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IEEE Transactions on Electromagnetic Compatibility Information for Authors IEEE《作者电磁兼容性信息汇刊》
IF 2 3区 计算机科学
IEEE Transactions on Electromagnetic Compatibility Pub Date : 2024-12-19 DOI: 10.1109/TEMC.2024.3504886
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引用次数: 0
Editorial: Introduction to the Special Issue on AI, Machine Learning, and Deep Learning: Advances and Applications for EMC 社论：人工智能、机器学习和深度学习特刊导论：EMC的进展和应用
IF 2 3区 计算机科学
IEEE Transactions on Electromagnetic Compatibility Pub Date : 2024-12-19 DOI: 10.1109/TEMC.2024.3504693
Alistair Duffy;En-Xiao Liu
{"title":"Editorial: Introduction to the Special Issue on AI, Machine Learning, and Deep Learning: Advances and Applications for EMC","authors":"Alistair Duffy;En-Xiao Liu","doi":"10.1109/TEMC.2024.3504693","DOIUrl":"10.1109/TEMC.2024.3504693","url":null,"abstract":"Not many technologies have ever captured the public imagination as widely and abruptly as artificial intelligence (AI). While AI has been a staple of science fiction for decades with actual applications in engineering and sciences for many years, it is only in the last year or so that generative AI tools have enthused and engaged so many people. All of a sudden, our general consciousness sees AI as so accessible and so normalized. This is particularly evident that you wish to do a simple web search of AI tools available online or perhaps check out the libraries and toolboxes of your favorite programming languages.","PeriodicalId":55012,"journal":{"name":"IEEE Transactions on Electromagnetic Compatibility","volume":"66 6","pages":"1926-1927"},"PeriodicalIF":2.0,"publicationDate":"2024-12-19","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"https://ieeexplore.ieee.org/stamp/stamp.jsp?tp=&arnumber=10807760","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"142858265","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":3,"RegionCategory":"计算机科学","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"OA","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 0
Institutional Listings 机构清单
IF 2 3区 计算机科学
IEEE Transactions on Electromagnetic Compatibility Pub Date : 2024-12-19 DOI: 10.1109/TEMC.2024.3504879
{"title":"Institutional Listings","authors":"","doi":"10.1109/TEMC.2024.3504879","DOIUrl":"10.1109/TEMC.2024.3504879","url":null,"abstract":"","PeriodicalId":55012,"journal":{"name":"IEEE Transactions on Electromagnetic Compatibility","volume":"66 6","pages":"C4-C4"},"PeriodicalIF":2.0,"publicationDate":"2024-12-19","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"https://ieeexplore.ieee.org/stamp/stamp.jsp?tp=&arnumber=10807722","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"142858264","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":3,"RegionCategory":"计算机科学","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"OA","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 0
Share your Preprint Research with the World! 与世界分享你的预印本研究！
IF 2 3区 计算机科学
IEEE Transactions on Electromagnetic Compatibility Pub Date : 2024-12-19 DOI: 10.1109/TEMC.2024.3512273
{"title":"Share your Preprint Research with the World!","authors":"","doi":"10.1109/TEMC.2024.3512273","DOIUrl":"10.1109/TEMC.2024.3512273","url":null,"abstract":"","PeriodicalId":55012,"journal":{"name":"IEEE Transactions on Electromagnetic Compatibility","volume":"66 6","pages":"1924-1924"},"PeriodicalIF":2.0,"publicationDate":"2024-12-19","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"https://ieeexplore.ieee.org/stamp/stamp.jsp?tp=&arnumber=10807739","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"142858270","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":3,"RegionCategory":"计算机科学","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"OA","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 0
Institutional Listings 机构清单
IF 2 3区 计算机科学
IEEE Transactions on Electromagnetic Compatibility Pub Date : 2024-12-19 DOI: 10.1109/TEMC.2024.3504888
