IEEE Transactions on Electromagnetic Compatibility最新文献

{"title":"On the Concept of EMC Risk Management for Critical Infrastructures","authors":"Frank Sabath","doi":"10.1109/TEMC.2026.3710994","DOIUrl":"10.1109/TEMC.2026.3710994","url":null,"abstract":"The disruption, damage, or destruction of critical infrastructures can have a significant impact on the stability and safety of modern societies. Therefore, the electromagnetic compatibility (EMC) of critical infrastructures, including the protection for intentional electromagnetic interferences, is of growing concern. Critical infrastructures are designed as networked and distributed systems with an in-service period of up to several decades. This article provides some reflections on how the necessary level of EMC in critical infrastructure can be ensured by the application of a holistic EMC risk management. The EMC risk management is the most comprehensive and formal application of risk management principles and processes to EMC. The EMC risk management process is a process that involves the systematic application of procedures and practices to identify, analyze, evaluate, treat, monitor, and review EMC risks throughout the entire life cycle of critical infrastructures. The objective of this article is to introduce the concept and principles of risk management.","PeriodicalId":55012,"journal":{"name":"IEEE Transactions on Electromagnetic Compatibility","volume":"68 5","pages":"1108-1117"},"PeriodicalIF":2.6,"publicationDate":"2026-10-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"https://ieeexplore.ieee.org/stamp/stamp.jsp?tp=&arnumber=11618962","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"148586777","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":3,"RegionCategory":"计算机科学","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"OA","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}

{"title":"Embedded Design and Optimization of Finite-Array Absorbers for Laptop EMI Mitigation and Throughput Improvement","authors":"Chung-En Wu;Yu-Kai Huang;Kuan-Hsueh Tseng;Yen-Sheng Chen","doi":"10.1109/TEMC.2026.3727307","DOIUrl":"10.1109/TEMC.2026.3727307","url":null,"abstract":"Internal electromagnetic interference (EMI) from high-speed digital circuits in laptops can couple to Wi-Fi antennas and reduce 2.4-GHz throughput. This article presents a finite-array radio-frequency absorber placed around the dynamic random-access memory region for source-side EMI mitigation. Unlike conventional free-space periodic-unit-cell design, the loaded laptop itself is treated as the design environment. The principal contribution is the integration of controlled source modeling, complementary power-based objectives, Pareto selection, and finite-array hardware validated through EMI, antenna, and multiple-input-multiple-output measurements. This framework incorporates printed circuit board ground, finite-array boundaries, nearby components, and installation constraints during optimization. The source-enclosure placement reduces radiation efficiency to 30%–48% over 2.40–2.48 GHz, compared with 89%–95% for single-row placements. The radiation-efficiency-oriented design reduces the measured band-averaged EMI level by 4.11 dB. In system-level testing, it increases the measured receive throughput from 137.2 to 185.4 Mbps (+35.1%), from 32.0 to 59.0 Mbps (+84.4%), from 4.2 to 19.7 Mbps (+369.0%), and from 2.0 to 5.7 Mbps (+185.0%) at −54, −66, −72, and −75 dBm, respectively. Both absorber prototypes preserve the lower-band impedance matching and band-averaged antenna efficiency; however, the source-reflection-oriented design produces a localized 2.40-dB reduction in the +<italic>y</i> backlobe realized gain at 2.45 GHz.","PeriodicalId":55012,"journal":{"name":"IEEE Transactions on Electromagnetic Compatibility","volume":"68 5","pages":"1118-1129"},"PeriodicalIF":2.6,"publicationDate":"2026-10-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"148973483","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":3,"RegionCategory":"计算机科学","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}

