Nature Reviews Electrical Engineering最新文献_第2页

Advancing Earth observation with a multi-modal remote sensing foundation model 利用多模态遥感基础模型推进对地观测

Nature Reviews Electrical Engineering Pub Date : 2025-08-15 DOI: 10.1038/s44287-025-00208-z

Silvia Conti

引用次数: 0

Learning for embodiment and embodiment for learning 为体现而学习，为学习而体现

Nature Reviews Electrical Engineering Pub Date : 2025-08-15 DOI: 10.1038/s44287-025-00203-4

Huaping Liu, Di Guo, Kangyao Huang

引用次数: 0

Hardware design challenges for marketable 6G measurement tools 面向市场的6G测量工具的硬件设计挑战

Nature Reviews Electrical Engineering Pub Date : 2025-08-13 DOI: 10.1038/s44287-025-00205-2

Sarath Gopalakrishnan, Manish Mamidanna, Bruce Erickson

引用次数: 0

Microdisplay technologies in augmented reality and virtual reality headsets 增强现实和虚拟现实耳机中的微显示技术

Nature Reviews Electrical Engineering Pub Date : 2025-08-13 DOI: 10.1038/s44287-025-00199-x

Inbo Sim, Kyusung Choi, Yongmin Baek, Jun Hee Choi, Jang Jo, Jiwoon Yeom, Boeun Kim, Yongjoo Cho, Heesung Lee, Hyungseok Bang, Jun-Han Han, Dong Hyuk Park, Jongchan Kim, Kyusang Lee

{"title":"Microdisplay technologies in augmented reality and virtual reality headsets","authors":"Inbo Sim, Kyusung Choi, Yongmin Baek, Jun Hee Choi, Jang Jo, Jiwoon Yeom, Boeun Kim, Yongjoo Cho, Heesung Lee, Hyungseok Bang, Jun-Han Han, Dong Hyuk Park, Jongchan Kim, Kyusang Lee","doi":"10.1038/s44287-025-00199-x","DOIUrl":"10.1038/s44287-025-00199-x","url":null,"abstract":"Augmented reality (AR) and virtual reality (VR) technologies enable interactive and immersive user experiences through head-worn devices that contain microdisplays. These microdisplays must have superior pixel density, brightness, contrast and response times, owing to the proximity of the AR glasses or VR headset to the eyes. Advanced microdisplay technologies in light engines such as liquid crystal on silicon (LCoS), organic light-emitting diodes on silicon (OLEDoS) and light-emitting diodes on silicon (LEDoS) have emerged to meet the demands of AR and VR, and are typically integrated with optical components such as free-space, freeform or waveguide combiners. In this Perspective, we explore the key requirements for AR and VR microdisplays, consider the advantages of each light-engine technology and discuss how their performance can be accurately characterized. We also examine how LCoS, OLEDoS and LEDoS technologies are integrated with complementary metal–oxide–semiconductor (CMOS) backplanes, and paired with optical combiners in AR displays, to merge virtual images with real-world scenes. Microdisplays for the glasses and headsets used in augmented reality and virtual reality must provide high pixel density, brightness and contrast, and fast response times. This Perspective explores three advanced technologies — liquid crystal on silicon, organic light-emitting diodes on silicon, and light-emitting diodes on silicon — that can meet the challenge.","PeriodicalId":501701,"journal":{"name":"Nature Reviews Electrical Engineering","volume":"2 9","pages":"634-650"},"PeriodicalIF":0.0,"publicationDate":"2025-08-13","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"145123074","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}

引用次数: 0

Artificial nerve systems for use in bio-interactive prostheses 用于生物交互假体的人工神经系统

Nature Reviews Electrical Engineering Pub Date : 2025-08-12 DOI: 10.1038/s44287-025-00197-z

Chunghee Kim, Dae-Gyo Seo, Yeongjun Lee, Tae-Woo Lee

{"title":"Artificial nerve systems for use in bio-interactive prostheses","authors":"Chunghee Kim, Dae-Gyo Seo, Yeongjun Lee, Tae-Woo Lee","doi":"10.1038/s44287-025-00197-z","DOIUrl":"10.1038/s44287-025-00197-z","url":null,"abstract":"Artificial nerves aim to replicate the functioning of the biological nervous system and are expected to lead to important advances in bio-interactive prosthetics. Population ageing is expected to increase the number of patients with neurological deficits or disorders worldwide and to drive increasing global demand for effective prosthetic solutions. Most current bio-interactive prostheses use traditional complementary metal–oxide–semiconductor digital computing and are primarily focused on the restoration or rehabilitation of physiological functions from an electronics perspective. These devices often place little emphasis on neurological compatibility. By contrast, artificial nerve systems consisting of neuromorphic devices offer a promising and neurologically compatible method to either bypass damaged biological nerves or act as an interface between biological nerves and a prosthesis. Artificial nerves are designed to restore lost sensory and motor functions in a similar way to biological nerves by providing biologically plausible and simplified signal processing. Moreover, artificial nerves provide power-efficient control of prostheses and improve users’ interactions with their environment. This Review explores the achievements and limitations of conventional bio-interactive prostheses and describes advances in artificial nerve systems that aim to increase functionality through the seamless integration and neuromorphic processing of biological signals. This Review provides an overview of non-biomimetic, biomimetic and neuromorphic approaches to bio-interactive prosthetics. Kim et al. highlight the advantages and challenges of artificial nerve systems for reducing computational complexity, improving biocompatibility and restoring natural sensory and motor functions in patients with neurological deficits.","PeriodicalId":501701,"journal":{"name":"Nature Reviews Electrical Engineering","volume":"2 10","pages":"665-682"},"PeriodicalIF":0.0,"publicationDate":"2025-08-12","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"145273091","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}

