{"title":"包装创新路线图委员会(PIRC)技术总结","authors":"Yan Li","doi":"10.31399/asm.edfa.2023-1.p054","DOIUrl":null,"url":null,"abstract":"\n The Package Innovation Roadmap Council (PIRC) was established as part of the Failure Analysis Technology Roadmap activity at the direction of the EDFAS Board. This column provides an overview of a technical paper by the PIRC that highlights recent innovations, technology gaps, and future development trends in package fault isolation and failure analysis. The paper focuses on three main categories: 1) Artificial intelligence (AI) applications, 2) Sample handling, and 3) FA tool robustness.","PeriodicalId":431761,"journal":{"name":"EDFA Technical Articles","volume":"102 1","pages":"0"},"PeriodicalIF":0.0000,"publicationDate":"2023-02-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"0","resultStr":"{\"title\":\"Package Innovation Roadmap Council (PIRC) Technical Summary\",\"authors\":\"Yan Li\",\"doi\":\"10.31399/asm.edfa.2023-1.p054\",\"DOIUrl\":null,\"url\":null,\"abstract\":\"\\n The Package Innovation Roadmap Council (PIRC) was established as part of the Failure Analysis Technology Roadmap activity at the direction of the EDFAS Board. This column provides an overview of a technical paper by the PIRC that highlights recent innovations, technology gaps, and future development trends in package fault isolation and failure analysis. The paper focuses on three main categories: 1) Artificial intelligence (AI) applications, 2) Sample handling, and 3) FA tool robustness.\",\"PeriodicalId\":431761,\"journal\":{\"name\":\"EDFA Technical Articles\",\"volume\":\"102 1\",\"pages\":\"0\"},\"PeriodicalIF\":0.0000,\"publicationDate\":\"2023-02-01\",\"publicationTypes\":\"Journal Article\",\"fieldsOfStudy\":null,\"isOpenAccess\":false,\"openAccessPdf\":\"\",\"citationCount\":\"0\",\"resultStr\":null,\"platform\":\"Semanticscholar\",\"paperid\":null,\"PeriodicalName\":\"EDFA Technical Articles\",\"FirstCategoryId\":\"1085\",\"ListUrlMain\":\"https://doi.org/10.31399/asm.edfa.2023-1.p054\",\"RegionNum\":0,\"RegionCategory\":null,\"ArticlePicture\":[],\"TitleCN\":null,\"AbstractTextCN\":null,\"PMCID\":null,\"EPubDate\":\"\",\"PubModel\":\"\",\"JCR\":\"\",\"JCRName\":\"\",\"Score\":null,\"Total\":0}","platform":"Semanticscholar","paperid":null,"PeriodicalName":"EDFA Technical Articles","FirstCategoryId":"1085","ListUrlMain":"https://doi.org/10.31399/asm.edfa.2023-1.p054","RegionNum":0,"RegionCategory":null,"ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"","JCRName":"","Score":null,"Total":0}
Package Innovation Roadmap Council (PIRC) Technical Summary
The Package Innovation Roadmap Council (PIRC) was established as part of the Failure Analysis Technology Roadmap activity at the direction of the EDFAS Board. This column provides an overview of a technical paper by the PIRC that highlights recent innovations, technology gaps, and future development trends in package fault isolation and failure analysis. The paper focuses on three main categories: 1) Artificial intelligence (AI) applications, 2) Sample handling, and 3) FA tool robustness.
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