{"title":"Conducted Susceptibility Visualization and Modeling Optimization for Analog and Mixed-Signal Chips Based on a Cluster Heatmap Approach","authors":"Xi Chen;Shuguo Xie;Bing Shao","doi":"10.1109/TEMC.2026.3723379","DOIUrl":"https://doi.org/10.1109/TEMC.2026.3723379","url":null,"abstract":"An automated, sensitive-feature identification–visualization method is proposed in this article to address the challenges—namely, the limited identification accuracy, reliance on single-dimensional static criteria, and bottlenecks in Black box modeling efficiency—in evaluating the conducted susceptibility of analog and mixed-signal (AMS) integrated circuits (ICs) in complex electromagnetic environments. The proposed method is based on the data selection initialization of an improved k-means clustering approach, which does not require predefined output failure criteria for evaluation. The developed method addresses issues inherent to traditional clustering techniques, including sensitivity to initial conditions and random clustering outcomes, by leveraging the chip’s baseline response characteristics under undisturbed conditions as a physical constraint and integrating a multi-indicator fusion algorithm. The proposed method generates heatmaps of electromagnetic interference susceptibility distributions, providing intuitive quantification and visualization of the chip’s susceptibility evolution patterns in the 2-D frequency–power interference space. Experimental results demonstrate that this approach had good consistency with the susceptibility boundaries determined according to traditional standards and, more critically, revealed the continuous degradation trajectory of AMS ICs from the linear operating region through the nonlinear distortion transition zone to the functional failure zone. Furthermore, the partition modeling strategy guided by clustering results reduced data acquisition and model training costs by eliminating redundant test points and focusing on critically sensitive regions while maintaining the black-box model’s prediction accuracy (the model iteration convergence speed improved by approximately 33.7%, and the total time was reduced by 25.9%). This work provides an objective evaluation tool for the electromagnetic susceptibility of AMS ICs without predefined output failure criteria, characterizes the susceptibility response evolution under broadband interference, and establishes a robust theoretical and methodological foundation for chip screening, in situ replacement, and efficient electromagnetic behavior modeling in high-reliability scenarios.","PeriodicalId":55012,"journal":{"name":"IEEE Transactions on Electromagnetic Compatibility","volume":"68 5","pages":"1266-1277"},"PeriodicalIF":2.6,"publicationDate":"2026-10-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"149176103","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":3,"RegionCategory":"计算机科学","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}

{"title":"Transient Response of Buried Power Cable Under Direct Lightning Strikes: Impact of Interconnection Between Adjacent Grounding Grids","authors":"Mi Zhou, Tianyu Hu, Jianguo Wang, Li Cai, Maorong Geng, Lingfeng Liang, Tian Zhou, Jianping Wang, Jinxin Cao, Yadong Fan","doi":"10.1109/temc.2026.3732589","DOIUrl":"https://doi.org/10.1109/temc.2026.3732589","url":null,"abstract":"","PeriodicalId":55012,"journal":{"name":"IEEE Transactions on Electromagnetic Compatibility","volume":"3 1","pages":""},"PeriodicalIF":2.1,"publicationDate":"2026-10-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"149084567","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":3,"RegionCategory":"计算机科学","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}

{"title":"A Highly Accelerated Automatic Transient Field Evaluation in Planar Multilayered Structures","authors":"Giampiero Lovat","doi":"10.1109/TEMC.2026.3703968","DOIUrl":"10.1109/TEMC.2026.3703968","url":null,"abstract":"An automatic numerical scheme is presented for accelerated time-domain evaluation of electromagnetic fields radiated by elementary sources in planar multilayered structures. The formulation is based on the inverse Fourier transform of Sommerfeld-type integrals. The latter are evaluated by a partition–extrapolation method using an automatic generalized weighted-averages algorithm for semi-infinite tails, while the inverse Fourier transform is carried out semianalytically by adaptive cubic-spline interpolation of the field spectrum and closed-form integration of each spline segment. Once the spectral kernel is known, the integration parameters are selected automatically, including decay-exponent estimates for the tail acceleration and a multicriterion frequency-truncation strategy. Numerical examples involving vertical electric and magnetic dipoles, nondispersive and dispersive layers are used to assess accuracy, robustness, computational cost, and acceleration.","PeriodicalId":55012,"journal":{"name":"IEEE Transactions on Electromagnetic Compatibility","volume":"68 5","pages":"1189-1200"},"PeriodicalIF":2.6,"publicationDate":"2026-10-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"148401042","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":3,"RegionCategory":"计算机科学","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}

