1998 Proceedings. 48th Electronic Components and Technology Conference (Cat. No.98CH36206)最新文献

{"title":"Thermosonic flip chip bonding system with a self-planarization feature using polymer","authors":"Q. Tan, B. Schaible, L. Bond, Y.C. Lee","doi":"10.1109/ECTC.1998.678915","DOIUrl":"https://doi.org/10.1109/ECTC.1998.678915","url":null,"abstract":"Thermosonic flip-chip bonding is a wire bonding technology modified for flip-chip assembly. Compared with the soldering technology, it is simpler, faster and more cost-effective. Unfortunately, the yield of thermosonic bonding is low and unreliable because it is difficult to control the ultrasonic energy transmission. A small planarity angle between the bonding tool and stage can result in a nonuniform ultrasonic energy distribution. A self-planarization concept was proposed to solve this problem. A layer of polymer was placed between the bonding tool and the chip to smooth the nonplanar contact. Experimental measurements and finite element modeling were used to study the effect of the polymer layer. Results showed that the polymer layer could assure a uniform ultrasonic energy distribution; however, it also reduced the energy transmission efficiency. A case study for optimization was conducted based on finite element modeling. For a 1000-I/O flip chip assembly with a 250 /spl mu/m pitch using a bonder with a 0.01/spl deg/ planarity angle, polymer thickness of 350 /spl mu/m and a Young's modulus of 2 GPa were selected.","PeriodicalId":422475,"journal":{"name":"1998 Proceedings. 48th Electronic Components and Technology Conference (Cat. No.98CH36206)","volume":"8 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"1998-05-25","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"114697832","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}

{"title":"Hybrid integrated silicon optical bench planar lightguide circuits","authors":"J. Gates, D. Muehlner, M. Cappuzzo, M. Fishteyn, L. Gomez, G. Henein, E. Laskowski, I. Ryazansky, J. Shmulovich, D. Syvertsen, A. White","doi":"10.1109/ECTC.1998.678749","DOIUrl":"https://doi.org/10.1109/ECTC.1998.678749","url":null,"abstract":"As optical system architectures have matured over the past ten years, the use of silicon optical bench (SiOB) technology for cost effective packaging of opto-electronic components has migrated from relatively simple laser and photodetector submounts to sophisticated hybrid integrated optical subsystems. Lucent Technologies Bell Laboratories has been developing SiOB technology for use as an integrated packaging platform for lasers, photodetectors, waveguides and passive optical components. In this paper we describe two integrated optical sub-assemblies using planar lightguide circuits (PLCs) as examples of transceivers and complex laser source modules. The assemblies integrate lasers, photodetectors, passive waveguide splitters, wavelength division multiplex (WDM) filters, etched fiber and ball lens attachment sites, turning mirrors, optical reversing elements, deposited metals, solder dams and solders for mechanical and electrical contacts onto a single silicon optical sub-assembly. The approach allows for low cost batch processing, assembly and testing of complex components using the silicon wafer as a carrier and the use of automated pick-and-place machines for assembly.","PeriodicalId":422475,"journal":{"name":"1998 Proceedings. 48th Electronic Components and Technology Conference (Cat. No.98CH36206)","volume":"6 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"1998-05-25","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"128027766","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}

{"title":"Moisture diffusion and vapour pressure modeling of IC packaging","authors":"E. Wong, Y. C. Teo, T. Lim","doi":"10.1109/ECTC.1998.678922","DOIUrl":"https://doi.org/10.1109/ECTC.1998.678922","url":null,"abstract":"A new physical quantity-wetness fraction-has been introduced to overcome the concentration discontinuity in the application of Fick's diffusion equation to multi-material systems such as in plastic IC packaging. This enables the use of commercial thermal diffusion software to model the transient moisture diffusion phenomenon in IC packaging. More significantly, the wetness fraction provides a simple means of computing the vapour pressure in a delaminated region within an IC package when it is heated up to 230/spl deg/C during reflow solder. The approach was bench marked against published works and found to corroborate remarkbly well despite its simplicity.","PeriodicalId":422475,"journal":{"name":"1998 Proceedings. 48th Electronic Components and Technology Conference (Cat. No.98CH36206)","volume":"5 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"1998-05-25","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"125575355","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}

