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Multilayer Perceptron Development to Identify Plastics Using Fluorescence Lifetime Imaging Microscopy 多层感知器的发展，以识别塑料荧光寿命成像显微镜
EDFA Technical Articles Pub Date : 2023-08-01 DOI: 10.31399/asm.edfa.2023-3.p031
Georgekutty Jose Maniyattu, Eldho Geegy, M. Wohlschläger, N. Leiter, M. Versen, C. Laforsch
{"title":"Multilayer Perceptron Development to Identify Plastics Using Fluorescence Lifetime Imaging Microscopy","authors":"Georgekutty Jose Maniyattu, Eldho Geegy, M. Wohlschläger, N. Leiter, M. Versen, C. Laforsch","doi":"10.31399/asm.edfa.2023-3.p031","DOIUrl":"https://doi.org/10.31399/asm.edfa.2023-3.p031","url":null,"abstract":"\u0000 Existing plastic analysis techniques such as Fourier transform infrared spectroscopy and Raman spectroscopy are problematic because samples must be anhydrous and identification can be hindered by additives. This article describes a new approach that has been successfully demonstrated in which plastics can be classified by neural networks that are trained, validated, and tested by frequency domain fluorescence lifetime imaging microscopy measurements.","PeriodicalId":431761,"journal":{"name":"EDFA Technical Articles","volume":"205 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2023-08-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"115310594","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 0
Advancements in Image Pattern Recognition for Lock-In Thermography Hotspot Detection and Classification with Supervised Learning 基于监督学习的锁定热成像热点检测与分类图像模式识别研究进展
EDFA Technical Articles Pub Date : 2023-08-01 DOI: 10.31399/asm.edfa.2023-3.p004
K. K. Thinn, Teh Tict Eng, Ming Xue, Rui Zhen Tan
{"title":"Advancements in Image Pattern Recognition for Lock-In Thermography Hotspot Detection and Classification with Supervised Learning","authors":"K. K. Thinn, Teh Tict Eng, Ming Xue, Rui Zhen Tan","doi":"10.31399/asm.edfa.2023-3.p004","DOIUrl":"https://doi.org/10.31399/asm.edfa.2023-3.p004","url":null,"abstract":"\u0000 Lock-in thermography (LIT) is a widely used nondestructive tool for detecting the failure location in integrated circuits. The image pattern recognition algorithm for detecting LIT hotspots benefits image processing and can be leveraged to automate failure analysis processes.","PeriodicalId":431761,"journal":{"name":"EDFA Technical Articles","volume":"30 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2023-08-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"125214061","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 0
The EDFAS FA Technology Roadmap Die-Level Post-Isolation Domain Technical Summary EDFAS FA技术路线图模具级隔离后领域技术总结
EDFA Technical Articles Pub Date : 2023-08-01 DOI: 10.31399/asm.edfa.2023-3.p054
Chuan Zhang
{"title":"The EDFAS FA Technology Roadmap Die-Level Post-Isolation Domain Technical Summary","authors":"Chuan Zhang","doi":"10.31399/asm.edfa.2023-3.p054","DOIUrl":"https://doi.org/10.31399/asm.edfa.2023-3.p054","url":null,"abstract":"\u0000 The Electronic Device Failure Analysis Society established the Die-Level Post-Isolation Domain Council to provide an overview of the upcoming challenges in this area and guide technique developments for next-generation analytical tools. This column summarizes the findings of the council in the areas of sample preparation, microscopy, nanoprobing, circuit editing, and scanning probe microscopy. It is a preview of the full roadmap document, which is in preparation to be released to the EDFAS community.","PeriodicalId":431761,"journal":{"name":"EDFA Technical Articles","volume":"88 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2023-08-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"133107040","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 1
Four-Dimensional Scanning Transmission Electron Microscopy: Part I: Imaging, Strain Mapping, and Defect Detection 四维扫描透射电子显微镜:第一部分:成像，应变映射和缺陷检测
EDFA Technical Articles Pub Date : 2023-08-01 DOI: 10.31399/asm.edfa.2023-3.p012
A. Johnston-Peck, A. Herzing
{"title":"Four-Dimensional Scanning Transmission Electron Microscopy: Part I: Imaging, Strain Mapping, and Defect Detection","authors":"A. Johnston-Peck, A. Herzing","doi":"10.31399/asm.edfa.2023-3.p012","DOIUrl":"https://doi.org/10.31399/asm.edfa.2023-3.p012","url":null,"abstract":"\u0000 Four-dimensional scanning transmission electron microscopy (4D-STEM) is a spatially resolved electron diffraction technique that records the electron scattering distribution at each sampling point. 4D-STEM provides researchers with information that can be analyzed in a multitude of ways to characterize a sample’s structure, including imaging, strain measurement, and defect analysis. This article introduces the basics of the technique and some areas of application with an emphasis on semiconductor materials.","PeriodicalId":431761,"journal":{"name":"EDFA Technical Articles","volume":"1 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2023-08-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"130167878","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 0
Fundamentals of Circuit Edit 电路编辑基础
EDFA Technical Articles Pub Date : 2023-05-01 DOI: 10.31399/asm.edfa.2023-2.p009
David J. Akerson
{"title":"Fundamentals of Circuit Edit","authors":"David J. Akerson","doi":"10.31399/asm.edfa.2023-2.p009","DOIUrl":"https://doi.org/10.31399/asm.edfa.2023-2.p009","url":null,"abstract":"\u0000 This article provides an introduction to focused ion beam (FIB) circuit editing, covering the basic process along with best practices and procedures.","PeriodicalId":431761,"journal":{"name":"EDFA Technical Articles","volume":"6 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2023-05-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"129570491","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 0