{"title":"Estimation of Electromagnetic Coupling Between PCBs Based on Equivalent Dipole Model and Modified Kron-Branin Method","authors":"Xiao Ma;Junjun Wang;Qi Wu","doi":"10.1109/TEMC.2026.3720350","DOIUrl":"10.1109/TEMC.2026.3720350","url":null,"abstract":"A hybrid model is proposed for predicting the response of printed circuit board (PCB) traces excited by electromagnetic (EM) field radiated from the other PCB. The proposed hybrid model combines the equivalent dipole model with the modified Kron–Branin (KB) method. The equivalent dipole model is based on electric and magnetic dipoles, which can produce the same EM fields as the actual electromagnetic interference source. The modified KB method can calculate the terminal responses of PCB traces by incorporating the illumination of the external EM field and discontinuous structures in actual PCB traces. The modified KB method is verified using two actual trace models in the frequency range of 0.1to 3 GHz, and the maximum absolute difference of terminal responses compared with the full-wave simulation is less than 5 dB. Based on the validation of the modified KB method, EM coupling between two parallel PCBs is investigated. The radiation fields of the emitter PCB are modeled by the equivalent dipole model via near-field scanning experiments and are used to calculate the coupling voltages with two victim PCBs in different slots from 0.1 to 3 GHz. The results show generally consistent trends with the measurements, particularly for slot B, where good agreement is obtained across the investigated band. For slot C, the proposed method still captures the main variation tendency and response level, although relatively larger deviations are observed at some frequencies. For the two victim PCBs in slots B and C, the mean root-mean-square error between the proposed hybrid model and that of the experimental measurements is 3.91and 7.06 dB, respectively. These results indicate that the proposed hybrid model is potentially useful for estimating EM coupling effects of multiple PCBs placed in one module with different layouts.","PeriodicalId":55012,"journal":{"name":"IEEE Transactions on Electromagnetic Compatibility","volume":"68 5","pages":"1246-1257"},"PeriodicalIF":2.6,"publicationDate":"2026-10-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"148806405","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":3,"RegionCategory":"计算机科学","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}

{"title":"IEEE Member Discount","authors":"","doi":"10.1109/TEMC.2026.3735495","DOIUrl":"https://doi.org/10.1109/TEMC.2026.3735495","url":null,"abstract":"","PeriodicalId":55012,"journal":{"name":"IEEE Transactions on Electromagnetic Compatibility","volume":"68 5","pages":"1311-1311"},"PeriodicalIF":2.6,"publicationDate":"2026-10-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"https://ieeexplore.ieee.org/stamp/stamp.jsp?tp=&arnumber=11738576","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"149175973","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":3,"RegionCategory":"计算机科学","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"OA","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}

{"title":"A Verification and Harmonic Reference Kit for RF Contact Harmonic Test Setup Characterization","authors":"Rui Mi;Simon Wäsner;Leonhard Petzel;David Pommerenke","doi":"10.1109/TEMC.2026.3711199","DOIUrl":"https://doi.org/10.1109/TEMC.2026.3711199","url":null,"abstract":"This article presents a dedicated verification and harmonic reference kit for contact harmonic measurement, consisting of a printed circuit board (PCB) for contact harmonics testing, an S-parameter verification PCB, and a harmonic reference source PCB with a controlled nonlinear element. Experimental results demonstrate that the proposed reference source provides predictable harmonic-versus-power behavior, good repeatability, a well-defined operating range, and adjustable harmonic output. The proposed kit provides a practical method for verifying the radio frequency (RF) signal path, checking the system self-harmonic baseline, and comparing the measured harmonic response with a repeatable nonlinear reference. It improves measurement reliability and provides a basis for future interlaboratory comparison of contact harmonic measurements.","PeriodicalId":55012,"journal":{"name":"IEEE Transactions on Electromagnetic Compatibility","volume":"68 5","pages":"1050-1058"},"PeriodicalIF":2.6,"publicationDate":"2026-10-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"149175976","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":3,"RegionCategory":"计算机科学","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}