{"title":"Characterization of underfill materials for functional solder bumped flip chips on board applications","authors":"J. Lau, C. Chang","doi":"10.1109/ECTC.1998.678921","DOIUrl":"https://doi.org/10.1109/ECTC.1998.678921","url":null,"abstract":"The curing conditions and material properties such as the TCE (thermal coefficient of expansion), T/sub g/ (glass transition temperature), flexural storage modulus, tangent delta, and moisture content of nine different underfill materials from three different vendors are measured. Their flow rate and the effect of moisture content on mechanical (shear) strength in solder bumped flip chips on organic substrate are also determined experimentally. Furthermore, their effects on the electrical performance (voltage) of functional flip chip devices on organic substrate are measured. Finally, a simple methodology is presented for the selection of underfills from the measurement results of these nine different underfill materials.","PeriodicalId":422475,"journal":{"name":"1998 Proceedings. 48th Electronic Components and Technology Conference (Cat. No.98CH36206)","volume":"163 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"1998-05-25","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"125975675","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}

{"title":"Reliability investigations for flip-chip on flex using different solder materials","authors":"C. Kallmayer, H. Oppermann, S. Anhock, R. Azadeh, R. Aschenbrenner, H. Reichl","doi":"10.1109/ECTC.1998.678710","DOIUrl":"https://doi.org/10.1109/ECTC.1998.678710","url":null,"abstract":"Flip chip assembly on flexible organic substrates is facing increasing interest. In consumer products such as mobile phones or pagers, the assembly of the drivers of the LCD displays can be realized this way. Also there is a growing demand for Chip Size Packages (CSP). As a low cost version, CSPs based on flexible interposers have been developed. Especially for this application the reliability of the assemblies is important. Little is known about the aging behavior of these packages with different solder materials such as Pb-Sn and Au-Sn on standard tape metallizations as Cu-Au or Cu-Ni-Au. The impact of the bumping technology on the reliability is also a subject. Electroplated bumps are studied in comparison with meniscus bumps. Based on electroless Ni bumping, this cost effective technology is especially suited for flip chip on flex as the solder volume deposited is very small. In order to make useful predictions about the reliability of a metallurgical system it is necessary to understand the basic reactions involved. The scope of the investigations presented in this paper is to gain the data on interdiffusion in these systems, on the formation and growth of intermetallic phases. The impact of the presence of intermetallics and voids on the mechanical reliability is determined. The test program includes annealing of the flip chip assemblies at different temperatures and thermal cycling. Electrical measurements (Daisy chain) and shear tests are performed to determine the electrical and mechanical degradation of the solder joints.","PeriodicalId":422475,"journal":{"name":"1998 Proceedings. 48th Electronic Components and Technology Conference (Cat. No.98CH36206)","volume":"115 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"1998-05-25","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"134167227","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}

{"title":"A national course on thermal design of electronic products: recent experiences and a proposal","authors":"Y. Joshi, A. Bar-Cohen, S. Bhavnani","doi":"10.1109/ECTC.1998.678746","DOIUrl":"https://doi.org/10.1109/ECTC.1998.678746","url":null,"abstract":"The concept of a national course on thermal design of electronic products was presented by the authors at the last ECTC. Since that time, additional experience has been gained on this topic through student feedback and continuing advancements in instructional technologies. The focus of the present paper is on an Internet based approach, supplemented with live interactions for the development of a series of learning modules. Advances in Internet based instructional technology and satellite tele-conferencing offer unprecedented opportunities to provide high quality learning where and when it is needed. A high degree of reconfigurability is possible, which makes lifelong learning a real possibility. The concept of a national course and its basic elements are first summarized. Examples of modules and suggested implementation methodologies are then presented. Also discussed are methods for the assessment of the effectiveness of these modules.","PeriodicalId":422475,"journal":{"name":"1998 Proceedings. 48th Electronic Components and Technology Conference (Cat. No.98CH36206)","volume":"13 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"1998-05-25","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"131696823","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}

{"title":"Study of the fluxing agent effects on the properties of no-flow underfill materials for flip-chip applications","authors":"S. Shi, C. Wong","doi":"10.1109/ECTC.1998.678680","DOIUrl":"https://doi.org/10.1109/ECTC.1998.678680","url":null,"abstract":"As one of the key requirements of the no-flow underfilling process for flip-chip applications, a proper self-fluxing agent must be incorporated in the developed no-flow underfill materials to provide proper fluxing activity during the simultaneous solder reflow and underfill material curing. However, most fluxing agents have some adverse effects on the no-flow underfill material properties and assembly reliability. In this paper, we have extensively investigated the effect of the concentration of the selected fluxing agent on the material properties, interconnect integrity and assembly reliability. Through this work, an optimum concentration window of the fluxing agent is obtained and a routine procedure of evaluating fluxing agents is established.","PeriodicalId":422475,"journal":{"name":"1998 Proceedings. 48th Electronic Components and Technology Conference (Cat. No.98CH36206)","volume":"18 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"1998-05-25","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"131204241","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}

