{"title":"Multi-voltage aware resistive open fault modeling","authors":"M. T. Mohammadat, N. Ali, F. Hussin","doi":"10.1109/ETS.2012.6233021","DOIUrl":"https://doi.org/10.1109/ETS.2012.6233021","url":null,"abstract":"Resistive open fault (ROF) represents common manufacturing defects causing extra delays and reliability risks in affected circuits. ROF behavior is sensitive to the supply voltage and the resistance of open (RO). Modeling this fault behavior and detectability with the supply voltage helps in distinguishing between faults as well as testing of multi-voltage designs. While previous ROF models did not explicitly consider these dependencies. Therefore in this paper, these dependencies were investigated by exhaustive parametric SPICE simulation considering different technology models. A voltage aware model is proposed by dividing the full RO continuum into resistance intervals and ranges.","PeriodicalId":429839,"journal":{"name":"2012 17th IEEE European Test Symposium (ETS)","volume":"91 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2012-05-28","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"132007900","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
{"title":"Reducing wearout in embedded processors using proactive fine-grain dynamic runtime adaptation","authors":"Fabian Oboril, M. Tahoori","doi":"10.1109/ETS.2012.6233012","DOIUrl":"https://doi.org/10.1109/ETS.2012.6233012","url":null,"abstract":"With shrinking feature sizes, transistor aging becomes a reliability challenge for embedded processors. Processes such as NBTI and HCI lead to increasing gate delays and eventually reduced lifetime. Currently, to ensure functionality for a certain lifetime, safety margins are added to the design, which means overdesign and increased costs. To extend lifetime, reduce power and heat, while maintaining the required performance we propose a dynamic runtime adaptation approach, which is based on runtime monitoring of temperature, performance, power and wearout in combination with fine-grained proactive dynamic voltage and frequency scaling. The experimental results presented in this work show lifetime improvements between 63% up to 5×, while the required performance as well as power and temperature constraints are maintained.","PeriodicalId":429839,"journal":{"name":"2012 17th IEEE European Test Symposium (ETS)","volume":"79 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2012-05-28","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"126733279","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
{"title":"Adaptive multi-site testing for analog/mixed-signal circuits incorporating neighborhood information","authors":"E. Yilmaz, S. Ozev","doi":"10.1109/ETS.2012.6233010","DOIUrl":"https://doi.org/10.1109/ETS.2012.6233010","url":null,"abstract":"Increasing integration packs more functionality in a single chip necessitating the testing of even more specification parameters. However, there is a tendency to keep test time budged constrained, which leads test engineers to seek more efficient test strategies. Statistical test compaction methods offer generic and circuit independent means of achieving efficient testing. Adaptive test methodologies have been shown to achieve better test quality versus test time trade-off compared to non-adaptive methods. In this work, we propose a new adaptive test approach geared for multi-site applications to achieve a significantly better test time/test quality trade-off. We employ an innovative compound-device approach that enables us to exploit device-to-device correlations. Moreover, we use neighbor device statistics for efficient defect screening. We show that despite the constraints imposed by multi-site testing, we successfully reap the benefits of adaptive testing in a multi-site environment.","PeriodicalId":429839,"journal":{"name":"2012 17th IEEE European Test Symposium (ETS)","volume":"10 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2012-05-28","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"125817194","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
C. Metzler, A. Todri, A. Bosio, L. Dilillo, P. Girard, A. Virazel
{"title":"Through-Silicon-Via resistive-open defect analysis","authors":"C. Metzler, A. Todri, A. Bosio, L. Dilillo, P. Girard, A. Virazel","doi":"10.1109/ETS.2012.6233037","DOIUrl":"https://doi.org/10.1109/ETS.2012.6233037","url":null,"abstract":"Three-dimensional (3D) integration is a fast emerging technology that offers integration of high density, fast performance and heterogeneous circuits in a small footprint. Through-Silicon-Vias (TSVs) enable 3D integration by providing fast performance and short interconnects among tiers. However, they are also susceptible to defects that occur during manufacturing steps and cause crucial reliability issues. In this paper, we perform an analysis of resistive-open defects (ROD) on TSVs considering coupling effects (i.e. inductive and capacitive) and a wide frequency spectrum. Our experiments show that both substrate coupling and switching frequency can have a significant impact on weak open TSV behavior.","PeriodicalId":429839,"journal":{"name":"2012 17th IEEE European Test Symposium (ETS)","volume":"2677 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2012-05-28","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"125820693","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
