Inbo Sim, Kyusung Choi, Yongmin Baek, Jun Hee Choi, Jang Jo, Jiwoon Yeom, Boeun Kim, Yongjoo Cho, Heesung Lee, Hyungseok Bang, Jun-Han Han, Dong Hyuk Park, Jongchan Kim, Kyusang Lee
{"title":"Microdisplay technologies in augmented reality and virtual reality headsets","authors":"Inbo Sim, Kyusung Choi, Yongmin Baek, Jun Hee Choi, Jang Jo, Jiwoon Yeom, Boeun Kim, Yongjoo Cho, Heesung Lee, Hyungseok Bang, Jun-Han Han, Dong Hyuk Park, Jongchan Kim, Kyusang Lee","doi":"10.1038/s44287-025-00199-x","DOIUrl":null,"url":null,"abstract":"Augmented reality (AR) and virtual reality (VR) technologies enable interactive and immersive user experiences through head-worn devices that contain microdisplays. These microdisplays must have superior pixel density, brightness, contrast and response times, owing to the proximity of the AR glasses or VR headset to the eyes. Advanced microdisplay technologies in light engines such as liquid crystal on silicon (LCoS), organic light-emitting diodes on silicon (OLEDoS) and light-emitting diodes on silicon (LEDoS) have emerged to meet the demands of AR and VR, and are typically integrated with optical components such as free-space, freeform or waveguide combiners. In this Perspective, we explore the key requirements for AR and VR microdisplays, consider the advantages of each light-engine technology and discuss how their performance can be accurately characterized. We also examine how LCoS, OLEDoS and LEDoS technologies are integrated with complementary metal–oxide–semiconductor (CMOS) backplanes, and paired with optical combiners in AR displays, to merge virtual images with real-world scenes. Microdisplays for the glasses and headsets used in augmented reality and virtual reality must provide high pixel density, brightness and contrast, and fast response times. This Perspective explores three advanced technologies — liquid crystal on silicon, organic light-emitting diodes on silicon, and light-emitting diodes on silicon — that can meet the challenge.","PeriodicalId":501701,"journal":{"name":"Nature Reviews Electrical Engineering","volume":"2 9","pages":"634-650"},"PeriodicalIF":0.0000,"publicationDate":"2025-08-13","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"0","resultStr":null,"platform":"Semanticscholar","paperid":null,"PeriodicalName":"Nature Reviews Electrical Engineering","FirstCategoryId":"1085","ListUrlMain":"https://www.nature.com/articles/s44287-025-00199-x","RegionNum":0,"RegionCategory":null,"ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"","JCRName":"","Score":null,"Total":0}
引用次数: 0
Abstract
Augmented reality (AR) and virtual reality (VR) technologies enable interactive and immersive user experiences through head-worn devices that contain microdisplays. These microdisplays must have superior pixel density, brightness, contrast and response times, owing to the proximity of the AR glasses or VR headset to the eyes. Advanced microdisplay technologies in light engines such as liquid crystal on silicon (LCoS), organic light-emitting diodes on silicon (OLEDoS) and light-emitting diodes on silicon (LEDoS) have emerged to meet the demands of AR and VR, and are typically integrated with optical components such as free-space, freeform or waveguide combiners. In this Perspective, we explore the key requirements for AR and VR microdisplays, consider the advantages of each light-engine technology and discuss how their performance can be accurately characterized. We also examine how LCoS, OLEDoS and LEDoS technologies are integrated with complementary metal–oxide–semiconductor (CMOS) backplanes, and paired with optical combiners in AR displays, to merge virtual images with real-world scenes. Microdisplays for the glasses and headsets used in augmented reality and virtual reality must provide high pixel density, brightness and contrast, and fast response times. This Perspective explores three advanced technologies — liquid crystal on silicon, organic light-emitting diodes on silicon, and light-emitting diodes on silicon — that can meet the challenge.