Precision Engineering-Journal of the International Societies for Precision Engineering and Nanotechnology最新文献

{"title":"Numerical simulation of the effect of scratching parameters and crystal orientation on the surface scratching mechanism of single-crystal γ-TiAl alloy","authors":"Ruicheng Feng ,&nbsp;Hanzong Xu ,&nbsp;Baocheng Zhou ,&nbsp;Tao Chen ,&nbsp;Haiyan Li ,&nbsp;Hui Cao ,&nbsp;Chunli Lei","doi":"10.1016/j.precisioneng.2025.01.020","DOIUrl":"10.1016/j.precisioneng.2025.01.020","url":null,"abstract":"<div><div>The study investigated the effects of different tip radii and scratch depths of diamond conical indenter on the surface nano-scratching mechanism of single-crystal γ-TiAl alloys using Molecular Dynamics (MD) simulations. Effectively combining the scratching parameters with crystal orientation, the variation rules of temperature, mechanical response, atomic flow, subsurface damage, and surface morphology during the scratching process are revealed. The results demonstrate that increasing indenter tip radius and scratch depth lead to higher values of scratch force, temperature, and degree of subsurface damage. Moreover, the average coefficient of friction (COF) and removal rate of atomic wear increase with an increase in the ratio between scratch depth and indenter tip radius (<em>d/r</em>), also known as relative tool sharpness (RTS), a larger RTS facilitates generating more pile-up on both sides. In comparison, a smaller RTS concentrates chips at the indenter's tip. Furthermore, crystal orientation significantly influences the extent to which scratching parameters affect the matrix, specifically, the <span><math><mrow><mrow><mo>(</mo><mn>001</mn><mo>)</mo></mrow><mrow><mo>[</mo><mrow><mover><mn>1</mn><mo>‾</mo></mover><mover><mn>1</mn><mo>‾</mo></mover><mn>0</mn></mrow><mo>]</mo></mrow></mrow></math></span> crystal orientation exhibits higher scratch sensitivity. Finally, the optical morphology of the scratch was obtained by scratch experiment and qualitatively compared with the simulation results. The research results provide valuable insights for the selection of machining parameters of γ-TiAl alloy at nano-scale.</div></div>","PeriodicalId":54589,"journal":{"name":"Precision Engineering-Journal of the International Societies for Precision Engineering and Nanotechnology","volume":"93 ","pages":"Pages 381-396"},"PeriodicalIF":3.5,"publicationDate":"2025-01-31","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"143287268","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":2,"RegionCategory":"工程技术","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}

{"title":"Phosphorescence marking method for liquid level detection and control using computer vision in dark environments","authors":"Seyit Ahmet İnan ,&nbsp;Bekir Aksoy","doi":"10.1016/j.precisioneng.2025.01.025","DOIUrl":"10.1016/j.precisioneng.2025.01.025","url":null,"abstract":"<div><div>The liquid mixture control and level measurement processes were examined in the study using computer images. Liquids of optical characteristics result in low contrast and light reflections in captured camera images. This causes a slowdown in the image's level detection and the processing of mixed images. The method of marking the liquid surface with phosphorescent material in a dark environment was proposed to reduce the light effect on the images. The method's goal is to lessen the noise and light effect in the image that causes measurement errors. A system for experimental measurement and control was set up, comprising liquid tanks, pumps, phosphorus float, camera, and computer. RGB color space, column profile, color moment, filtering, and threshold techniques were used to detected the liquid level from the camera images. When the computer vision results were compared with the real results, the measurement error was calculated as ± 2.595 mm, RMSE = 2.595, and an error rate of 0.66 % for the 400 ml liquid tank. The method simplifies software development procedures for computer, FPGA and microprocessor-based level measurement devices by simplifying intricate image processing algorithms. The computer vision-based phosphorescence marking method can be used in liquid mixture processes for experimental and industrial purposes. It is a liquid level measurement technique that is low cost and easy to apply. Liquids affected by light can employ this method. It has the potential for application in biology, medicine and chemistry laboratories.</div></div>","PeriodicalId":54589,"journal":{"name":"Precision Engineering-Journal of the International Societies for Precision Engineering and Nanotechnology","volume":"93 ","pages":"Pages 397-405"},"PeriodicalIF":3.5,"publicationDate":"2025-01-31","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"143287269","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":2,"RegionCategory":"工程技术","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}