{"title":"On the detection of path delay faults by functional broadside tests","authors":"I. Pomeranz","doi":"10.1109/ETS.2012.6233015","DOIUrl":"https://doi.org/10.1109/ETS.2012.6233015","url":null,"abstract":"Paths that cannot be sensitized during functional operation do not need to be optimized for speed, and their delays may be higher than the clock period. This paper uses functional broadside tests for path delay faults in order to avoid overtesting due to the detection of faults that are associated with such paths. To ensure that as many small delay defects as possible will be detected, the paper considers path delay faults that are associated with full paths as well as ones associated with subpaths. It uses a type of path delay faults called transition path delay faults to define the conditions under which a path delay fault associated with a subpath is detected. It uses detection conditions called the hazard-based detection conditions, which yield a type of weak non-robust tests, to detect as many transition path delay faults as possible. Experimental results demonstrate the importance of considering subpaths for different coverage objectives.","PeriodicalId":429839,"journal":{"name":"2012 17th IEEE European Test Symposium (ETS)","volume":"1 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2012-05-28","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"128902207","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
{"title":"On the quality of test vectors for post-silicon characterization","authors":"M. Sauer, A. Czutro, B. Becker, I. Polian","doi":"10.1109/ETS.2012.6233027","DOIUrl":"https://doi.org/10.1109/ETS.2012.6233027","url":null,"abstract":"Post-silicon validation, i.e., physical characterization of a small number of fabricated circuit instances before start of high-volume manufacturing, has become an essential step in integrated circuit production. Post-silicon validation is required to identify intricate logic or electrical bugs which could not be found during pre-silicon verification. In addition, physical characterization is useful to determine the performance distribution of the manufactured circuit instances and to derive performance yield. Test vectors used for this step are subject to different requirements compared to vectors for simulation-based verification or for manufacturing test. In particular, they must sensitize a very comprehensive set of paths in the circuit, assuming massive variations and possible modeling deficiencies. An inadequate test vector set may result in overly optimistic yield estimates and wrong manufacturing decisions. On the other hand, the size of the test vector set is less important than in verification or manufacturing test. In this paper, we systematically investigate the relationship between the quality of the employed test vectors and the accuracy of yield-performance predictions. We use a highly efficient SAT-based algorithm to generate comprehensive test vector sets based on simple model assumptions and validate these test sets using simulated circuit instances which incorporate effects of process variations. The obtained vector sets can also serve as a basis for adaptive manufacturing test.","PeriodicalId":429839,"journal":{"name":"2012 17th IEEE European Test Symposium (ETS)","volume":"30 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2012-05-28","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"126367360","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
P. Bernardi, Lyl M. Ciganda Brasca, M. D. Carvalho, M. Grosso, Jorge Luis Lagos-Benites, E. Sánchez, M. Reorda, O. Ballan
{"title":"On-line software-based self-test of the Address Calculation Unit in RISC processors","authors":"P. Bernardi, Lyl M. Ciganda Brasca, M. D. Carvalho, M. Grosso, Jorge Luis Lagos-Benites, E. Sánchez, M. Reorda, O. Ballan","doi":"10.1109/ETS.2012.6233004","DOIUrl":"https://doi.org/10.1109/ETS.2012.6233004","url":null,"abstract":"Software-based Self-Test (SBST) can be used during the mission phase of microprocessor-based systems to periodically assess the hardware integrity. However, several constraints are imposed to this approach, due to the coexistence of test programs with the mission application. This paper proposes a method for the generation of SBST programs to test on-line the Address Calculation Unit of embedded RISC processors, which is one of the most heavily impacted by the online constraints. The proposed strategy achieves high stuck-at fault coverage on both a MIPS-like processor and an industrial 32-bit pipelined processor; these two case studies show the effectiveness of the technique and the low effort.","PeriodicalId":429839,"journal":{"name":"2012 17th IEEE European Test Symposium (ETS)","volume":"241 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2012-05-28","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"133934668","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