引用次数: 0

Thermal management materials for 3D-stacked integrated circuits 用于3d堆叠集成电路的热管理材料

Nature Reviews Electrical Engineering Pub Date : 2025-08-07 DOI: 10.1038/s44287-025-00196-0

W.-Y. Woon, A. Kasperovich, J.-R. Wen, K. K. Hu, M. Malakoutian, J.-H. Jhang, S. Vaziri, I. Datye, C. C. Shih, J. F. Hsu, X. Y. Bao, Y. Wu, M. Nomura, S. Chowdhury, S. Sandy Liao

{"title":"Thermal management materials for 3D-stacked integrated circuits","authors":"W.-Y. Woon, A. Kasperovich, J.-R. Wen, K. K. Hu, M. Malakoutian, J.-H. Jhang, S. Vaziri, I. Datye, C. C. Shih, J. F. Hsu, X. Y. Bao, Y. Wu, M. Nomura, S. Chowdhury, S. Sandy Liao","doi":"10.1038/s44287-025-00196-0","DOIUrl":"10.1038/s44287-025-00196-0","url":null,"abstract":"As transistor scaling approaches nanometre and even atomic scales, 3D stacking has become a critical enabler for advancement in the semiconductor industry, especially in high-performance computing and artificial intelligence (AI) applications. However, 3D integration introduces substantial thermal management challenges related to the increased power density and constrained heat dissipation pathways, particularly through low thermal conductivity interlayer dielectrics and complex interfaces. In this Review, we discuss state-of-the-art thermal management materials, covering their process compatibility, the critical integration challenges and the need for improved methods to enhance heat transport across interfaces. Advanced thermal characterization metrologies are introduced to highlight the need for non-destructive in-line metrologies. Finally, we provide a road map that outlines future research directions for material growth, integration and characterization methodologies to enable viable thermal solutions for 3D integration and beyond. The shrinking dimensions, the increased structural complexity and the 3D stacking of silicon-based semiconductor devices are intensifying challenges in thermal dissipation. This Review explores thermal management materials, integration challenges and characterization methods, and proposes a road map for efficient heat dissipation solutions in 3D integration.","PeriodicalId":501701,"journal":{"name":"Nature Reviews Electrical Engineering","volume":"2 9","pages":"598-613"},"PeriodicalIF":0.0,"publicationDate":"2025-08-07","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"145123151","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}

引用次数: 0

Beating the capacity crunch in optical links 解决光链路的容量短缺问题

Nature Reviews Electrical Engineering Pub Date : 2025-08-04 DOI: 10.1038/s44287-025-00202-5

Rachel Won

引用次数: 0

Metal stamp method for residue-free two-dimensional semiconductor patterning 无残留物二维半导体图像化的金属冲压方法

Nature Reviews Electrical Engineering Pub Date : 2025-07-28 DOI: 10.1038/s44287-025-00200-7

Silvia Conti

引用次数: 0

Realizing rooftop photovoltaics for China’s carbon neutrality goals 实现中国碳中和目标的屋顶光伏

Nature Reviews Electrical Engineering Pub Date : 2025-07-25 DOI: 10.1038/s44287-025-00201-6

Miranda L. Vinay

引用次数: 0

Using biopotential and bio-impedance for intuitive human–robot interaction 利用生物电位和生物阻抗实现直观的人机交互

Nature Reviews Electrical Engineering Pub Date : 2025-07-18 DOI: 10.1038/s44287-025-00191-5

Kyungseo Park, Hwayeong Jeong, Yoontae Jung, Ji-Hoon Suh, Minkyu Je, Jung Kim

{"title":"Using biopotential and bio-impedance for intuitive human–robot interaction","authors":"Kyungseo Park, Hwayeong Jeong, Yoontae Jung, Ji-Hoon Suh, Minkyu Je, Jung Kim","doi":"10.1038/s44287-025-00191-5","DOIUrl":"10.1038/s44287-025-00191-5","url":null,"abstract":"The rising interest in robotics and virtual reality has driven a growing demand for intuitive interfaces that enable seamless human–robot interaction (HRI). Bio-signal-based solutions, using biopotential and bio-impedance, offer a promising approach for estimating human motion intention thanks to their ability to capture physiological neuromuscular activity in real time. This Review discusses the potential of biopotential and bio-impedance sensing systems for advancing HRI focusing on the role of integrated circuits in enabling practical applications. Biopotential and bio-impedance can be used to monitor human physiological states and motion intention, making them highly suitable for enhancing motion recognition in HRI. However, as stand-alone modalities, they face limitations related to inter-subject variability and susceptibility to noise, highlighting the need for hybrid sensing techniques. The performance of these sensing modalities is closely tied to the development of integrated circuits optimized for low-noise, low-power operation and accurate signal acquisition in a dynamic environment. Understanding the complementary strengths and limitations of biopotential and bio-impedance signals, along with the advances in integrated circuit technologies for their acquisition, highlights the potential of hybrid, multimodal systems to enable robust, intuitive and scalable HRI. The growing interest in robotics in daily life has increased the demand for intuitive interfaces for human–robot interaction (HRI). This Review examines the potential, challenges and innovations of bio-signal analysis to enhance HRI and facilitate broader applications.","PeriodicalId":501701,"journal":{"name":"Nature Reviews Electrical Engineering","volume":"2 8","pages":"555-571"},"PeriodicalIF":0.0,"publicationDate":"2025-07-18","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"145123067","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}

引用次数: 0