{"title":"Experimental and simulation analysis of surface morphology characteristics through multiple methods of ultrasonic vibration-assisted grinding using a single grain","authors":"Chenwei Dai ,&nbsp;Bin Dai ,&nbsp;Qing Miao ,&nbsp;Zhen Yin ,&nbsp;Jiajia Chen","doi":"10.1016/j.precisioneng.2025.01.023","DOIUrl":"10.1016/j.precisioneng.2025.01.023","url":null,"abstract":"<div><div>The high hardness and brittleness of silicon carbide (SiC) ceramics lead to issues such as low efficiency and severe surface damage during the machining process. Ultrasonic vibration-assisted grinding (UVAG) is an important means to efficiently machining this kind of material, but the surface quality obtained by different vibration modes varies. In order to investigate the scratch morphology characteristics and formation mechanisms by one-dimensional, two-dimensional and three-dimensional UVAG, this article conducted simulation and experimental studies on conventional grinding (CG), axial ultrasonic vibration-assisted grinding (AUVAG), elliptic ultrasonic vibration-assisted grinding (EUVAG) and composite ultrasonic vibration-assisted grinding (CUVAG) of SiC ceramics. The scratch morphology characteristics, the scratch width ratio, the grinding forces and the distribution of residual stress in the four grinding modes were analyzed using a single grain. The results show that the fractures are more pronounced on the scratch sides created by CG and AUVAG, with poor morphology at the scratch bottom. But good morphologies at the scratch bottom in forms of small facets are acquired by EUVAG and CUVAG. The scratch width ratio increases in sequence of CG, AUVAG, EUVAFG and CUVAG, indicating that UAVG can effectively improve the material removal efficiency. Compared to CG, UVAG has a maximum reduction of 67.5 % in grinding force. Meanwhile, as the axial amplitude increases, the grinding forces of AUVAG and CUVAG first decrease and then increase; as the elliptic amplitude increases, the grinding forces of EUVAG and CUVAG slowly increases. In addition, the maximum residual stress of CG, AUVAG, CUVAG and EUVAG is decreased in sequence. EUVAG and CUVAG show lower and more evenly distributed residual stresses at the bottom of the scratch, which indicates that elliptic ultrasonic vibration can significantly improve surface quality and reduce residual stress. EUVAG performs best in improving the surface finish, while CUVAG strikes a good balance between high efficiency and low damage.</div></div>","PeriodicalId":54589,"journal":{"name":"Precision Engineering-Journal of the International Societies for Precision Engineering and Nanotechnology","volume":"93 ","pages":"Pages 355-367"},"PeriodicalIF":3.5,"publicationDate":"2025-01-28","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"143286922","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":2,"RegionCategory":"工程技术","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}

{"title":"Investigation of Fenton-electrochemical oxidation behavior and polishing mechanism of SiC","authors":"Huilong Kang,&nbsp;Min Zhong,&nbsp;Xiaobing Li,&nbsp;Meirong Yi,&nbsp;Jianfeng Chen,&nbsp;Wenhu Xu","doi":"10.1016/j.precisioneng.2025.01.022","DOIUrl":"10.1016/j.precisioneng.2025.01.022","url":null,"abstract":"<div><div>SiC is applied extensively in semiconductor fields because of outstanding characteristics. Nevertheless, its high hardness and chemical inertness hinder the polishing before application. This article introduces the Fenton reaction, ultrasound, and electrochemistry in SiC polishing. The effects of voltage, pH, and downward pressure on ultrasonic-assisted electrochemical mechanical polishing (UAECMP) are investigated through experiments and tests. The optimal polishing parameters have been determined: voltage of 3 V, pH 10, and downward pressure of 8 psi. The MRR of SiC is nearly 4.5 times that of conventional CMP. The polished surface roughness is Ra 0.127 nm. In addition, the polishing mechanism is studied through polarization curves, EIS, XPS, Zeta potential, and abrasive size. A material removal model of SiC UAECMP is put forward. It is helpful to develop new polishing technology of SiC and improve the machining efficiency and quality.</div></div>","PeriodicalId":54589,"journal":{"name":"Precision Engineering-Journal of the International Societies for Precision Engineering and Nanotechnology","volume":"93 ","pages":"Pages 334-343"},"PeriodicalIF":3.5,"publicationDate":"2025-01-28","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"143369644","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":2,"RegionCategory":"工程技术","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}