{"title":"Institutional Listings","authors":"","doi":"10.1109/TEMC.2024.3504888","DOIUrl":"10.1109/TEMC.2024.3504888","url":null,"abstract":"","PeriodicalId":55012,"journal":{"name":"IEEE Transactions on Electromagnetic Compatibility","volume":"66 6","pages":"C4-C4"},"PeriodicalIF":2.0,"publicationDate":"2024-12-19","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"https://ieeexplore.ieee.org/stamp/stamp.jsp?tp=&arnumber=10807730","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"142858267","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":3,"RegionCategory":"计算机科学","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"OA","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 0
IEEE Electromagnetic Compatibility Society Information IEEE电磁兼容协会信息
IF 2 3区 计算机科学
IEEE Transactions on Electromagnetic Compatibility Pub Date : 2024-12-19 DOI: 10.1109/TEMC.2024.3504875
{"title":"IEEE Electromagnetic Compatibility Society Information","authors":"","doi":"10.1109/TEMC.2024.3504875","DOIUrl":"10.1109/TEMC.2024.3504875","url":null,"abstract":"","PeriodicalId":55012,"journal":{"name":"IEEE Transactions on Electromagnetic Compatibility","volume":"66 6","pages":"C2-C2"},"PeriodicalIF":2.0,"publicationDate":"2024-12-19","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"https://ieeexplore.ieee.org/stamp/stamp.jsp?tp=&arnumber=10807736","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"142858269","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":3,"RegionCategory":"计算机科学","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"OA","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 0
Toward Enhancing Soil Resistivity Measurement and Modelling for Limited Interelectrode Spacing 加强有限电极间距土壤电阻率测量与建模
IF 2.1 3区 计算机科学
IEEE Transactions on Electromagnetic Compatibility Pub Date : 2024-12-18 DOI: 10.1109/temc.2024.3514772
Omar Kherif, Stephen Robson, Salah Mousa, Noureddine Harid, Huw Griffiths, David Thorpe, Abderrahmane Haddad
{"title":"Toward Enhancing Soil Resistivity Measurement and Modelling for Limited Interelectrode Spacing","authors":"Omar Kherif, Stephen Robson, Salah Mousa, Noureddine Harid, Huw Griffiths, David Thorpe, Abderrahmane Haddad","doi":"10.1109/temc.2024.3514772","DOIUrl":"https://doi.org/10.1109/temc.2024.3514772","url":null,"abstract":"","PeriodicalId":55012,"journal":{"name":"IEEE Transactions on Electromagnetic Compatibility","volume":"23 1","pages":""},"PeriodicalIF":2.1,"publicationDate":"2024-12-18","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"142848910","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":3,"RegionCategory":"计算机科学","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 0
Response of Metal-Oxide Varistors Excited by Consecutive Early-Time and Intermediate-Time HEMP Conducted Currents 金属氧化物压敏电阻在连续早期和中期HEMP传导电流激励下的响应
IF 2 3区 计算机科学
IEEE Transactions on Electromagnetic Compatibility Pub Date : 2024-12-18 DOI: 10.1109/TEMC.2024.3514685
Dao-zhong Zhang;Yan-zhao Xie;Yi Zhou;Yun-peng Zhang
{"title":"Response of Metal-Oxide Varistors Excited by Consecutive Early-Time and Intermediate-Time HEMP Conducted Currents","authors":"Dao-zhong Zhang;Yan-zhao Xie;Yi Zhou;Yun-peng Zhang","doi":"10.1109/TEMC.2024.3514685","DOIUrl":"10.1109/TEMC.2024.3514685","url":null,"abstract":"High-altitude electromagnetic pulse (HEMP) can be divided into three parts: 1) early-time HEMP (E1); 2) intermediate-time HEMP (E2); and 3) late-time HEMP (E3). Most studies focus on E1 alone, as E2 and E3 pose lower peak value, especially E2, which is considered less severe than lightning. However, E2 coexists with E1 and affects victim equipment simultaneously, which may result in different effects than E1 or E2 alone. As the most widely used surge protection device, the behavior of metal-oxide varistors (MOVs) under the consecutive E1 and E2 should be investigated and compared with those under E1 or E2 alone. Based on a pulse current injection platform, the voltage, current, susceptibility, and nonuniformity behavior of two types of MOVs under the separate E1, E2, and consecutive E1 and E2 disturbances are investigated and compared. The peak residual voltages of the MOV samples under consecutive E1 and E2 disturbances reach 15 kV, which is the same as that