{"title":"Statistical Characterization of Spark Length and Spark Resistance in ESD Air Discharges","authors":"Yang Xu;Jennifer Kitaygorsky;David Pommerenke","doi":"10.1109/TEMC.2026.3711876","DOIUrl":"10.1109/TEMC.2026.3711876","url":null,"abstract":"This article presents a high-bandwidth, nanosecond-resolved measurement method and a statistically meaningful dataset for spark characterization in electrostatic discharge (ESD) air discharges. A transmission-line-based setup with a DC source is employed to directly measure spark length and discharge current, from which spark resistance <inline-formula><tex-math>${{R}_{text{spark}( t )}}$</tex-math></inline-formula>, gap voltage <inline-formula><tex-math>${{V}_{text{gap}( t )}}$</tex-math></inline-formula>, reduced E-field E/N, peak current derivative, rise time, transferred charge, and deposited energy are extracted. In total, 1200 discharge events are characterized for <inline-formula><tex-math>${{Z}_0}$</tex-math></inline-formula> of 100, 133, and 240 Ω, voltages of 1.5, 3, 5, and 10 kV, relative humidity of 25% and 55%, and approach speeds up to 330 mm/s. The results quantify the statistical distribution of spark length and its relation to peak current derivative, and they reveal a two-stage current-rise behavior during breakdown. Comparison with Rompe–Weizel-based simulation shows agreement in the initial fast-rising stage, but clear deviation in the subsequent slow-rise stage. The dataset provides a practical nanosecond-scale reference for ESD spark model calibration and validation.","PeriodicalId":55012,"journal":{"name":"IEEE Transactions on Electromagnetic Compatibility","volume":"68 5","pages":"1076-1084"},"PeriodicalIF":2.6,"publicationDate":"2026-10-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"148595591","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":3,"RegionCategory":"计算机科学","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}

{"title":"Numerical Computation of Unshielded Multiwires In-Cell Parameters for Coupling Between FDTD and MTL Methods Using Multipolar Expansions","authors":"Luis D. Angulo;Jesper Lansink Rotgerink;Harmen Schippers;Alberto Gascon Bravo;Alejandro Muñoz Manterola","doi":"10.1109/TEMC.2026.3713195","DOIUrl":"10.1109/TEMC.2026.3713195","url":null,"abstract":"This article presents a robust and efficient methodology to compute the per-unit-length in-cell inductance and capacitance matrices required to couple unshielded multiwire bundles to a 3-D finite-difference time-domain (FDTD) solver within a multiconductor transmission line framework. The proposed approach numerically solves the 2-D electrostatic and magnetostatic Laplace problems in an inner region and represents the field in the outer region by a multipolar (MP) expansion whose coefficients are computed from the full numerical solution. This hybrid finite element method (FEM)–MP formulation decouples the in-cell parameters from the specific FDTD cell position and size, avoids repeated numerical computations when bundles cross many cells, and naturally accommodates dielectric insulation. The method is validated on three cases of increasing complexity: 1) a single insulated wire; 2) two bare wires; and 3) a realistic 31-conductor bundle. Results are compared against a pure FEM reference, a boundary element method implementation and Bérenger's center-based approximation. The proposed FEM(inner)+MP(outer) scheme matches the FEM reference with very small discrepancies. The study also shows that conductor interactions shift the effective expansion centers away from geometric centers and that electrostatic and magnetostatic centers differ in the presence of dielectrics, which are effects not captured by simplified previous analytic models.","PeriodicalId":55012,"journal":{"name":"IEEE Transactions on Electromagnetic Compatibility","volume":"68 5","pages":"1226-1233"},"PeriodicalIF":2.6,"publicationDate":"2026-10-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"https://ieeexplore.ieee.org/stamp/stamp.jsp?tp=&arnumber=11625738","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"148595590","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":3,"RegionCategory":"计算机科学","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"OA","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}