{"title":"Effects of pad characteristics on surface quality of soft-brittle crystals in water dissolution continuous polishing","authors":"Zhipeng Cheng ,&nbsp;Xuanping Wang ,&nbsp;Hang Gao ,&nbsp;Dongming Guo","doi":"10.1016/j.precisioneng.2025.01.015","DOIUrl":"10.1016/j.precisioneng.2025.01.015","url":null,"abstract":"<div><div>Water dissolution continuous polishing is essential for fabricating large-sized soft-brittle crystals to achieve global planarity and smooth surfaces. The pad, as a core component, directly affects polishing efficiency and quality. In this study, the effects of pad characteristics, including polyurethane, damping, and nonwoven materials on surface quality are extensively examined. Material properties such as surface roughness, asperity distribution, and porosity are studied to achieve high-quality surfaces. Based on the direct contact model between the pad and the workpiece, three pad surface shapes are proposed to optimize pad performance. Through a combination of trajectory uniformity simulation and experimental verification, the influence of the pad surface shape on the workpiece surface quality is systematically analyzed. The results demonstrate that the pad characteristic is a critical determinant of polishing quality. The polyurethane pads with convexity surfaces perform well in water dissolution continuous polishing due to their high hardness and low compressibility. A 200 mm × 200 mm × 10 mm KDP crystal with a surface roughness of 1.694 nm and PV of 0.153 λ is successfully obtained, significantly improving surface control efficiency and accuracy.</div></div>","PeriodicalId":54589,"journal":{"name":"Precision Engineering-Journal of the International Societies for Precision Engineering and Nanotechnology","volume":"93 ","pages":"Pages 368-380"},"PeriodicalIF":3.5,"publicationDate":"2025-01-25","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"143287271","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":2,"RegionCategory":"工程技术","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}

{"title":"High efficiency fabrication of Si microlenses by applying in-situ laser and ultrasonic vibration hybrid diamond cutting","authors":"Jianguo Zhang,&nbsp;Xinhuan Li,&nbsp;Shanyi Ma,&nbsp;Yujiang Lu,&nbsp;Haoxia Tian,&nbsp;Junfeng Xiao,&nbsp;Jianfeng Xu","doi":"10.1016/j.precisioneng.2025.01.017","DOIUrl":"10.1016/j.precisioneng.2025.01.017","url":null,"abstract":"<div><div>Microlens arrays are important component units of new optical systems with the advantageous of small unit size and high degree of integration. In this research, the efficient fabrication of microlens arrays on hard and brittle material of silicon is achieved by coupling high efficiency ultrasonic elliptical vibration trajectory with in-situ laser softening technology. Firstly, the generation mode and morphology characteristics of the microlens array are fitted by the numerical calculation. Moreover, the actual machining parameters are furtherly confirmed. Furthermore, the maximum critical depth of cut along each crystal direction of monocrystalline silicon is experimentally verified by grooving investigation for anisotropy. Finally, the high efficiency fabrication of the microlens array on silicon is carried out by applying the in-situ laser-vibration hybrid assisted diamond cutting system, where the experimental results matched well with the simulation results. This work provides a valuable method for fast fabrication of microstructure arrays on hard and brittle materials, which has broad application in precision engineering.</div></div>","PeriodicalId":54589,"journal":{"name":"Precision Engineering-Journal of the International Societies for Precision Engineering and Nanotechnology","volume":"93 ","pages":"Pages 324-333"},"PeriodicalIF":3.5,"publicationDate":"2025-01-25","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"143286923","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":2,"RegionCategory":"工程技术","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}