under the E1 disturbance and much higher than that under the E2 disturbance (1.5 kV). The MOV samples are more sensitive to the consecutive E1 and E2 disturbance, particularly those with a higher nonuniformity. Finally, the response process is discussed based on the microstructural nonuniformity of MOVs.","PeriodicalId":55012,"journal":{"name":"IEEE Transactions on Electromagnetic Compatibility","volume":"67 1","pages":"191-199"},"PeriodicalIF":2.0,"publicationDate":"2024-12-18","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"142848919","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":3,"RegionCategory":"计算机科学","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 0
Practice and Evaluation for Ceiling-Mounted MIMO Indoor Base Stations With Antenna Optimization and SAR Touch Compliance 天线优化与SAR触控的吸顶式MIMO室内基站实践与评价
IF 2 3区 计算机科学
IEEE Transactions on Electromagnetic Compatibility Pub Date : 2024-12-18 DOI: 10.1109/TEMC.2024.3511700
Wenfu Fu;Stanislav Stefanov Zhekov;Carla Di Paola;Sailing He;Bo Xu
{"title":"Practice and Evaluation for Ceiling-Mounted MIMO Indoor Base Stations With Antenna Optimization and SAR Touch Compliance","authors":"Wenfu Fu;Stanislav Stefanov Zhekov;Carla Di Paola;Sailing He;Bo Xu","doi":"10.1109/TEMC.2024.3511700","DOIUrl":"10.1109/TEMC.2024.3511700","url":null,"abstract":"Antenna design for indoor base stations (BSs) needs to consider various requirements to maximize the performance of the entire system in complicated environments. In this article, antenna design and performance evaluation are conducted from a holistic perspective using a modified multiplexing efficiency. This metric considers power constraints due to electromagnetic field exposure compliance and indoor channel environments for multiple-input multiple-output (MIMO) antenna systems. In the case study, using the reference monopole antenna, the accepted power needs to be reduced from 0.5 to 0.28 W to achieve specific absorption rate (SAR) touch compliance, resulting in a reduction in the modified multiplexing efficiency. The improved monopole antenna design can meet SAR touch compliance with an accepted power of 0.5 W by altering the electric current distribution on the monopole and ground plane. The system performance evaluated using the modified multiplexing efficiency is therefore improved by approximately 2.4 dB in the indoor environment for an indoor BS with four antennas. This holistic antenna design and evaluation process provides a valuable basis for comparing and optimizing MIMO antenna systems while considering SAR touch compliance and deployment scenarios for indoor BSs.","PeriodicalId":55012,"journal":{"name":"IEEE Transactions on Electromagnetic Compatibility","volume":"67 1","pages":"60-71"},"PeriodicalIF":2.0,"publicationDate":"2024-12-18","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"https://ieeexplore.ieee.org/stamp/stamp.jsp?tp=&arnumber=10807071","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"142848913","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":3,"RegionCategory":"计算机科学","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"OA","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 0
Passive Intermodulation Model Based on Conductors Cross-Section for Printed Transmission Line 基于印刷传输线导体截面的无源互调模型
IF 2.1 3区 计算机科学
IEEE Transactions on Electromagnetic Compatibility Pub Date : 2024-12-16 DOI: 10.1109/temc.2024.3511254
Mingtai Li, Tuanjie Li
{"title":"Passive Intermodulation Model Based on Conductors Cross-Section for Printed Transmission Line","authors":"Mingtai Li, Tuanjie Li","doi":"10.1109/temc.2024.3511254","DOIUrl":"https://doi.org/10.1109/temc.2024.3511254","url":null,"abstract":"","PeriodicalId":55012,"journal":{"name":"IEEE Transactions on Electromagnetic Compatibility","volume":"4 1","pages":""},"PeriodicalIF":2.1,"publicationDate":"2024-12-16","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"142832620","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":3,"RegionCategory":"计算机科学","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 0
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