Artificial Intelligence Applications in Semiconductor Failure Analysis 人工智能在半导体失效分析中的应用
EDFA Technical Articles Pub Date : 2023-05-01 DOI: 10.31399/asm.edfa.2023-2.p016
Anna Safont-Andreu, Konstantin Schekotihin, C. Burmer, C. Hollerith, Xue Ming
{"title":"Artificial Intelligence Applications in Semiconductor Failure Analysis","authors":"Anna Safont-Andreu, Konstantin Schekotihin, C. Burmer, C. Hollerith, Xue Ming","doi":"10.31399/asm.edfa.2023-2.p016","DOIUrl":"https://doi.org/10.31399/asm.edfa.2023-2.p016","url":null,"abstract":"\u0000 This article provides a systematic overview of knowledge-based and machine-learning AI methods and their potential for use in automated testing, defect identification, fault prediction, root cause analysis, and equipment scheduling. It also discusses the role of decision-making rules, image annotations, and ontologies in automated workflows, data sharing, and interoperability.","PeriodicalId":431761,"journal":{"name":"EDFA Technical Articles","volume":"33 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2023-05-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"121311911","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 0
The EDFAS FA Technology Roadmap—FA Future Roadmap EDFAS FA技术路线图- FA未来路线图
EDFA Technical Articles Pub Date : 2023-05-01 DOI: 10.31399/asm.edfa.2023-2.p044
N. Antoniou, B. Foran
{"title":"The EDFAS FA Technology Roadmap—FA Future Roadmap","authors":"N. Antoniou, B. Foran","doi":"10.31399/asm.edfa.2023-2.p044","DOIUrl":"https://doi.org/10.31399/asm.edfa.2023-2.p044","url":null,"abstract":"\u0000 This column is part of a series of reports on the findings to date of the EDFAS Failure Analysis Roadmap Councils. The Failure Analysis Future Roadmap Council (FAFRC) is concerned with identifying the longer term needs of the FA community. This article discusses analysis challenges associated with the growing number of elements being incorporated into integrated circuit fabrication. It includes tables summarizing top challenges in front end and package analysis.","PeriodicalId":431761,"journal":{"name":"EDFA Technical Articles","volume":"1 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2023-05-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"129565325","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 0
Whole-Chip Delayering for Failure Analysis and Quality Assurance 故障分析和质量保证的全芯片分层
EDFA Technical Articles Pub Date : 2023-05-01 DOI: 10.31399/asm.edfa.2023-2.p004
D. Douglass, K. Godin
{"title":"Whole-Chip Delayering for Failure Analysis and Quality Assurance","authors":"D. Douglass, K. Godin","doi":"10.31399/asm.edfa.2023-2.p004","DOIUrl":"https://doi.org/10.31399/asm.edfa.2023-2.p004","url":null,"abstract":"\u0000 Broad ion beam delayering is a versatile technique for whole-chip failure analysis. The large area of uniformity coupled with the ability to precisely stop at the layer of interest facilitates repeatable, rapid defect detection anywhere on the chip.","PeriodicalId":431761,"journal":{"name":"EDFA Technical Articles","volume":"1 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2023-05-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"129709429","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 0
Making Connections: Challenges and Opportunities for In Situ TEM Biasing 连接:原位瞬变电磁法偏置的挑战与机遇
EDFA Technical Articles Pub Date : 2023-02-01 DOI: 10.31399/asm.edfa.2023-1.p004
W. Hubbard
{"title":"Making Connections: Challenges and Opportunities for In Situ TEM Biasing","authors":"W. Hubbard","doi":"10.31399/asm.edfa.2023-1.p004","DOIUrl":"https://doi.org/10.31399/asm.edfa.2023-1.p004","url":null,"abstract":"\u0000 This article discusses sample preparation challenges that have impeded progress in producing bias-enabled TEM samples from electronic components, as well as strategies to mitigate these issues.","PeriodicalId":431761,"journal":{"name":"EDFA Technical Articles","volume":"1 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2023-02-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"124238635","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 0
Package Innovation Roadmap Council (PIRC) Technical Summary 包装创新路线图委员会(PIRC)技术总结
EDFA Technical Articles Pub Date : 2023-02-01 DOI: 10.31399/asm.edfa.2023-1.p054
Yan Li
{"title":"Package Innovation Roadmap Council (PIRC) Technical Summary","authors":"Yan Li","doi":"10.31399/asm.edfa.2023-1.p054","DOIUrl":"https://doi.org/10.31399/asm.edfa.2023-1.p054","url":null,"abstract":"\u0000 The Package Innovation Roadmap Council (PIRC) was established as part of the Failure Analysis Technology Roadmap activity at the direction of the EDFAS Board. This column provides an overview of a technical paper by the PIRC that highlights recent innovations, technology gaps, and future development trends in package fault isolation and failure analysis. The paper focuses on three main categories: 1) Artificial intelligence (AI) applications, 2) Sample handling, and 3) FA tool robustness.","PeriodicalId":431761,"journal":{"name":"EDFA Technical Articles","volume":"102 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2023-02-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"122928472","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 0
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