{"title":"Optimizing processing stability with ionized polymers in magnetorheological finishing fluid","authors":"Tianyu Bai ,&nbsp;Chenglin Yan ,&nbsp;Xiaoyuan Li ,&nbsp;Lianxin Zhang ,&nbsp;Minheng Ye ,&nbsp;Chao Wang","doi":"10.1016/j.precisioneng.2025.01.018","DOIUrl":"10.1016/j.precisioneng.2025.01.018","url":null,"abstract":"<div><div>Magnetorheological finishing (MRF) is being widely utilized in Semiconductor and optical processing. The properties of the finishing fluid have a great influence on the finishing quality. This study revealed that sodium polystyrene sulfonate (PSS), when employed as a dispersant in the finishing fluid, effectively enhances the polishing performance and maintains the processing stability of the finishing fluid. In the MRF processing, the group with the addition of 0.2 % PSS achieved a reduction in the roughness (Rq) of the fused silica (FS) workpiece to 1.02 nm compared to 4.3 nm in the control group. The PSS elevated the surface potential of abrasive particles, impeding abrasive agglomeration by reinforcing electrostatic repulsion. Simultaneously, the operation life of the finishing fluid significantly extends more than 3 times. The addition of PSS resulted in a significant decrease in the oxidation of Carbonyl iron particles (CIPs). Energy spectrum analysis revealed that diamond abrasives scratched the CIPs. Scratched CIPs were prone to be oxidized to Fe³⁺, thus leading to the significant failure of the finishing fluid. PSS adsorb to particle surfaces, creating steric hindrance that reduces friction between abrasives and CIPs. The MRF fluid with PSS exhibited a notable reduction of Fe³⁺ concentration. Both mechanisms concurrently enhanced the processing stability.</div></div>","PeriodicalId":54589,"journal":{"name":"Precision Engineering-Journal of the International Societies for Precision Engineering and Nanotechnology","volume":"93 ","pages":"Pages 344-354"},"PeriodicalIF":3.5,"publicationDate":"2025-01-24","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"143287270","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":2,"RegionCategory":"工程技术","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}

{"title":"A comprehensive evaluation of accuracy and performance metrics for a laser on-the-fly processing control system","authors":"Ping-Jian Huang,&nbsp;Chien-Fang Ding","doi":"10.1016/j.precisioneng.2025.01.014","DOIUrl":"10.1016/j.precisioneng.2025.01.014","url":null,"abstract":"<div><div>Laser On-the-Fly processing technology integrates a motion platform and a laser galvanometer scanning system to achieve high-speed and high-precision dynamic on-the-fly processing. In this study, a UV pulsed laser On-the-Fly processing system was developed, and laser processing monitoring technology was introduced to realize real-time optimization of processing parameters through a synchronous multi-axis motion control system. Experimental results demonstrate that the system maintains a circularity error within 1 μm and an average error within 0.1 μm during a 10 μm diameter circular scan. Furthermore, the system achieves scanning speeds exceeding 3000 mm/s while maintaining a pattern distortion ratio of less than 1 %. This system is suitable for both single-axis and dual-axis processing of large-area planar substrates and maintains a stable laser spot with a highly uniform distribution during scanning, thereby effectively improving processing efficiency. The results of this study can provide a potential solution for future microfabrication industries.</div></div>","PeriodicalId":54589,"journal":{"name":"Precision Engineering-Journal of the International Societies for Precision Engineering and Nanotechnology","volume":"93 ","pages":"Pages 310-323"},"PeriodicalIF":3.5,"publicationDate":"2025-01-23","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"143369642","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":2,"RegionCategory":"工程技术","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}