Jean DaRolt, G. D. Natale, M. Flottes, B. Rouzeyre
{"title":"On-chip test comparison for protecting confidential data in secure ICs","authors":"Jean DaRolt, G. D. Natale, M. Flottes, B. Rouzeyre","doi":"10.1109/ETS.2012.6233039","DOIUrl":"https://doi.org/10.1109/ETS.2012.6233039","url":null,"abstract":"Hardware implementations of secure applications, e.g. cryptographic algorithms, are subject to various attacks. In particular, it has been demonstrated that scan chains introduced by Design for Testability open a backdoor to potential attacks. In this paper we propose a scan protection scheme that provides testing facilities both at production time and during the circuit's lifetime. The underlying principle is to scan-in both input vectors and expected responses, and to perform the comparison between expected and actual responses within the circuit. Compared to regular scan test, this technique has no impact on test quality and no impact on diagnostic of modeled faults. It entails a negligible area overhead and it avoids the use of an authentication test mechanism.","PeriodicalId":429839,"journal":{"name":"2012 17th IEEE European Test Symposium (ETS)","volume":"36 3 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2012-05-28","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"132761204","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
Asma Laraba, H. Stratigopoulos, S. Mir, Hervé Naudet, Christophe Forel
{"title":"Enhanced reduced code linearity test technique for multi-bit/stage pipeline ADCs","authors":"Asma Laraba, H. Stratigopoulos, S. Mir, Hervé Naudet, Christophe Forel","doi":"10.1109/ETS.2012.6233009","DOIUrl":"https://doi.org/10.1109/ETS.2012.6233009","url":null,"abstract":"The reduced code linearity test technique for pipeline ADCs consists in measuring some judiciously selected codes which contain the information about the linearity of the converter as opposed to the standard histogram technique that considers indiscriminately all codes. This technique dramatically reduces the static test time for pipeline ADCs. In this paper, we identify some limitations in the existing version of the technique and we provide solutions to enhance its accuracy. The enhanced technique is applied to a 12-bit 2.5-bit/stage pipeline ADC.","PeriodicalId":429839,"journal":{"name":"2012 17th IEEE European Test Symposium (ETS)","volume":"7 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2012-05-28","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"123966840","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
{"title":"Fault tolerant FPGA processor based on runtime reconfigurable modules","authors":"M. Psarakis, A. Apostolakis","doi":"10.1109/ETS.2012.6233007","DOIUrl":"https://doi.org/10.1109/ETS.2012.6233007","url":null,"abstract":"The increasing use of field programmable devices for the implementation of embedded processors and systems-on-chip even in mission-critical applications demands for fault tolerant techniques to improve reliability and extend system lifetime. Furthermore, the runtime partial reconfiguration potentials of the latest FPGA devices along with the availability of unused programmable resources in most FPGA designs provide interesting opportunities to build fault tolerant mechanisms. In this paper, we exploit the latest dynamic reconfiguration advances and propose a fault-tolerant FPGA processor architecture based on runtime reconfigurable modules. We partition the processor core into reconfigurable modules and duplicate these modules to implement a concurrent error detection mechanism. For every duplicated module we generate precompiled configurations which include spare resources and are used to runtime repair the defective module. The processor freezes upon the detection of an error and an on-chip controller coordinates the processor recovery and repair in a reconfiguration process transparent to the processor. We demonstrate the proposed approach in OpenRISC core, a widely-used open-source soft processor.","PeriodicalId":429839,"journal":{"name":"2012 17th IEEE European Test Symposium (ETS)","volume":"16 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2012-05-28","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"124929472","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}