IEEE Transactions on Electromagnetic Compatibility最新文献

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Model-Order Reduction of the Full-Wave Partial-Element Equivalent-Circuit (PEEC) Method Based on a Modal Approach 基于模态方法的全波部分单元等效电路(PEEC)模型阶降阶方法
IF 2.1 3区 计算机科学
IEEE Transactions on Electromagnetic Compatibility Pub Date : 2025-06-23 DOI: 10.1109/temc.2025.3577351
Philipp Herwigk, Marco Leone
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引用次数: 0
The Impact of Discharge-Point Geometry on Air-Discharge ESD Testing: Current-Waveform Shape and Intensity 放电点几何形状对空气放电ESD测试的影响:电流波形形状和强度
IF 2.1 3区 计算机科学
IEEE Transactions on Electromagnetic Compatibility Pub Date : 2025-06-19 DOI: 10.1109/temc.2025.3576324
Hans Kunz
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引用次数: 0
Systematic Analysis of an Innovative DDR5 Connector Design 一种新型DDR5连接器设计的系统分析
IF 2.1 3区 计算机科学
IEEE Transactions on Electromagnetic Compatibility Pub Date : 2025-06-19 DOI: 10.1109/temc.2025.3577371
Yuchen Lee, Shuhao Liang
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引用次数: 0
Analysis and Integration of Chaotic Gaussian PWM and Passive Filter for Conducted EMI Suppression 混沌高斯脉宽调制与无源滤波器在传导电磁干扰抑制中的分析与集成
IF 2.1 3区 计算机科学
IEEE Transactions on Electromagnetic Compatibility Pub Date : 2025-06-18 DOI: 10.1109/temc.2025.3571194
Chentao Li, Jingsong Wang, Ping Xu, Qishuang Ma
{"title":"Analysis and Integration of Chaotic Gaussian PWM and Passive Filter for Conducted EMI Suppression","authors":"Chentao Li, Jingsong Wang, Ping Xu, Qishuang Ma","doi":"10.1109/temc.2025.3571194","DOIUrl":"https://doi.org/10.1109/temc.2025.3571194","url":null,"abstract":"","PeriodicalId":55012,"journal":{"name":"IEEE Transactions on Electromagnetic Compatibility","volume":"12 1","pages":""},"PeriodicalIF":2.1,"publicationDate":"2025-06-18","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"144319769","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":3,"RegionCategory":"计算机科学","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 0
Modeling and Optimization of Near-Field Coupling Between Power Loop and Gate Drive in High-Density Bidirectional Converters 高密度双向变换器电源环与栅极驱动近场耦合建模与优化
IF 2.1 3区 计算机科学
IEEE Transactions on Electromagnetic Compatibility Pub Date : 2025-06-18 DOI: 10.1109/temc.2025.3571381
Yuxuan Wu, Kushan Choksi, Samuel Defaz, Abdul Basit Mirza, Fang Luo
{"title":"Modeling and Optimization of Near-Field Coupling Between Power Loop and Gate Drive in High-Density Bidirectional Converters","authors":"Yuxuan Wu, Kushan Choksi, Samuel Defaz, Abdul Basit Mirza, Fang Luo","doi":"10.1109/temc.2025.3571381","DOIUrl":"https://doi.org/10.1109/temc.2025.3571381","url":null,"abstract":"","PeriodicalId":55012,"journal":{"name":"IEEE Transactions on Electromagnetic Compatibility","volume":"6 1","pages":""},"PeriodicalIF":2.1,"publicationDate":"2025-06-18","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"144319770","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":3,"RegionCategory":"计算机科学","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 0
Machine Learning to Predict EMI Radiation and Optimize the Structure of Pinmap Packages 机器学习预测电磁干扰辐射和优化pmap封装结构
IF 2.1 3区 计算机科学
IEEE Transactions on Electromagnetic Compatibility Pub Date : 2025-06-13 DOI: 10.1109/temc.2025.3574362
Yan Li, Wan Ji, Xiaotian Yang, Guoliang Yu, Yang Qiu, Da Li, Haomiao Zhou, En-xiao Liu, Er-ping Li
{"title":"Machine Learning to Predict EMI Radiation and Optimize the Structure of Pinmap Packages","authors":"Yan Li, Wan Ji, Xiaotian Yang, Guoliang Yu, Yang Qiu, Da Li, Haomiao Zhou, En-xiao Liu, Er-ping Li","doi":"10.1109/temc.2025.3574362","DOIUrl":"https://doi.org/10.1109/temc.2025.3574362","url":null,"abstract":"","PeriodicalId":55012,"journal":{"name":"IEEE Transactions on Electromagnetic Compatibility","volume":"51 1","pages":"1-12"},"PeriodicalIF":2.1,"publicationDate":"2025-06-13","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"144288474","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":3,"RegionCategory":"计算机科学","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 0