{"title":"Fast and affordable printing of polymeric nanostructures via superluminescent light projection","authors":"Jungho Choi,&nbsp;Sourabh K. Saha","doi":"10.1016/j.precisioneng.2025.01.016","DOIUrl":"10.1016/j.precisioneng.2025.01.016","url":null,"abstract":"<div><div>The ability to additively manufacture polymeric nanostructures is highly desirable, but existing light-based techniques are challenging to scale up due to the need to engineer optical nonlinearity into the process. This nonlinearity enables overcoming the optical diffraction limit so that nanoscale features that are smaller than the focused light spot can be printed. However, achieving optical nonlinearity requires either expensive high-intensity femtosecond lasers to activate multi-photon absorption or novel custom-designed photoresists to activate multi-step absorption. Here, we present the superluminescent light projection (SLP) technique as an alternative approach that does not require one to engineer optical nonlinearity into the process, yet it is still capable of sub-diffraction printing. We achieved this by digitally patterning a low-intensity light beam generated from a low-cost superluminescent diode and projecting the patterned beam into a UV-curable photoresist. SLP can print features as small as 325 nm with 405 nm light and at an intensity of 36 W/cm², which is more than 25 billion times lower than that required for multi-photon 3D printing. Furthermore, it enables rapid printing of 3D structures through its layer-by-layer writing mechanism at a voxel generation rate of up to 2.3 × 10⁵ voxels/s using a system which is 35 times less expensive than multi-photon printers. Thus, SLP can significantly advance the affordability of rapid nanoscale 3D printing for a variety of applications.</div></div>","PeriodicalId":54589,"journal":{"name":"Precision Engineering-Journal of the International Societies for Precision Engineering and Nanotechnology","volume":"93 ","pages":"Pages 302-309"},"PeriodicalIF":3.5,"publicationDate":"2025-01-22","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"143369641","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":2,"RegionCategory":"工程技术","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}

{"title":"Investigation into high-shear and low-pressure grinding heat using liquid-body-armor-like wheel: Theory and modeling","authors":"Yebing Tian ,&nbsp;Shuang Liu ,&nbsp;Bing Liu ,&nbsp;Pengzhan Wang","doi":"10.1016/j.precisioneng.2025.01.005","DOIUrl":"10.1016/j.precisioneng.2025.01.005","url":null,"abstract":"<div><div>High-shear and low-pressure grinding with the liquid-body-armor-like wheel has significant advantages, such as good machining quality, high adaptability, and low cost. It has a considerable potential for application in the field of precision machining. A theoretical analytical model was proposed to understand the heat dissipation mechanism and the distribution of the heat source in the high-shear and low-pressure grinding with liquid-body-armor-like wheel. Firstly, the convective heat transfer coefficient of the cutting film at the interface of the workpiece surface and wheel was solved through combining the fluid dynamic and the heat transfer. Then, a heat source model for the high-shear and low-pressure grinding was established. The temperature field under three different shapes (i.e. rectangular, triangular, and trapezoidal) of the heat source distribution were solved. Additionally, the effects of grinding velocity, workpiece feed rate, and normal grinding force on the shape of the heat source distribution were analyzed. Finally, the grinding temperature during the grinding process was measured using the thermocouple on the experimental platform to verify the model. The findings show the trapezoidal distribution of heat sources has the minimum error as compared with the rectangular and triangular heat source distribution. The theoretical analytical results and finite element simulation results agreed well with the measured temperature values. The average error of the analytical results was 5.5 %. The theoretical temperature increased with the grinding velocity and the normal grinding force. It decreased with the increase in the workpiece feed rate. The highest measured temperature was only 91.68 °C at the grinding velocity of 14 m/s in this work. The temperature was significantly lower than that of the conventional grinding. This study provides theoretical guidance for the thermal behaviors and heat generation mechanisms in high-shear and low-pressure grinding processes.</div></div>","PeriodicalId":54589,"journal":{"name":"Precision Engineering-Journal of the International Societies for Precision Engineering and Nanotechnology","volume":"93 ","pages":"Pages 259-271"},"PeriodicalIF":3.5,"publicationDate":"2025-01-20","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"143369640","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":2,"RegionCategory":"工程技术","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}