EDFAS FA技术路线图- FA未来路线图

EDFA Technical Articles Pub Date : 2023-05-01 DOI:10.31399/asm.edfa.2023-2.p044

N. Antoniou, B. Foran

{"title":"EDFAS FA技术路线图- FA未来路线图","authors":"N. Antoniou, B. Foran","doi":"10.31399/asm.edfa.2023-2.p044","DOIUrl":null,"url":null,"abstract":"\n This column is part of a series of reports on the findings to date of the EDFAS Failure Analysis Roadmap Councils. The Failure Analysis Future Roadmap Council (FAFRC) is concerned with identifying the longer term needs of the FA community. This article discusses analysis challenges associated with the growing number of elements being incorporated into integrated circuit fabrication. It includes tables summarizing top challenges in front end and package analysis.","PeriodicalId":431761,"journal":{"name":"EDFA Technical Articles","volume":null,"pages":null},"PeriodicalIF":0.0000,"publicationDate":"2023-05-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"0","resultStr":"{\"title\":\"The EDFAS FA Technology Roadmap—FA Future Roadmap\",\"authors\":\"N. Antoniou, B. Foran\",\"doi\":\"10.31399/asm.edfa.2023-2.p044\",\"DOIUrl\":null,\"url\":null,\"abstract\":\"\\n This column is part of a series of reports on the findings to date of the EDFAS Failure Analysis Roadmap Councils. The Failure Analysis Future Roadmap Council (FAFRC) is concerned with identifying the longer term needs of the FA community. This article discusses analysis challenges associated with the growing number of elements being incorporated into integrated circuit fabrication. It includes tables summarizing top challenges in front end and package analysis.\",\"PeriodicalId\":431761,\"journal\":{\"name\":\"EDFA Technical Articles\",\"volume\":null,\"pages\":null},\"PeriodicalIF\":0.0000,\"publicationDate\":\"2023-05-01\",\"publicationTypes\":\"Journal Article\",\"fieldsOfStudy\":null,\"isOpenAccess\":false,\"openAccessPdf\":\"\",\"citationCount\":\"0\",\"resultStr\":null,\"platform\":\"Semanticscholar\",\"paperid\":null,\"PeriodicalName\":\"EDFA Technical Articles\",\"FirstCategoryId\":\"1085\",\"ListUrlMain\":\"https://doi.org/10.31399/asm.edfa.2023-2.p044\",\"RegionNum\":0,\"RegionCategory\":null,\"ArticlePicture\":[],\"TitleCN\":null,\"AbstractTextCN\":null,\"PMCID\":null,\"EPubDate\":\"\",\"PubModel\":\"\",\"JCR\":\"\",\"JCRName\":\"\",\"Score\":null,\"Total\":0}","platform":"Semanticscholar","paperid":null,"PeriodicalName":"EDFA Technical Articles","FirstCategoryId":"1085","ListUrlMain":"https://doi.org/10.31399/asm.edfa.2023-2.p044","RegionNum":0,"RegionCategory":null,"ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"","JCRName":"","Score":null,"Total":0}

引用次数: 0

摘要

本专栏是EDFAS故障分析路线图委员会迄今为止的调查结果系列报告的一部分。故障分析未来路线图委员会(FAFRC)关注识别FA社区的长期需求。本文讨论了与集成电路制造中越来越多的元件相关的分析挑战。它包括总结前端和包分析中的主要挑战的表格。

本文章由计算机程序翻译，如有差异，请以英文原文为准。

查看原文本刊更多论文

The EDFAS FA Technology Roadmap—FA Future Roadmap

This column is part of a series of reports on the findings to date of the EDFAS Failure Analysis Roadmap Councils. The Failure Analysis Future Roadmap Council (FAFRC) is concerned with identifying the longer term needs of the FA community. This article discusses analysis challenges associated with the growing number of elements being incorporated into integrated circuit fabrication. It includes tables summarizing top challenges in front end and package analysis.

求助全文

通过发布文献求助，成功后即可免费获取论文全文。去求助

来源期刊

EDFA Technical Articles

自引率

0.00%

发文量