactions on Electromagnetic Compatibility","volume":"24 1","pages":""},"PeriodicalIF":2.1,"publicationDate":"2024-08-16","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"141994371","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":3,"RegionCategory":"计算机科学","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 0
An Efficient PEEC-Based Method for Full-Wave Analysis of Microstrip Structures 基于 PEEC 的高效微带结构全波分析方法
IF 2 3区 计算机科学
IEEE Transactions on Electromagnetic Compatibility Pub Date : 2024-08-16 DOI: 10.1109/TEMC.2024.3430472
Jinyan Ma;Da Li;Hanzhi Ma;Ruifeng Li;Ling Zhang;Michal Mrozowski;Er-Ping Li
{"title":"An Efficient PEEC-Based Method for Full-Wave Analysis of Microstrip Structures","authors":"Jinyan Ma;Da Li;Hanzhi Ma;Ruifeng Li;Ling Zhang;Michal Mrozowski;Er-Ping Li","doi":"10.1109/TEMC.2024.3430472","DOIUrl":"10.1109/TEMC.2024.3430472","url":null,"abstract":"This article introduces an efficient method for the equivalent circuit characterization and full-wave analysis of microstrip structures, leveraging the full-wave partial element equivalent circuit (PEEC). In particular, the multilayered Green's function is evaluated using the discrete complex-image method (DCIM) and employed to establish the mixed potential integral equations. The proposed strategy considers time delays for the retarded electric and magnetic couplings, offering a new efficient full-wave approach to extract equivalent circuit components, which encapsulate the contributions of the quasi-static, surface-wave, and complex images. It is noted that the proposed full-wave PEEC strategy allows each component contribution derived from DCIM to be efficiently represented as frequency-independent lumped circuit elements and corresponding frequency factors, thereby simplifying the extraction process of the entire frequency-dependent lumped elements in the traditional PEEC method. Moreover, the proposed PEEC model, equipped with full-wave equivalent circuits, offers clear physical insight into electromagnetic behaviors, thereby facilitating design and optimization. Finally, the accuracy and efficiency of the proposed PEEC model are fully demonstrated through various examples and experiments.","PeriodicalId":55012,"journal":{"name":"IEEE Transactions on Electromagnetic Compatibility","volume":"66 5","pages":"1585-1595"},"PeriodicalIF":2.0,"publicationDate":"2024-08-16","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"141994372","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":3,"RegionCategory":"计算机科学","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 0
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