Institutional Listings 机构清单
IF 2 3区 计算机科学
IEEE Transactions on Electromagnetic Compatibility Pub Date : 2025-06-13 DOI: 10.1109/TEMC.2025.3577542
{"title":"Institutional Listings","authors":"","doi":"10.1109/TEMC.2025.3577542","DOIUrl":"https://doi.org/10.1109/TEMC.2025.3577542","url":null,"abstract":"","PeriodicalId":55012,"journal":{"name":"IEEE Transactions on Electromagnetic Compatibility","volume":"67 3","pages":"C4-C4"},"PeriodicalIF":2.0,"publicationDate":"2025-06-13","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"https://ieeexplore.ieee.org/stamp/stamp.jsp?tp=&arnumber=11036534","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"144281258","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":3,"RegionCategory":"计算机科学","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"OA","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 0
IEEE Open Access Publishing IEEE开放获取出版
IF 2 3区 计算机科学
IEEE Transactions on Electromagnetic Compatibility Pub Date : 2025-06-13 DOI: 10.1109/TEMC.2025.3577554
{"title":"IEEE Open Access Publishing","authors":"","doi":"10.1109/TEMC.2025.3577554","DOIUrl":"https://doi.org/10.1109/TEMC.2025.3577554","url":null,"abstract":"","PeriodicalId":55012,"journal":{"name":"IEEE Transactions on Electromagnetic Compatibility","volume":"67 3","pages":"1032-1032"},"PeriodicalIF":2.0,"publicationDate":"2025-06-13","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"https://ieeexplore.ieee.org/stamp/stamp.jsp?tp=&arnumber=11036563","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"144281316","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":3,"RegionCategory":"计算机科学","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"OA","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 0
Corrections to “Periodic Nonuniform Sampling for Enhanced Recognition of Spread Spectrum Clocking-Based Electromagnetic Signature” 对“周期非均匀采样增强扩频时钟型电磁信号识别”的修正
IF 2 3区 计算机科学
IEEE Transactions on Electromagnetic Compatibility Pub Date : 2025-06-13 DOI: 10.1109/TEMC.2025.3556536
Euibum Lee;Dong-Hoon Choi;Taesik Nam;Jong-Gwan Yook
{"title":"Corrections to “Periodic Nonuniform Sampling for Enhanced Recognition of Spread Spectrum Clocking-Based Electromagnetic Signature”","authors":"Euibum Lee;Dong-Hoon Choi;Taesik Nam;Jong-Gwan Yook","doi":"10.1109/TEMC.2025.3556536","DOIUrl":"https://doi.org/10.1109/TEMC.2025.3556536","url":null,"abstract":"The above article [1] omitted a crucial step: A phase unwrapping process for $angle {{s}_{D.text{mea}}}[ n ]$ to prevent unnecessary spikes in its derivative, $d{ {angle {{s}_{D.text{mea}}}[ n ]} }/dn$, as given in (12a), (13a), and (14) and plots on Fig. 5. Additionally, the y-axis of the upper plot in Fig. 5 represents phase difference, not the phase.","PeriodicalId":55012,"journal":{"name":"IEEE Transactions on Electromagnetic Compatibility","volume":"67 3","pages":"1031-1031"},"PeriodicalIF":2.0,"publicationDate":"2025-06-13","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"https://ieeexplore.ieee.org/stamp/stamp.jsp?tp=&arnumber=11036575","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"144281154","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":3,"RegionCategory":"计算机科学","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"OA","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 0
IEEE Electromagnetic Compatibility Society Publication Information IEEE电磁兼容协会出版信息
IF 2 3区 计算机科学
IEEE Transactions on Electromagnetic Compatibility Pub Date : 2025-06-13 DOI: 10.1109/TEMC.2025.3577546
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引用次数: 0
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