{"title":"Data-Driven Topology Design for Conductor Layout Problem of Electromagnetic Interference Filter","authors":"Duanyutian Zhou;Katsuya Nomura;Shintaro Yamasaki","doi":"10.1109/TEMC.2025.3558260","DOIUrl":null,"url":null,"abstract":"Electromagnetic interference (EMI) filters are used to reduce electromagnetic noise. It is well known that the performance of an EMI filter in reducing electromagnetic noise largely depends on its conductor layout. Therefore, if a conductor layout optimization method with a high degree of freedom is realized, then a drastic performance improvement is expected. Although there are a few design methods based on topology optimization for this purpose, these methods have some difficulties originating from topology optimization. In this article, we, therefore, propose a conductor layout design method for EMI filters on the basis of data-driven topology design (DDTD), which is a high degree of freedom structural design methodology incorporating a deep generative model and data-driven approach. DDTD was proposed to overcome the intrinsic difficulties of topology optimization, and we consider it suitable for the conductor layout design problem of EMI filters. One significant challenge in applying DDTD to the conductor layout design problem is maintaining the topology of the circuit diagram during the solution search. For this purpose, we propose a simple yet efficient constraint. We further provide numerical examples to confirm the usefulness of the proposed method.","PeriodicalId":55012,"journal":{"name":"IEEE Transactions on Electromagnetic Compatibility","volume":"67 3","pages":"872-883"},"PeriodicalIF":2.5000,"publicationDate":"2025-04-28","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"0","resultStr":null,"platform":"Semanticscholar","paperid":null,"PeriodicalName":"IEEE Transactions on Electromagnetic Compatibility","FirstCategoryId":"94","ListUrlMain":"https://ieeexplore.ieee.org/document/10978869/","RegionNum":3,"RegionCategory":"计算机科学","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"Q3","JCRName":"ENGINEERING, ELECTRICAL & ELECTRONIC","Score":null,"Total":0}
引用次数: 0
Abstract
Electromagnetic interference (EMI) filters are used to reduce electromagnetic noise. It is well known that the performance of an EMI filter in reducing electromagnetic noise largely depends on its conductor layout. Therefore, if a conductor layout optimization method with a high degree of freedom is realized, then a drastic performance improvement is expected. Although there are a few design methods based on topology optimization for this purpose, these methods have some difficulties originating from topology optimization. In this article, we, therefore, propose a conductor layout design method for EMI filters on the basis of data-driven topology design (DDTD), which is a high degree of freedom structural design methodology incorporating a deep generative model and data-driven approach. DDTD was proposed to overcome the intrinsic difficulties of topology optimization, and we consider it suitable for the conductor layout design problem of EMI filters. One significant challenge in applying DDTD to the conductor layout design problem is maintaining the topology of the circuit diagram during the solution search. For this purpose, we propose a simple yet efficient constraint. We further provide numerical examples to confirm the usefulness of the proposed method.
期刊介绍:
IEEE Transactions on Electromagnetic Compatibility publishes original and significant contributions related to all disciplines of electromagnetic compatibility (EMC) and relevant methods to predict, assess and prevent electromagnetic interference (EMI) and increase device/product immunity. The scope of the publication includes, but is not limited to Electromagnetic Environments; Interference Control; EMC and EMI Modeling; High Power Electromagnetics; EMC Standards, Methods of EMC Measurements; Computational Electromagnetics and Signal and Power Integrity, as applied or directly related to Electromagnetic Compatibility problems; Transmission Lines; Electrostatic Discharge and Lightning Effects; EMC in Wireless and Optical Technologies; EMC in Printed Circuit Board and System Design.