The EDFAS FA Technology Roadmap—FA Future Roadmap

Abstract

This column is part of a series of reports on the findings to date of the EDFAS Failure Analysis Roadmap Councils. The Failure Analysis Future Roadmap Council (FAFRC) is concerned with identifying the longer term needs of the FA community. This article discusses analysis challenges associated with the growing number of elements being incorporated into integrated circuit fabrication. It includes tables summarizing top challenges in front end and package analysis.