{"title":"Characterization of a no-flow underfill encapsulant during the solder reflow process","authors":"C. Wong, D. Baldwin, M. Vincent, B. Fennell, L. Wang, S. Shi","doi":"10.1109/ECTC.1998.678898","DOIUrl":"https://doi.org/10.1109/ECTC.1998.678898","url":null,"abstract":"A challenge in flip-chip technology development is to improve the thermo-mechanical reliability of the flip-chip assembly. To increase reliability, an underfill encapsulant is applied to the gap between IC chip and substrate to provide thermal-mechanical protection as well as environmental protection to the assembly. Two processes for applying the underfill encapsulant to the gap between IC chip and substrate can be described as the fast-flow method and the no-flow (reflowable underfill) method. The fast-flow method is currently the most widely used method. The no-flow method is a new innovative method that provides cost savings. In order to develop novel underfill encapsulants for the no-flow process, a better understanding of the underfill properties during the solder reflow is needed. This paper studies two aspects of the No-Flow underfill: fluxing activity and viscosity during reflow. These two aspects are important for proper interconnect formation. Solder wetting studies were conducted by applying the no-flow underfill on top of solder beads on substrates of different metallizations. The samples were then placed in a 7-zone reflow oven on different eutectic type heating cycles. Cross sections of the samples were taken and the angle the solder makes with the substrate was determined. The viscosity of the underfill during reflow is important to allow proper solder interconnects. To acquire the viscosity of the underfill just before, during, and shortly after the solder reflow temperature, a no-flow underfill encapsulant developed at the Georgia Institute of Technology was studied. Samples of this underfill were placed in a 5-zone reflow oven on a standard eutectic cycle and taken out at different points. The samples were then analyzed by differential scanning calorimetry (DSC) to find the % conversion (amount of cure) of the underfill material. These % conversions were then used to find the complex viscosity at different points in the reflow process. In this paper, we present the experimental procedures and results of the No-Flow underfill's fluxing abilities and viscosity during reflow heating conditions.","PeriodicalId":422475,"journal":{"name":"1998 Proceedings. 48th Electronic Components and Technology Conference (Cat. No.98CH36206)","volume":"132 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"1998-05-25","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"115090901","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}

{"title":"Cost-effective and high-density integration of monitoring photodetector arrays onto polymeric guided-wave components","authors":"J. van der Linden, P. van Daele, P. D. De Dobbelaere, M. Diemeer","doi":"10.1109/ECTC.1998.678837","DOIUrl":"https://doi.org/10.1109/ECTC.1998.678837","url":null,"abstract":"We report on a hybrid coupling concept which allows high-density integration of top illuminated photodetector arrays with polymeric guided-wave based optical network components by means of a micromachined submount with an integrated mirror. The etching of a complementary alignment structure into the polymeric layer stack allows passive assembly with a 1.0 dB alignment tolerance range of about 40 /spl mu/m. A prototype 8-channel detector module integrated with a straight single mode polymeric waveguide array exhibited a coupling efficiency of about -7.7 dB and an average crosstalk value of -21.3 dB between adjacent channels at 1300 nm.","PeriodicalId":422475,"journal":{"name":"1998 Proceedings. 48th Electronic Components and Technology Conference (Cat. No.98CH36206)","volume":"4 11","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"1998-05-25","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"120859007","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}

{"title":"Constitutive and damage model for solders","authors":"V. Stolkarts, B. Moran, L. Keer","doi":"10.1109/ECTC.1998.678721","DOIUrl":"https://doi.org/10.1109/ECTC.1998.678721","url":null,"abstract":"A unified creep-plasticity model with damage is introduced and employed to simulate the isothermal cyclic behavior of Sn-Ag solder. The proposed damage evolution law is based on a nonlinear accumulation of damage and an interaction between applied load and creep. The stress drop amplitude and hysteresis loops are modeled over a wide range of loading conditions.","PeriodicalId":422475,"journal":{"name":"1998 Proceedings. 48th Electronic Components and Technology Conference (Cat. No.98CH36206)","volume":"16 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"1998-05-25","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"124452026","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}